| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/17/2004 | US20040116048 Ultra fine particle film forming method and apparatus |
| 06/17/2004 | US20040115992 Via providing multiple electrically conductive paths through a circuit board |
| 06/17/2004 | US20040115971 Connector having contact connected to conductive portion of board, and method of producing the same |
| 06/17/2004 | US20040115970 Jig for press-fitting terminals and a press-fitting apparatus |
| 06/17/2004 | US20040115968 Connector and printed circuit board for reducing cross-talk |
| 06/17/2004 | US20040115964 IC tester socket with flexible contact points |
| 06/17/2004 | US20040115932 Method and apparatus for controlling local current to achieve uniform plating thickness |
| 06/17/2004 | US20040115864 Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and electronic component-mounted completed product |
| 06/17/2004 | US20040115409 Interconnection designs and materials having improved strength and fatigue life |
| 06/17/2004 | US20040115408 Low temperature bumping process |
| 06/17/2004 | US20040115405 Laser cutting of laminates for electrical insulation testing |
| 06/17/2004 | US20040115344 Inkjet deposition apparatus and method |
| 06/17/2004 | US20040115341 Adhesion promoter and wetting agent |
| 06/17/2004 | US20040115340 Depositing particles comprising at least one coating on a substrate; andreflowing the particles to at least partially melt the coating, thereby forming a substantially continuous solidified solder material |
| 06/17/2004 | US20040114336 Techniques for fabricating a resistor on a flexible base material |
| 06/17/2004 | US20040114064 Liquid crystal display apparatus and method for checking the joining accuracy thereof |
| 06/17/2004 | US20040113994 Inkjet head and manufacturing method of the same |
| 06/17/2004 | US20040113905 Display apparatus and assembly of its driving circuit |
| 06/17/2004 | US20040113884 Electrostatically addressable electrophoretic display |
| 06/17/2004 | US20040113752 Method for the implementation of electronic components in via-holes of a multi-layer multi-chip module |
| 06/17/2004 | US20040113725 Edge plated transmission line |
| 06/17/2004 | US20040113719 High-frequency module |
| 06/17/2004 | US20040113711 Grouped element transmission channel link |
| 06/17/2004 | US20040113708 Piezoelectric oscillator and its manufacturing method |
| 06/17/2004 | US20040113645 Wafer level burn-in and electrical test system and method |
| 06/17/2004 | US20040113644 Probe card, e.g., for testing microelectronic components, and methods for making same |
| 06/17/2004 | US20040113285 Method and apparatus for reducing electrical interconnection fatigue |
| 06/17/2004 | US20040113282 [structure of flip chip package with area bump] |
| 06/17/2004 | US20040113267 Electronic device |
| 06/17/2004 | US20040113266 [semiconductor package module and manufacturing mehod thereof] |
| 06/17/2004 | US20040113261 wiring pattern; connecting terminals via apertures : flip chips |
| 06/17/2004 | US20040113260 Electronic parts packaging structure and method of manufacturing the same |
| 06/17/2004 | US20040113258 Semiconductor power module |
| 06/17/2004 | US20040113257 Integrated circuit package and printed circuit board arrangement |
| 06/17/2004 | US20040113248 Semiconductor device and manufacturing the same |
| 06/17/2004 | US20040113244 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 06/17/2004 | US20040113241 Gold spot plated leadframes for semiconductor devices and method of fabrication |
| 06/17/2004 | US20040112943 Lead frame substrate clamp and method |
| 06/17/2004 | US20040112935 Integrated flex substrate metallurgical bonding |
| 06/17/2004 | US20040112884 Electric heating system for a motor vehicle |
| 06/17/2004 | US20040112869 Cleaning composition |
| 06/17/2004 | US20040112868 Etchant solution for removing a thin metallic layer |
| 06/17/2004 | US20040112763 Method for surface treatment of processed copper workpiece |
| 06/17/2004 | US20040112755 Contacting surface with water soluble polymer ; oxidation with permanganate solutions; plating with copper |
| 06/17/2004 | US20040112637 Built-up printed circuit board with stacked via-holes and method for manufacturing the same |
| 06/17/2004 | US20040112636 Manufacturing method for electronic component module and electromagnetically readable data carrier |
| 06/17/2004 | US20040112634 Method for plating polymer molding material, circuit forming component and method for producing circuit forming component |
| 06/17/2004 | US20040112633 Electronic device module |
| 06/17/2004 | US20040112632 Printed wiring board having rigid portion and flexible portion, and method of fabricating the board |
| 06/17/2004 | US20040112631 Underfilling material for semiconductor package |
| 06/17/2004 | US20040112617 Non-circular micro-via |
| 06/17/2004 | US20040112528 Bonding flexible film circuit and electronic circuit board |
| 06/17/2004 | US20040112516 Method and apparatus for electric-charge adhering of thin release-layered plastic firlms to thin copper foil substrates and the like and improved products thereby produced |
| 06/17/2004 | US20040112504 Method for joining ceramic green bodies using a transfer tape and conversion of bonded green body into a ceramic body |
| 06/17/2004 | US20040112478 Methods for producing lead-free in-situ composite solder alloys |
| 06/17/2004 | US20040112474 Lead-free solder ball |
| 06/17/2004 | US20040112237 A pattern is printed with a masking coating or an ink, on the substrate, the pattern being such that, the desired thin film structures will be formed in the areas where the printed masking coating is not present |
| 06/17/2004 | US20040111882 Process for producing a printed wiring board-forming sheet and multi-layered printed wiring board |
| 06/17/2004 | US20040111854 Method and appratus of recycling printed circuit board |
| 06/17/2004 | DE19608683B4 Verfahren zum Herstellen eines Substrates A method for manufacturing a substrate |
| 06/17/2004 | DE10354202A1 Heat removal device for electronic components of electronic control device e.g. for vehicles, has heat conducting connection joined to circuit board in vicinity of electronic component/unit |
| 06/17/2004 | DE10354007A1 Preparation of thin layer capacitor low leakage current and high breakdown voltage, for use in microfabrication technology, |
| 06/17/2004 | DE10338297A1 Busschiene Bus bar |
| 06/17/2004 | DE10318297A1 Keramisches Multilayersubstrat und Verfahren zu dessen Herstellung A ceramic multilayer substrate and process for its preparation |
| 06/17/2004 | DE10317675A1 Keramisches Multilayersubstrat und Verfahren zu seiner Herstellung A ceramic multilayer substrate and process for its preparation |
| 06/17/2004 | DE10255520A1 Production of conductor strips for electronic components comprises forming a liquid film with a liquid having electrically conducting particles on the upper surfaces of a circuit carrier or electronic component, and further processing |
| 06/17/2004 | DE10254927A1 Verfahren zur Herstellung von leitfähigen Strukturen auf einem Träger A process for preparing conductive structures on a carrier |
| 06/17/2004 | DE10254547A1 Arrangement for mechanical protection of chip module assembly, has distance holder filling gaps on circuit board between chips, at least partly passing over edges of chips, and slightly higher than chips |
| 06/17/2004 | DE10253954A1 Process for attaching electronic components such as ball grid arrays and flip chips to a carrier, involves using a prehardened adhesive layer which is softened by radiation |
| 06/17/2004 | DE10245596B3 Vorverkabeltes Ausstattungsteil, Leitungsstrang und Verfahren zu seiner Herstellung Pre wired piece of equipment, wiring harness and method for its manufacture |
| 06/16/2004 | EP1429590A1 Thin film circuit board device and its manufacturing method |
| 06/16/2004 | EP1429589A2 Circuit carrier |
| 06/16/2004 | EP1429389A1 Compact circuit module having high mounting accuracy and method of manufacturing the same |
| 06/16/2004 | EP1429386A2 Tape carrier for tab and method for producing the same |
| 06/16/2004 | EP1429371A2 Device for treatment of integrated circuits |
| 06/16/2004 | EP1429184A1 Functionalized copolymer for photopolymerizable composition |
| 06/16/2004 | EP1429164A2 Optical communication device |
| 06/16/2004 | EP1428677A1 Printing plate, circuit board and method of printing circuit board |
| 06/16/2004 | EP1428418A1 Surface mounting package |
| 06/16/2004 | EP1428417A1 Liquid crystal polymers for flexible circuits |
| 06/16/2004 | EP1428260A2 Non-conductive substrate forming a strip or a panel, on which a plurality of carrier elements are configured |
| 06/16/2004 | EP1428258A1 Thin electronic label and method for making same |
| 06/16/2004 | EP1427591A1 Connection module |
| 06/16/2004 | EP1427585A1 Security tag and process for making same |
| 06/16/2004 | EP1360885B1 Element for electromagnetic shielding and method for manufacturing thereof |
| 06/16/2004 | EP1286789A4 High-speed fabrication of highly uniform ultra-small metallic microspheres |
| 06/16/2004 | EP1228676B1 Method and apparatus for holding a printed circuit board in a precise position during processing |
| 06/16/2004 | EP1097023B1 Device for the laser processing of workpieces |
| 06/16/2004 | EP1070443B1 Steel alloy separator sheets and copper/steel laminated sheets for use in manufacturing printed circuit boards |
| 06/16/2004 | EP0954385B1 Fluid delivery apparatus and method |
| 06/16/2004 | EP0806056B1 Glass bonding layer for a ceramic circuit board support substrate |
| 06/16/2004 | CN2620962Y Worm gear pressurized type air flue device in hot air reflow welding machine |
| 06/16/2004 | CN2620961Y Oppositely-blowing air-cooled device |
| 06/16/2004 | CN1505918A Substrate adhesion enhancement to film |
| 06/16/2004 | CN1505917A Copper ball insertion machine |
| 06/16/2004 | CN1505916A Method of manufacturing flexible wiring board |
| 06/16/2004 | CN1505672A Method for adhering substrates using light activatable adhesive film |
| 06/16/2004 | CN1505574A Method for producing a moulded component comprising an integrated conductor strip and moulded component |
| 06/16/2004 | CN1505550A Monodisperse spherical metal particles and method for preparing the same |
| 06/16/2004 | CN1505467A Substrate operating system |