| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/08/2004 | US20040129364 Bonding method |
| 07/08/2004 | US20040128831 Methods and systems for forming a die package |
| 07/08/2004 | US20040128829 Circuit board, method of manufacturing the same, transfer chip, transfer source subtrate, electro-optical device, and electronic apparatus |
| 07/08/2004 | US20040128827 Apparatus and system for mounting components and program for controlling the same |
| 07/08/2004 | US20040128822 Method for making a multilayer circuit board having embedded passive components |
| 07/08/2004 | US20040128816 Machining method and machining apparatus |
| 07/08/2004 | DE19608484B4 Bei niedriger Temperatur gebranntes Keramik-Schaltungssubstrat At low temperature-fired ceramic circuit substrate |
| 07/08/2004 | DE10259861A1 Contact element for electrically connecting circuit board contact openings, has mutually parallel long pins electrically and mechanically connected to tongue |
| 07/08/2004 | DE10259549A1 Haftklebeartikel mit wenigstens einer Schicht aus einer elektrisch leitfähigen Haftklebemasse und Verfahren zu seiner Herstellung Adhesive products with at least one layer of an electrically conductive pressure sensitive adhesive and method for its manufacture |
| 07/08/2004 | DE10258478A1 Top-bottom ball grid array package for a micro-system construction kit, has metal top and bottom parts with electric wiring/connection structures |
| 07/08/2004 | DE10222964B4 Verfahren zur Gehäusebildung bei elektronischen Bauteilen sowie so hermetisch verkapselte elektronische Bauteile A method for encasing for electronic components and so hermetically encapsulated electronic components |
| 07/08/2004 | DE10048457B4 Anordnung und Verfahren zum Kontaktieren eines Motor- oder Getriebebauteils an eine elektrische Leiterplatte Apparatus and method for contacting an engine or transmission component of an electrical circuit board |
| 07/07/2004 | EP1435765A1 Method of forming connections on a conductor pattern of a printed circuit board |
| 07/07/2004 | EP1435658A1 Substrate and method for producing the same |
| 07/07/2004 | EP1435651A2 Process for the constrained sintering of asymetrically configured dielectric layers |
| 07/07/2004 | EP1435193A2 Nickel coated copper as electrodes for embedded passive devices |
| 07/07/2004 | EP1435109A2 Method for creating adhesion during fabrication of electronic devices |
| 07/07/2004 | EP1435021A1 Aqueous developable photoimageable thick film compositions for making photoimageable black electrodes |
| 07/07/2004 | EP1435020A2 Aqueous developable photoimageable thick film compositions |
| 07/07/2004 | EP1434748A1 Printed circuit techniques for polyethylene surfaces |
| 07/07/2004 | EP1030349B1 Method and apparatus for treating electronic components mounted on a substrate, in particular semiconductor chips |
| 07/07/2004 | CN2624585Y 万向载具 Universal carrier |
| 07/07/2004 | CN2624584Y Structure of circuit board loadbearing device |
| 07/07/2004 | CN1511434A Method for producing components for electronic devices |
| 07/07/2004 | CN1511433A Method for drilling microholes using laser beam |
| 07/07/2004 | CN1511343A Method for contacting electrical component with substrate comprising conducting structure |
| 07/07/2004 | CN1511262A Circuit pattern inspection apparatus, circuit pattern inspection method, and recording medium |
| 07/07/2004 | CN1511260A 接触探针 The touch probe |
| 07/07/2004 | CN1510987A Electronic component mistake assembling preventing system |
| 07/07/2004 | CN1510986A Technology for decreasing layer number in signal wiring apparatus |
| 07/07/2004 | CN1510983A Thick-membrane distribution shaping method and manufacturing method for laminated electronic parts |
| 07/07/2004 | CN1510982A Electric signal electric interconnection technology between electronic component and multi-layer route device |
| 07/07/2004 | CN1510980A Film carrying belt for mounting electronic components, production and electrolyzing apparatus |
| 07/07/2004 | CN1510979A High-density circuit board without weld pad design and manufacturing method thereof |
| 07/07/2004 | CN1510788A High-density electric connector assembly and producing method thereof |
| 07/07/2004 | CN1510750A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 07/07/2004 | CN1510743A Film carried belt for mounting electronic components thereon |
| 07/07/2004 | CN1510393A Measuring devices |
| 07/07/2004 | CN1510174A Method for depositing non-lead tin alloy |
| 07/07/2004 | CN1510092A Connecting materials |
| 07/07/2004 | CN1157106C Process for preparing thin EBGA substrate |
| 07/07/2004 | CN1157105C Built-in circuit device assembly and its manufacturing method |
| 07/07/2004 | CN1156949C Receptacle seat of cathode-ray tube and monitor containg same |
| 07/07/2004 | CN1156901C Fixing clamp, distribution board and electronic component assembly and making method thereof |
| 07/07/2004 | CN1156734C Display Panel |
| 07/07/2004 | CN1156613C Process of controlling grain growth in metal films |
| 07/07/2004 | CN1156549C Adhesive compositions and their precursors |
| 07/07/2004 | CN1156542C Method for producing contact control screen linear pattern |
| 07/07/2004 | CN1156353C Cutting tool for making circuit substrate with flat bottom surface and concave cups |
| 07/06/2004 | US6760232 Power distribution system having a dedicated power structure with apertures for mounting integrated circuit packages |
| 07/06/2004 | US6760227 Multilayer ceramic electronic component and manufacturing method thereof |
| 07/06/2004 | US6760225 Heat-dissipating structure of circuit board |
| 07/06/2004 | US6760208 Distributive capacitor for high density applications |
| 07/06/2004 | US6760094 Aligner |
| 07/06/2004 | US6760090 Liquid crystal display device having solder resist structure and method of making the same |
| 07/06/2004 | US6760054 Imaging apparatus utilizing laser beams |
| 07/06/2004 | US6759862 Method and apparatus for evaluating a set of electronic components |
| 07/06/2004 | US6759845 Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same |
| 07/06/2004 | US6759749 Circuit structure, manufacturing method thereof and wiring structure |
| 07/06/2004 | US6759744 Electronic circuit unit suitable for miniaturization |
| 07/06/2004 | US6759743 Thick film millimeter wave transceiver module |
| 07/06/2004 | US6759740 Insulating layers of alumina ceramics and dielectric layers of ceramics laminated as a unitary structure, and conductor layers of au, ag, cu and pt are formed on the surfaces and inside of the composite ceramic board |
| 07/06/2004 | US6759739 Multilayered substrate for semiconductor device |
| 07/06/2004 | US6759738 Systems interconnected by bumps of joining material |
| 07/06/2004 | US6759625 Device for the laser processing of workpieces |
| 07/06/2004 | US6759600 Multilayer wiring board and method of fabrication thereof |
| 07/06/2004 | US6759599 Having thick-film fine wiring patterns, and a miniature high-performance high-output module |
| 07/06/2004 | US6759597 Wire bonding to dual metal covered pad surfaces |
| 07/06/2004 | US6759596 Sequential build circuit board |
| 07/06/2004 | US6759318 Translation pad flip chip (TPFC) method for improving micro bump pitch IC substrate structure and manufacturing process |
| 07/06/2004 | US6759142 Plated copper alloy material and process for production thereof |
| 07/06/2004 | US6759140 Areas of a first liquid crystal thermoplastic are present on at least one surface of next to areas of second syndiotactic polystyrene thermoplastic component |
| 07/06/2004 | US6759115 Multilayer circuit component and method for manufacturing the same |
| 07/06/2004 | US6759082 Metal foil laminated plate and method of manufacturing the same |
| 07/06/2004 | US6758984 Selective removal of dielectric materials and plating process using same |
| 07/06/2004 | US6758926 Method for producing multilayer ceramic substrate |
| 07/06/2004 | US6758712 Methods of manufacturing wiring substrate and electron source substrate and image forming apparatus with the same |
| 07/06/2004 | US6758686 Low current minimal alignment compression contact system |
| 07/06/2004 | US6758389 Composition for preventing creeping of a flux for soldering and use thereof |
| 07/06/2004 | US6758200 Ignition coil driver chip on printed circuit board for plughole coil housing |
| 07/06/2004 | US6758108 Solderability testing apparatus and solderability testing method |
| 07/06/2004 | US6757972 Method of forming socket contacts |
| 07/06/2004 | US6757971 Depositing malleable conductive layer over dielectric having openings using alumina slurry |
| 07/06/2004 | US6757968 Chip scale packaging on CTE matched printed wiring boards |
| 07/06/2004 | US6757966 Component mounting system and mounting method |
| 07/06/2004 | CA2396750C Rfid foil or film antennas |
| 07/06/2004 | CA2177275C Fabrication multilayer combined rigid/flex printed circuit board |
| 07/01/2004 | WO2004056163A1 Electronic card with wire-braced structure |
| 07/01/2004 | WO2004056162A1 Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package |
| 07/01/2004 | WO2004056161A1 A method of protecting metal foil subtrates |
| 07/01/2004 | WO2004056160A1 Printed wiring boards having low inductance embedded capacitors and methods of making same |
| 07/01/2004 | WO2004055834A1 Electric conductors |
| 07/01/2004 | WO2004055126A1 Anisotropic-electroconductive adhesive, circuit connection method and structure using the same |
| 07/01/2004 | WO2004055058A1 Process for producing resin particle and process for producing anisotropically conductive adhesive |
| 07/01/2004 | WO2004054798A1 Process for bonding metal components to the surfaces of cycloolefin resin moldings and cycloolefin resin moldings provided with metal components |
| 07/01/2004 | WO2004039897A3 Process for making an electrochemical sensor |
| 07/01/2004 | WO2004039134A3 Printed circuit heaters with ultrathin low resistivity materials |
| 07/01/2004 | WO2004036964A3 Method for the manufacture of printed circuit boards with integral plated resistors |
| 07/01/2004 | WO2004022338A3 Printing method using rubber stamp |
| 07/01/2004 | WO2004021749A3 Manufacture of flexible printed circuit boards |