| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/23/2004 | EP1431415A1 Method for producing metal plated plastic article |
| 06/23/2004 | EP1430757A2 Throughplating of flexible printed boards |
| 06/23/2004 | EP1430756A1 Vented vias for via in pad technology assembly process yield improvements |
| 06/23/2004 | EP1430755A1 Coupon registration mechanism and method |
| 06/23/2004 | EP1430545A2 Multi-stack surface mount light emitting diodes |
| 06/23/2004 | EP1430532A2 Encapsulation of pin solder for maintaining accuracy in pin position |
| 06/23/2004 | EP1430531A2 Arrangement of vias in a substrate to support a ball grid array |
| 06/23/2004 | EP1430529A2 Soldered heat sink anchor and method of use |
| 06/23/2004 | EP1430524A2 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces |
| 06/23/2004 | EP1430493A1 Multiple terminal smt-bga-style wound capacitor |
| 06/23/2004 | EP1430360A2 Screen printing process |
| 06/23/2004 | EP1430163A2 Precious metal recovery |
| 06/23/2004 | EP1430063A1 Vinyl silane compounds containing epoxy functionality |
| 06/23/2004 | EP1360067A4 Lightweight circuit board with conductive constraining cores |
| 06/23/2004 | EP1297198B1 Electroless platinum-rhodium alloy plating |
| 06/23/2004 | EP1043112B1 Lead-free solder |
| 06/23/2004 | CN1507747A Device for arranging a photoelectric transducer at an electric signal processing device |
| 06/23/2004 | CN1507671A 高频模块 High-frequency module |
| 06/23/2004 | CN1507575A Device for arranging a photoelectric transducer at an electric signal processing device |
| 06/23/2004 | CN1507505A Copper plating bath and method for plating substrate by using the same |
| 06/23/2004 | CN1507312A Flexible printed circuit board and producing method thereof |
| 06/23/2004 | CN1507311A Combined printed circuit board with superposed through holes and producing method thereof |
| 06/23/2004 | CN1507177A Optical communication apparatus |
| 06/23/2004 | CN1507105A Triplex wave.wave synthesizer |
| 06/23/2004 | CN1507046A High-density chip carrier and its constituent method |
| 06/23/2004 | CN1507029A Equipment and method for processing integrated circuit |
| 06/23/2004 | CN1507022A TAB tape carrier and producing method thereof |
| 06/23/2004 | CN1506988A Electronic element and inter base plate |
| 06/23/2004 | CN1506783A Flux coating amount controlling system |
| 06/23/2004 | CN1506762A Exposure equipment |
| 06/23/2004 | CN1506551A Bonding structure for plastic parts with of clamper of clamp mould pressing and bonding method thereof |
| 06/23/2004 | CN1506502A Method and equipment for controlling local electric current to obtain uniform electroplating thickness |
| 06/23/2004 | CN1506501A Electroplating liquid |
| 06/23/2004 | CN1506188A Structure and method for leadless welding flux electronic packaging interconnection |
| 06/23/2004 | CN1155305C Long-insertion welding technological method without cleaning |
| 06/23/2004 | CN1155304C Adhesive for electroless plating, and printed wiring board |
| 06/23/2004 | CN1155303C Adhesive for electroless plating, and printed wiring board |
| 06/23/2004 | CN1155302C Holding device for holding printed circuit board |
| 06/23/2004 | CN1155301C Collection substrate and making mehtod of electronic products of using the same |
| 06/23/2004 | CN1155139C High density connector system |
| 06/23/2004 | CN1155137C Circular polarization antenna and signal receiving & transmitting apparatus and method using the same antenna |
| 06/23/2004 | CN1155113C Light emitting display element, method for connecting same to electric wiring substrate and method of manufacturing same |
| 06/23/2004 | CN1155083C Electronic assembly and its producting method and its used lead wire frame |
| 06/23/2004 | CN1155080C Multi-strand substrate for ball-grid array assemblies and muonting method of assemblied members |
| 06/23/2004 | CN1155079C Semiconductor device and manufacturing method thereof, and reinforcing belt for manufacturing said semiconductor device |
| 06/23/2004 | CN1155026C Transformer bobbin |
| 06/23/2004 | CN1155010C Built-in fingered flat capacitor and resistor and their manufacture |
| 06/23/2004 | CA2438922A1 Technique for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device |
| 06/22/2004 | US6754876 System and method for designing a printed board adapted to suppress electromagnetic interference |
| 06/22/2004 | US6754551 Jet print apparatus and method for printed circuit board manufacturing |
| 06/22/2004 | US6754407 Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board |
| 06/22/2004 | US6754086 Integrated magnetic buck converter with magnetically coupled synchronously rectified mosfet gate drive |
| 06/22/2004 | US6753922 Attaching image sensor to circuit board by applying color filter array material to die, bonding die to package, attaching package to circuit board via mass reflow process |
| 06/22/2004 | US6753896 Laser drawing apparatus and laser drawing method |
| 06/22/2004 | US6753746 Printed circuit board having jumper lines and the method for making said printed circuit board |
| 06/22/2004 | US6753688 Interconnect package cluster probe short removal apparatus and method |
| 06/22/2004 | US6753612 Economical high density chip carrier |
| 06/22/2004 | US6753603 Electronic equipment having insulating heat dissipation plate |
| 06/22/2004 | US6753486 Electronic device switch |
| 06/22/2004 | US6753483 Printed circuit board and method of manufacturing the same |
| 06/22/2004 | US6753480 Printed circuit board having permanent solder mask |
| 06/22/2004 | US6753477 Flatwire jumper patch |
| 06/22/2004 | US6753476 Flame-retardant adhesives and circuit materials with the use of the same |
| 06/22/2004 | US6753300 Lubricant sheet for making hole and method of making hole with drill |
| 06/22/2004 | US6753070 Insulating ceramic compact, ceramic multilayer substrate, and ceramic electronic device |
| 06/22/2004 | US6753033 Method of manufacturing ceramic thick-film printed circuit board |
| 06/22/2004 | US6752942 Method of forming articles including waveguides via capillary micromolding and microtransfer molding |
| 06/22/2004 | US6752878 Process for treating adhesion promoted metal surfaces |
| 06/22/2004 | US6752662 Printed circuit board mounted electrical connector |
| 06/22/2004 | US6752638 Portable electronic apparatus having external connector fixed at internal circuit board |
| 06/22/2004 | US6752634 Contact array for semiconductor package |
| 06/22/2004 | US6752310 Electrically conductive wire |
| 06/22/2004 | US6751861 Printed circuit board manufacturing method |
| 06/22/2004 | US6751860 Method of making of electronic parts mounting board |
| 06/22/2004 | US6751857 Conductive contamination reliability solution for assembling substrates |
| 06/22/2004 | US6751841 Riveting method |
| 06/17/2004 | WO2004052063A1 Electronic part producing method and electronic part |
| 06/17/2004 | WO2004052062A1 Device for the metallisation of printed forms which are equipped with electrically conductive tracks and associated metallisation method |
| 06/17/2004 | WO2004052061A1 Method for manufacturing flexible wiring circuit board |
| 06/17/2004 | WO2004051748A1 Solder bond pad with a convex shape |
| 06/17/2004 | WO2004051747A1 Surface mountable clip suitable for use in a mobile communication device |
| 06/17/2004 | WO2004051732A1 Attachment of flip-chips to substrates |
| 06/17/2004 | WO2004051559A1 Chipcard and method for production of a chipcard |
| 06/17/2004 | WO2004051290A1 Circuit pattern inspection device and circuit pattern inspection method |
| 06/17/2004 | WO2004050959A2 Reduction of surface oxidation during electroplating |
| 06/17/2004 | WO2004050779A1 Adhesive composition, adhesive composition for circuit connection, connected circuit structure, and semiconductor devices |
| 06/17/2004 | WO2004050762A1 Thermally vanishing material, transfer sheet using the same, and method for forming pattern |
| 06/17/2004 | WO2004050753A1 Silver-based powder, method of preparation thereof, and curable silicone composition |
| 06/17/2004 | WO2004050352A1 Laminate, printed wiring board and method for manufacturing them |
| 06/17/2004 | WO2004050287A1 Method for soldering miniaturised components to a base plate |
| 06/17/2004 | WO2004050286A1 Method for the application of solder material, use of a system for laser-aided direct metal deposition and contact surfaces with solder material |
| 06/17/2004 | WO2004050260A2 Microdeposition system |
| 06/17/2004 | WO2004050256A1 Nozzle arrangement |
| 06/17/2004 | WO2004039600A3 Enzyme print humidification in a continuous process for manufacture of electrochemical sensors |
| 06/17/2004 | WO2004034427A3 Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials |
| 06/17/2004 | WO2004027919A3 Activation layer controlled variable impedance transmission line |
| 06/17/2004 | WO2004011705A3 Optical filament scribing of circuit patterns |
| 06/17/2004 | WO2003088370A3 Hermetic encapsulation of organic electro-optical elements |
| 06/17/2004 | US20040116547 Crosslinking under actinic radiation or heat; using silicon hydride as hydrosilation catalyst and photoinitiator |
| 06/17/2004 | US20040116098 Multiplexer |