| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/01/2004 | WO2004017372A3 Method and apparatus for reducing electromagnetic emissions from electronic circuits |
| 07/01/2004 | WO2004011177A3 Building a three-dimensional structure by manipulating individual particles |
| 07/01/2004 | WO2004001773A3 Integrated device providing overcurrent and overvoltage protection and common-mode filtering to data bus interface |
| 07/01/2004 | US20040128633 Global Equivalent Circuit Modeling System for Substrate Mounted Circuit Components Incorporating Substrate Dependent Characteristics |
| 07/01/2004 | US20040128278 Printed wiring board design aiding system, printed wiring board CAD system, and record medium |
| 07/01/2004 | US20040127626 capable of forming or bonding low-resistance electrodes; silver powder as a conductive agent |
| 07/01/2004 | US20040127595 Resin compositions, processes for preparing the resin compositions and processes for forming resin films |
| 07/01/2004 | US20040127096 Receptacle |
| 07/01/2004 | US20040127074 Interconnect assemblies and methods |
| 07/01/2004 | US20040127025 Processes for fabricating conductive patterns using nanolithography as a patterning tool |
| 07/01/2004 | US20040126712 Pattern forming method and substance adherence pattern material |
| 07/01/2004 | US20040126708 Digitally applying a photoreactive material comprising photochemical electron donor exposing to actinic radiation |
| 07/01/2004 | US20040126547 Coating with an A-stage thermoset resin as part of the imprinting process reduces thickness variation in the layers, provides full, intimate contact with prior layers and eliminates damage to prior layers; integrated circuits |
| 07/01/2004 | US20040126516 Method of manufacturing a circuit board and its manufacturing apparatus |
| 07/01/2004 | US20040126484 Method for forming ceramic film capacitors |
| 07/01/2004 | US20040126269 Solder for use on surfaces coated with nickel by electroless plating |
| 07/01/2004 | US20040125635 Memory system and memory subsystem |
| 07/01/2004 | US20040125578 Semiconductor module |
| 07/01/2004 | US20040125577 Low loss, high density array interconnection |
| 07/01/2004 | US20040125573 Multichip module including substrate with an array of interconnect structures |
| 07/01/2004 | US20040125543 Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same |
| 07/01/2004 | US20040125526 Distributive capacitor for high density applications |
| 07/01/2004 | US20040125516 Assembly of ICs with blocking capacitors and printed circuit boards |
| 07/01/2004 | US20040125177 Ink-jet head system |
| 07/01/2004 | US20040124941 Wiring board comprising granular magnetic film |
| 07/01/2004 | US20040124866 Semiconductor testing device |
| 07/01/2004 | US20040124540 [flip chip package structure] |
| 07/01/2004 | US20040124535 Substrate with stacked vias and fine circuits thereon, and method for fabricating the same |
| 07/01/2004 | US20040124534 Multi-layer interconnect |
| 07/01/2004 | US20040124517 Structural reinforcement for electronic substrate |
| 07/01/2004 | US20040124511 Method and apparatus for supplying power to a semiconductor device using a capacitor DC shunt |
| 07/01/2004 | US20040124507 Contact structure and production method thereof |
| 07/01/2004 | US20040124493 Method for forming a printed circuit board and a printed circuit board formed thereby |
| 07/01/2004 | US20040124405 Liquid crystalline polymer composites, method of manufacture thereof, and articles formed therefrom |
| 07/01/2004 | US20040124233 Method and protection apparatus for installation of a temperature-sensitive electronic component |
| 07/01/2004 | US20040124230 Application of acoustic and vibrational energy for fabricating bumped IC die and assembly of PCA's |
| 07/01/2004 | US20040124228 Method for testing soldering quality |
| 07/01/2004 | US20040124225 Apparatus for aligning and dispensing solder columns in an array |
| 07/01/2004 | US20040124176 Palsma etchingm method |
| 07/01/2004 | US20040124007 Circuit board, mounting structure for semiconductor device with bumps, and electro-optic device and electronic device |
| 07/01/2004 | US20040124006 Built up lands |
| 07/01/2004 | US20040124005 Wiring board comprising granular magnetic film |
| 07/01/2004 | US20040124004 Decoupled signal-power substrate architecture |
| 07/01/2004 | US20040124003 Double-sided printed circuit board without via holes and method of fabricating the same |
| 07/01/2004 | US20040124002 Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards |
| 07/01/2004 | US20040123968 Apparatus, mold, and method for manufacturing metal-ceramic composite member |
| 07/01/2004 | US20040123947 Structure of bonding plastic part insert-molded with wiring board and method of bonding the same |
| 07/01/2004 | US20040123921 Engraving pattern ; forming dielectric films |
| 07/01/2004 | US20040123799 Flexible frame for mounting a deposition mask |
| 07/01/2004 | US20040123750 Sonic screen printing |
| 07/01/2004 | US20040123457 Method for connecting printed circuit boards |
| 07/01/2004 | US20040123456 Process for producing semiconductor device |
| 07/01/2004 | US20040123455 Process of packaging organic electroluminescent panel |
| 07/01/2004 | US20040123454 Method of fabricating printed circuit board |
| 07/01/2004 | US20040123453 Method of forming a flexible circuit board |
| 07/01/2004 | DE10261576A1 Arrangement for coating substrate, especially circuit board, has gas feed device with coaxial outer and inner tubular elements forming gas feed channel so gaseous medium distributes coating material |
| 07/01/2004 | DE10259277A1 Locating device for electronic components, has fixing element that acts upon electronic components and holds it at desired distance to PCB |
| 07/01/2004 | DE10257111A1 Chipkarte und Verfahren zur Herstellung einer Chipkarte Chip card and method for manufacturing a smart card |
| 07/01/2004 | CA2509397A1 A method of protecting metal foil substrates |
| 06/30/2004 | EP1434474A2 Technique for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device |
| 06/30/2004 | EP1434473A2 Technique for reducing the number of layers in a signal routing device |
| 06/30/2004 | EP1434292A1 Fuel cell and electronic device using fuel cell |
| 06/30/2004 | EP1434266A1 Metal/ceramic bonding substrate and method for producing same |
| 06/30/2004 | EP1434261A1 Circuit device mounitng method and press |
| 06/30/2004 | EP1434248A2 Method for producing light-transmitting electromagnetic wave-shielding film, light-transmitting eletromagnetic wave-shielding film and plasma display panel using the shielding film |
| 06/30/2004 | EP1434242A2 Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same |
| 06/30/2004 | EP1433829A1 Thermally-formable and cross-linkable precursor of a thermally conductive material |
| 06/30/2004 | EP1433583A1 Cushioning material for hot pressing and process for producing the same |
| 06/30/2004 | EP1433368A1 Electronic circuit comprising conductive bridges and method for making such bridges |
| 06/30/2004 | EP1433367A2 Anti-tombstoning structures and methods of manufacture |
| 06/30/2004 | EP1433221A1 Waveguide in a printed circuit board |
| 06/30/2004 | EP1433128A1 Chip card and method for producing a chip card of this type |
| 06/30/2004 | EP1432845A2 Method for the deposition of materials from mesomorphous films |
| 06/30/2004 | EP1432567A1 Machine for converting synthetic or natural resins or rubbers |
| 06/30/2004 | EP1432526A2 Method and apparatus for detecting a liquid spray pattern |
| 06/30/2004 | EP1323341B1 Methods of manufacturing a printed circuit board shielded against interfering radiation |
| 06/30/2004 | EP1155420A4 Bus bar assembly |
| 06/30/2004 | CN1509232A High polymer plate and conductive plate conuecting body and part using the connecting plate |
| 06/30/2004 | CN1509136A Micro welded pad gap organic circuit board with electroplating soldering tin |
| 06/30/2004 | CN1509135A Welded area structure of printed circuit board for washing machine controller |
| 06/30/2004 | CN1509133A Coating film structure for printed circuit board |
| 06/30/2004 | CN1508286A Metal film formation method, semiconductor device and wiring substrate board |
| 06/30/2004 | CN1508285A Metal-film formation processing method, semiconductor device and wiring substrate board |
| 06/30/2004 | CN1508172A Emulsion formed artical and coating formed therefrom and cooling structure using said coating |
| 06/30/2004 | CN1156206C Vibrator holder |
| 06/30/2004 | CN1156205C Method for installing electronic device and circuit board |
| 06/30/2004 | CN1156204C Integrated circuit baseplate column-like projection block forming method |
| 06/30/2004 | CN1156203C Printed circuit boards for mounting semiconductor integrated circuit die |
| 06/30/2004 | CN1156061C I/O connector for portable communication equipment |
| 06/30/2004 | CN1155997C Anisotropic conductor film, semiconductor chip, and method of packaging |
| 06/30/2004 | CN1155994C Method and apparatus for separating products on same substrate along cutting lines |
| 06/30/2004 | CN1155450C Method employing UV laser pulses of varied energy density to form blind vias in multilayered targets |
| 06/29/2004 | US6757180 Electronic component base |
| 06/29/2004 | US6757178 Electronic circuit equipment using multilayer circuit board |
| 06/29/2004 | US6757176 Circuit board |
| 06/29/2004 | US6757174 Switching power-supply module |
| 06/29/2004 | US6756975 Matrix type display apparatus, method of production thereof, and thermo-compression bonding head |
| 06/29/2004 | US6756688 Wiring board and its production method, semiconductor device and its production method, and electronic apparatus |
| 06/29/2004 | US6756687 Interfacial strengthening for electroless nickel immersion gold substrates |
| 06/29/2004 | US6756680 Flip chip C4 extension structure and process |