| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/29/2004 | US6756675 Semiconductor device and a method for making the same that provide arrangement of a connecting region for an external connecting terminal |
| 06/29/2004 | US6756666 Solder couplings connecting plurality of corner terminals; printed circuits |
| 06/29/2004 | US6756663 Semiconductor device including wiring board with three dimensional wiring pattern |
| 06/29/2004 | US6756628 Capacitor sheet with built in capacitors |
| 06/29/2004 | US6756563 System and method for forming holes in substrates containing glass |
| 06/29/2004 | US6756560 Plasma enhanced circuit component attach method and device |
| 06/29/2004 | US6756304 Method for producing via-connections in a substrate and substrate equipped with same |
| 06/29/2004 | US6756253 Method for fabricating a semiconductor component with external contact polymer support layer |
| 06/29/2004 | US6756166 Active energy ray-curable resin having at least two unsaturated bonds; acid salt of n-substituted melamine or guanamine compound; photoinitiator; diluent; and thermosetting compound. |
| 06/29/2004 | US6755984 Micro-casted silicon carbide nano-imprinting stamp |
| 06/29/2004 | US6755957 Forming copper film on insulation layer; immersion in solution of plating promoter; removing promoter from copper film leaving it on side walls and bottoms of via holes; electroplating to fill holes; improvement over planarization |
| 06/29/2004 | US6755692 Connecting pin structure for a transformer core |
| 06/29/2004 | US6755677 Electronic circuit unit having a penetration-type connector housing |
| 06/29/2004 | US6755667 Electronic component having solder ball retaining terminal |
| 06/29/2004 | US6755666 Guide insert for PCI connector receptacle |
| 06/29/2004 | US6755127 Screen printing method |
| 06/29/2004 | US6754952 Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated |
| 06/29/2004 | US6754951 Etch reducing thickness with sulfuric acid and hydrogen peroxide; rapid, precise high energy carbon dioxide laser ablating |
| 06/29/2004 | US6754949 Method and apparatus for manufacturing electronic parts |
| 06/29/2004 | CA2291293C Surface mount modular jack |
| 06/29/2004 | CA2252407C Flexible integrated circuit package |
| 06/24/2004 | WO2004054340A1 Multilayer printed circuit board and method for manufacturing same |
| 06/24/2004 | WO2004054339A1 Method for supplying solder |
| 06/24/2004 | WO2004054338A1 Method for manufacturing printed wiring board |
| 06/24/2004 | WO2004054337A1 Method for manufacturing printed wiring board |
| 06/24/2004 | WO2004054336A1 Method for manufacturing printed wiring board |
| 06/24/2004 | WO2004054333A2 Cross connect via for multilayer printed circuit boards |
| 06/24/2004 | WO2004054332A2 Strip-line topology for a high speed pcb with low dissipation |
| 06/24/2004 | WO2004054032A1 Even dissipation of particles' transfer |
| 06/24/2004 | WO2004053983A1 Metal core substrate packaging |
| 06/24/2004 | WO2004053193A1 Peel strength enhancement of copper laminates 102426-201 |
| 06/24/2004 | WO2004052650A1 Electrode structure and method of manufacture |
| 06/24/2004 | WO2004052547A2 Coated and magnetic particles and applications thereof |
| 06/24/2004 | WO2004047508A3 Technique for accommodating electronic components on a multilayer signal routing device |
| 06/24/2004 | WO2004040285A3 Preconditioning of a substrate in a continuous process for manufacture of electrochemical sensors |
| 06/24/2004 | WO2004036701A3 Method and apparatus for depositing material for an electronic device |
| 06/24/2004 | WO2004010226A3 Machine for exposing printed circuit boards |
| 06/24/2004 | WO2003048981A3 Improving integrated circuit performance and reliability using a patterned bump layout on a power grid |
| 06/24/2004 | WO2003033764A3 Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
| 06/24/2004 | WO2003008940A9 Confocal 3d inspection system and process |
| 06/24/2004 | US20040121659 Electronic component and method of manufacturing the same |
| 06/24/2004 | US20040121632 Connector mounting structure and connector mounting method |
| 06/24/2004 | US20040121626 Surface mounted electrical components and method for mounting and retaining same |
| 06/24/2004 | US20040121624 Printed circuit board |
| 06/24/2004 | US20040121614 Method for forming pattern using printing process |
| 06/24/2004 | US20040121595 Method of forming a metal film, semiconductor device and wiring board |
| 06/24/2004 | US20040121518 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography |
| 06/24/2004 | US20040121515 Programmable multi-chip module |
| 06/24/2004 | US20040121266 inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of ceramic (e.g., BaTiO3) and a resin, and a process for manufacturing the printed circuit board |
| 06/24/2004 | US20040121178 Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier |
| 06/24/2004 | US20040120129 Multi-layer laminated structures for mounting electrical devices and method for fabricating such structures |
| 06/24/2004 | US20040120127 Compact circuit module having high mounting accuracy and method of manufacturing the same |
| 06/24/2004 | US20040120121 Densely packed electronic assemblage with heat removing element |
| 06/24/2004 | US20040120098 Roll of laminate for capacitor layer for withstand voltage inspection and method of withstand voltage measurement using this roll of laminate for capacitor layer for withstand voltage inspection |
| 06/24/2004 | US20040119593 Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same |
| 06/24/2004 | US20040119553 Center-tap termination circuit and printed circuit board having the same |
| 06/24/2004 | US20040119173 Packages for semiconductor die |
| 06/24/2004 | US20040119171 [flip-chip substrate and flip-chip bonding process thereof] |
| 06/24/2004 | US20040119160 Programmable multi-chip module |
| 06/24/2004 | US20040119159 Semiconductor device comprising ESD protection circuit for protecting circuit from being destructed by electrostatic discharge |
| 06/24/2004 | US20040119156 Electronic circuit assembly having high contrast fiducial |
| 06/24/2004 | US20040119155 A surface of the metal plate has soldering areas prepared for electrical connection and non-soldering areas coated with solder resist |
| 06/24/2004 | US20040119151 Pre-applied underfill |
| 06/24/2004 | US20040119147 Apparatus and method for improving AC coupling on circuit boards |
| 06/24/2004 | US20040118935 Method of jetting viscous medium |
| 06/24/2004 | US20040118824 Conveyorized blind microvia laser drilling system |
| 06/24/2004 | US20040118696 electrolytically treating a copper or copper alloy substrate with a solution of phosphoric acid and a carboxylic acid, and electrodepositing tin or tin alloy; reduced tendency to form whiskers |
| 06/24/2004 | US20040118691 Electroplating method |
| 06/24/2004 | US20040118690 successive conditioning, Pd activation, electroless copper plating, and electrolytic copper plating treatments; irradiation with ultraviolet light in the presence of treatment solution; resin is activated to improve copper adhesion |
| 06/24/2004 | US20040118606 Surface mount technology to via-in-pad interconnections |
| 06/24/2004 | US20040118605 Circuit board having a multi-functional hole |
| 06/24/2004 | US20040118604 Substrate-imprinting apparatus, methods of manufacture, and products formed therefrom |
| 06/24/2004 | US20040118603 Methods and apparatus for a flexible circuit interposer |
| 06/24/2004 | US20040118602 Printed circuit board with embedded capacitors and manufacturing method thereof |
| 06/24/2004 | US20040118600 Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
| 06/24/2004 | US20040118598 Information handling system utilizing circuitized substrate |
| 06/24/2004 | US20040118596 Circuitized substrate assembly and method of making same |
| 06/24/2004 | US20040118595 Rigid-flex circuit board system |
| 06/24/2004 | US20040118594 Imprinted substrate and methods of manufacture |
| 06/24/2004 | US20040118586 Low temperature microelectronic die to substrate interconnects |
| 06/24/2004 | US20040117985 Electronic circuit construction method, as for a wireless RF tag |
| 06/24/2004 | US20040117984 Method of fabricating multi-layered printed circuit board for optical waveguides |
| 06/24/2004 | US20040117982 Method of removing heat from an electronic assemblage |
| 06/24/2004 | DE20320315U1 Foil conduction harness joining conduction paths of foil conduction harness e.g. for motor vehicle internal electronics, has conduction paths of branch line directly contacted with associated conduction paths of supply line |
| 06/24/2004 | DE10356450A1 Exposure device used in photolithographic processes comprises a pressure-reducing chamber containing a mask-supporting arrangement and a pressure plate, a pressure film, and displacement arrangements |
| 06/24/2004 | DE10257777A1 Einrichtung zur Bearbeitung von integrierten Schaltkreisen Means for processing of integrated circuits |
| 06/24/2004 | DE10257527A1 Schaltungsträger Circuit board |
| 06/24/2004 | DE10257173A1 Verfahren zum Aufbringen von Lotmaterial, Verwendung einer Anlage zur laserunterstützten direkten Metallabscheidung hierfür und Kontaktflächen mit Lotdepots A method of applying solder material, using an installation for laser-assisted direct metal deposition and contact surfaces thereof with the solder deposits |
| 06/24/2004 | DE10256433A1 Contact between chip module and other components in chip card using isotropic conductive adhesive having grooves in it to provide separate areas to prevent short circuit between contacts in same level |
| 06/24/2004 | DE10256104A1 System zur elektrischen Kontaktierung mit einem Leiter, insbesondere für eine Heizungs- oder Klimaanlage für ein Kraftfahrzeug System for making electrical contact with a conductor, in particular for a heating or air conditioning system for a motor vehicle |
| 06/24/2004 | DE10255896A1 Electronic coin checker for an automatic vending machine, has a flexible circuit board with electrical connectors to simplify the connecting of a control and evaluation circuit board to electrical test units |
| 06/24/2004 | DE10255884A1 Düsenanordnung Nozzle assembly |
| 06/23/2004 | EP1432294A2 Circuitized substrate assembly and method of making same |
| 06/23/2004 | EP1432293A1 Printed wiring board and production method for printed wiring board |
| 06/23/2004 | EP1432292A1 Carrier-attached copper foil and printed board using the copper foil |
| 06/23/2004 | EP1432279A2 Means for contacting electrotechnical components placed in a communication terminal and communication terminal with such contacting means |
| 06/23/2004 | EP1432024A2 Method of forming a penetration electrode and substrate having a penetration electrode |
| 06/23/2004 | EP1432021A2 Manufacturing method for electronic component module and electromagnetically readable data carrier |
| 06/23/2004 | EP1432020A1 Apparatus for aligning and dispensing solder columns in an array |
| 06/23/2004 | EP1431821A1 Pattern forming method and substance adherence pattern |