| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/14/2004 | EP1436827A2 Device for soldering contacts on semiconductor chips |
| 07/14/2004 | EP1436818A1 Process relating to polymers |
| 07/14/2004 | EP1436773A1 Electronic module with protective bump |
| 07/14/2004 | EP1436605A1 Sensor substrate and method of fabricating same |
| 07/14/2004 | EP1436445A1 Process for making thin film porous ceramic-metal composites and composites obtained by this process |
| 07/14/2004 | EP1436237A1 Bonding method and product |
| 07/14/2004 | EP1436142A1 Metal-containing web processed with a continuous etch process |
| 07/14/2004 | EP1208618B1 Control device and soldering method |
| 07/14/2004 | CN2626190Y Multilayer base plate |
| 07/14/2004 | CN2626189Y Connection lead structure for electronic component and circuit board |
| 07/14/2004 | CN2626188Y Connection lead structure for electronic component and circuit board |
| 07/14/2004 | CN2626187Y Laminated line base plate |
| 07/14/2004 | CN2626186Y Rigid flexible base plate and camera using the same |
| 07/14/2004 | CN1513285A Method and device for structuring printed circuit board |
| 07/14/2004 | CN1513206A Fluxless flip chip inter connection |
| 07/14/2004 | CN1512935A Inkjet deposition apparatus and method |
| 07/14/2004 | CN1512920A Dimensionally stable composite article and method of making the same |
| 07/14/2004 | CN1512919A Microdeposition apparatus |
| 07/14/2004 | CN1512918A Interchangeable microdeposition head apparatus and method |
| 07/14/2004 | CN1512917A Waveform generation for microdeposition control system |
| 07/14/2004 | CN1512579A 半导体模块 Semiconductor Modules |
| 07/14/2004 | CN1512568A Film carrier tape for electronic part and its producing method |
| 07/14/2004 | CN1512554A Method for connecting integrated circuit to substrate and relative circuit wiring |
| 07/14/2004 | CN1512525A Capacitor and capacitor built-in circuit substrate and its producing method |
| 07/14/2004 | CN1512283A System for determining positioning hole location in printed circuit board producing controller |
| 07/14/2004 | CN1511672A Multiple beam laser holing working device |
| 07/14/2004 | CN1158005C Electric connection method between coaxial cable and circuit board and coaxial cable connector assembly |
| 07/14/2004 | CN1158004C Method and device of preventing soldering tin from adhering in wave soldering |
| 07/14/2004 | CN1157993C Apparatus having electroacoustic transducer mounted on PC board with aid of holding means |
| 07/14/2004 | CN1157773C Metal core substrate printed wiring board enabling thermally enhanced ball grid array (BGA) packages and method |
| 07/14/2004 | CN1157741C Chip type PTC thermistor |
| 07/14/2004 | CN1157503C Method for producing very small metal ball |
| 07/14/2004 | CN1157289C Method and device for cleaning silk screen for screen printing |
| 07/13/2004 | US6762921 Multilayer printed-circuit board and method of manufacture |
| 07/13/2004 | US6762521 Drive unit for a fan in a vehicle |
| 07/13/2004 | US6762506 Assembly of semiconductor device and wiring substrate |
| 07/13/2004 | US6762503 Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same |
| 07/13/2004 | US6762495 Area array package with non-electrically connected solder balls |
| 07/13/2004 | US6762494 Electronic package substrate with an upper dielectric layer covering high speed signal traces |
| 07/13/2004 | US6762485 Plastic lead frames for semiconductor devices |
| 07/13/2004 | US6762428 Cream solder inspection method and apparatus therefor |
| 07/13/2004 | US6762369 Multilayer ceramic substrate and method for manufacturing the same |
| 07/13/2004 | US6762367 Electronic package having high density signal wires with low resistance |
| 07/13/2004 | US6762249 Rapid low temperature setting; high adhesion, stress releaving polyurethane resin, free radical polymerizable material and curing agent |
| 07/13/2004 | US6762124 Method for patterning a multilayered conductor/substrate structure |
| 07/13/2004 | US6762122 Methods of forming metallurgy structures for wire and solder bonding |
| 07/13/2004 | US6762075 Semiconductor module and producing method therefor |
| 07/13/2004 | US6762073 Method of fabricating electronic interconnect devices using direct imaging of dielectric composite material |
| 07/13/2004 | US6761975 Resistance to delamination; eliminates the need for a primer coating application process step; curable polyaryl ether film |
| 07/13/2004 | US6761963 Integrated thin film capacitor/inductor/interconnect system and method |
| 07/13/2004 | US6761926 Pressure is applied to solder within a contained environment defined by a head cap to force it through a stencil; effective shearing; printed circuits |
| 07/13/2004 | US6761814 Superior filling properties and superior planarization of the deposited metal layer is provided. this is achieved by a method having a f/r ratio, the ratio of the electric current densities between the forward electrolysis and the reverse |
| 07/13/2004 | US6761790 Filling a through hole on a prepreg including a releasing resin film with a conductive paste containing a conductive filler; peeling said releasing resin film; laminating a metal foil; and heating and pressurizing the laminated product. |
| 07/13/2004 | US6761769 Apparatus for applying viscous material |
| 07/13/2004 | US6761598 Bus bar structure |
| 07/13/2004 | US6761586 Board connector and method of attaching board connector |
| 07/13/2004 | US6761302 Device mounting method |
| 07/13/2004 | US6761301 Soldering machine |
| 07/13/2004 | US6760981 Compact convection drying chamber for drying printed circuit boards and other electronic assemblies by enhanced evaporation |
| 07/13/2004 | US6760969 Method for connecting electrical components |
| 07/13/2004 | CA2232523C Plug-in type electronic control unit, structure of connection of wiring board with plug member, unit of connection of electronic part with wiring board, and process for mounting electronic part |
| 07/08/2004 | WO2004057670A1 Surface-mounted microwave package and corresponding mounting with multilayer circuit |
| 07/08/2004 | WO2004057669A1 Electro-forming master, its manufacturing method, and metal minute pattern made by it |
| 07/08/2004 | WO2004057061A1 Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit |
| 07/08/2004 | WO2004057055A1 Plating of multi-layer structures |
| 07/08/2004 | WO2004056933A1 Self-adhesive article with at least one layer of a thermally-conducting adhesive mass and method for production thereof |
| 07/08/2004 | WO2004008832A3 Attachable modular electronic systems |
| 07/08/2004 | WO2004007811A3 Device and method for monitoring an electrolytic process |
| 07/08/2004 | WO2002004712A3 Flow diffuser to be used in electro-chemical plating system |
| 07/08/2004 | US20040132925 Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board |
| 07/08/2004 | US20040132900 Heat resistance, chemical resistance, waterproofing; curing, cyclization polyamic acids |
| 07/08/2004 | US20040132857 Esterified maleic anhydride-styrene copolymer; using photoinitiator and curing agents; shrinkage inhibition, flexibility; shelf life; for printed circuits |
| 07/08/2004 | US20040132322 Filtered electrical connector assembly for an overmolded electronic package |
| 07/08/2004 | US20040132321 Connection housing for an electronic component |
| 07/08/2004 | US20040132299 Method for depositing lead-free tin alloy |
| 07/08/2004 | US20040132279 Electronic package with filled blind vias |
| 07/08/2004 | US20040132230 Ball grid array substrate and method for preparing the same |
| 07/08/2004 | US20040132229 Concurrent electrical signal wiring optimization for an electronic package |
| 07/08/2004 | US20040131964 Thick film containing partially naphthoquinonediazidosulfonyl ester substituted novalak resin and methyl vinyl ether-monoalkyl maleate polymer; high sensitivity and resolution, perpendicular geometry and crack resistance during and after plating |
| 07/08/2004 | US20040131869 Method for producing a conductive coating on an insulating substrate |
| 07/08/2004 | US20040131832 Metal/ceramic circuit board |
| 07/08/2004 | US20040131782 Preventing disconnections and short circuits; surface pretreating to set contact angle for ink jet droplet |
| 07/08/2004 | US20040131779 Process for forming a patterned thin film structure on a substrate |
| 07/08/2004 | US20040131765 Method for manufacturing double-sided flexible printed board |
| 07/08/2004 | US20040131764 Method for Manufacturing Printed Circuit Boards From an Extruded Polymer |
| 07/08/2004 | US20040130877 Substrate for high-frequency module and high-frequency module |
| 07/08/2004 | US20040130500 Non-contact communication medium |
| 07/08/2004 | US20040130435 Ball grid array resistor network having a ground plane |
| 07/08/2004 | US20040130428 Surface mount magnetic core winding structure |
| 07/08/2004 | US20040130343 High density cantilevered probe for electronic devices |
| 07/08/2004 | US20040130013 Electronic parts packaging structure and method of manufacturing the same |
| 07/08/2004 | US20040130003 Fine line circuitization |
| 07/08/2004 | US20040129765 Junction box and soldering method for printed circuit board of the junction box |
| 07/08/2004 | US20040129764 Reducing surface tension and oxidation potential of tin-based solders |
| 07/08/2004 | US20040129761 Tool head for attaching an electrical conductor on the contact surface of a substrate and method for implementing the attachment |
| 07/08/2004 | US20040129689 Method of making hole in ceramic green sheet |
| 07/08/2004 | US20040129685 Multibeam laser drilling apparatus |
| 07/08/2004 | US20040129454 Circuit board made of resin with pin |
| 07/08/2004 | US20040129453 Electronic substrate with direct inner layer component interconnection |
| 07/08/2004 | US20040129452 Multi-strand substrate for ball-grid array assemblies and method |