| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/20/2004 | US6765275 Two-layer electrical substrate for optical devices |
| 07/20/2004 | US6764938 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof |
| 07/20/2004 | US6764937 Solder on a sloped surface |
| 07/20/2004 | US6764935 Stereolithographic methods for fabricating conductive elements |
| 07/20/2004 | US6764933 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 07/20/2004 | US6764931 Semiconductor package, method of manufacturing the same, and semiconductor device |
| 07/20/2004 | US6764882 Two-stage transfer molding method to encapsulate MMC module |
| 07/20/2004 | US6764812 Plasma deposited selective wetting material |
| 07/20/2004 | US6764748 Z-interconnections with liquid crystal polymer dielectric films |
| 07/20/2004 | US6764747 Circuit board and method of producing the same |
| 07/20/2004 | US6764626 Piece having a portion of its visible surface galvanized, wherein the non-galvanized portion of its visible surface is covered in a film of non-galvanizable material that adheres strongly to the galvanized material |
| 07/20/2004 | US6764586 Method for electrochemically metallizing an insulating substrate |
| 07/20/2004 | US6764549 Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
| 07/20/2004 | US6764325 Zero insertion force heat-activated retention pin |
| 07/20/2004 | US6764319 Electrical connector having contacts with anti-wicking means |
| 07/20/2004 | US6764318 Self-centering press-fit connector pin used to secure components to a receiving element |
| 07/20/2004 | US6764316 Straddle-mount electrical connector |
| 07/20/2004 | US6764313 High density interconnects |
| 07/20/2004 | US6764264 Female screw device pickable by a SMT automatic machine |
| 07/20/2004 | US6764166 Ejecting ink using shape memory alloys |
| 07/20/2004 | US6763994 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 07/20/2004 | US6763585 Method for producing micro bump |
| 07/20/2004 | US6763581 Method for manufacturing spiral contactor |
| 07/20/2004 | US6763580 Method and apparatus for securing an electrically conductive interconnect through a metallic substrate |
| 07/20/2004 | US6763579 Method of making components with releasable leads |
| 07/20/2004 | US6763578 Method and apparatus for manufacturing known good semiconductor die |
| 07/20/2004 | US6763575 Printed circuit boards having integrated inductor cores |
| 07/20/2004 | CA2315177C Component of printed circuit boards |
| 07/20/2004 | CA2222857C Process to create metallic stand-offs on an electronic circuit |
| 07/15/2004 | WO2004060036A1 Separator plate for the production of circuit board components |
| 07/15/2004 | WO2004060035A1 Circuit board having a multi-functional hole |
| 07/15/2004 | WO2004060034A1 Electronic component-built-in module |
| 07/15/2004 | WO2004060033A1 Multilayer product to make printed circuit boards |
| 07/15/2004 | WO2004059804A1 Flat cable harness |
| 07/15/2004 | WO2004059729A1 Electronic part manufacturing method and electronic part |
| 07/15/2004 | WO2004059042A1 Lead-free bump and method for forming the same |
| 07/15/2004 | WO2003084295A3 Inductor and decoupling structures for filters and design method thereof |
| 07/15/2004 | WO2003064102A8 Solder metal, soldering flux and solder paste |
| 07/15/2004 | US20040138325 Ultraviolet activatable adhesive film |
| 07/15/2004 | US20040137803 Flanged terminal pins for dc/dc converters |
| 07/15/2004 | US20040137802 Crimp connector |
| 07/15/2004 | US20040137766 Connecting device for flexible electrical connection of circuit boards |
| 07/15/2004 | US20040137710 Method for producing a structure using nanoparticles |
| 07/15/2004 | US20040137664 Advanced packaging shell for pocketable consumer electronic devices |
| 07/15/2004 | US20040137659 [method of fabricating a solder mask and structure of a substrate] |
| 07/15/2004 | US20040137372 Utilizes the dependence of the chemical etching rate on the controlled laser exposure dose for forming variable laser irradiated and crystallized regions of the exposed glass, that have variable etch rates dependent on laser irradiance |
| 07/15/2004 | US20040137251 Curable blends contains a methacrylate capped polyethers; free-standing film on metal foil or thermoplastic substrate; molecular weight of between about 900 and 75,000; printed circuit boards |
| 07/15/2004 | US20040137173 Potting material for electronic components |
| 07/15/2004 | US20040136725 Optical communication device |
| 07/15/2004 | US20040136335 Structure of circuit boards for wireless communication apparatus |
| 07/15/2004 | US20040136170 Capacitor device and fabricating method thereof |
| 07/15/2004 | US20040136169 Printed circuit board, a buildup substrate, a method of manufacturing printed circuit board, and an electronic device |
| 07/15/2004 | US20040136168 Techniques for reducing the number of layers in a multilayer signal routing device |
| 07/15/2004 | US20040136164 Systems and methods that use at least one component to remove the heat generated by at least one other component |
| 07/15/2004 | US20040136162 Heat dissipating device for electronic components of electronic control devices |
| 07/15/2004 | US20040136152 Core substrate, and multilayer circuit board using it |
| 07/15/2004 | US20040136123 Circuit devices and method for manufacturing the same |
| 07/15/2004 | US20040135919 Camera module and method of fabricating the same |
| 07/15/2004 | US20040135847 Droplet ejecting device, droplet ejecting method, and electronic optical device |
| 07/15/2004 | US20040135445 Vibration motor holding apparatus and portable electronic equipment having the same |
| 07/15/2004 | US20040135269 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
| 07/15/2004 | US20040135264 Semiconductor device and method for packaging same |
| 07/15/2004 | US20040135258 Contact structure, display device and electronic device |
| 07/15/2004 | US20040135251 Composite metal column for mounting semiconductor device |
| 07/15/2004 | US20040135249 Semiconductor devices and substrates used in thereof |
| 07/15/2004 | US20040135246 Method for fabricating semiconductor package and semiconductor package |
| 07/15/2004 | US20040135240 Molded substrate stiffener with embedded capacitors |
| 07/15/2004 | US20040134976 Method and system for solder connecting electrical devices |
| 07/15/2004 | US20040134975 Composite pallet for a vector transient reflow process |
| 07/15/2004 | US20040134974 Solder bump structure and method for forming a solder bump |
| 07/15/2004 | US20040134896 Laser-based method and system for memory link processing with picosecond lasers |
| 07/15/2004 | US20040134894 Laser-based system for memory link processing with picosecond lasers |
| 07/15/2004 | US20040134886 Surface for use on implantable device |
| 07/15/2004 | US20040134875 Circuit-parts sheet and method of producing a multi-layer circuit board |
| 07/15/2004 | US20040134772 Monolithic structures including alignment and/or retention fixtures for accepting components |
| 07/15/2004 | US20040134685 Two signal one power plane circuit board |
| 07/15/2004 | US20040134684 Laminate comprised of flat conductor elements |
| 07/15/2004 | US20040134682 Printed wiring board and its manufacturing method |
| 07/15/2004 | US20040134681 Circuit board and its manufacturing method |
| 07/15/2004 | US20040134680 Use of perimeter stops to support solder interconnects between integrated circuit assembly components |
| 07/15/2004 | US20040134676 Cover for ball-grid array conenctor |
| 07/15/2004 | US20040134619 Paste application apparatus |
| 07/15/2004 | US20040134604 Method of producing a laminated structure |
| 07/15/2004 | US20040134363 Solder paste printing method, solder paste printing apparatus, and method for manufacturing a wiring substrate having solder-printed layers |
| 07/15/2004 | DE202004006434U1 Circuit with circuit board carrying conductive grid for use in industrial technology, typically in car manufacture, with electric components |
| 07/15/2004 | DE19732223B4 Aggregateträger für elektrische Verbraucher, insbesondere Türaggregateträger für Kraftfahrzeugtüren Subframe for electrical loads, especially door subframe for motor vehicle doors |
| 07/15/2004 | DE19512196B4 Kupferfolien für Basismaterial von gedruckten Schaltungen sowie Verfahren zur Oberflächenbehandlung der Kupferfolien Copper foil for the base material of printed circuits as well as method for surface treatment of the copper foils |
| 07/15/2004 | DE10357789A1 Leistungs-Halbleitervorrichtung Power semiconductor device |
| 07/15/2004 | DE10301352B3 Solder terminal element for connecting electrical conductor with conductor structure applied to substrate e.g. automobile windscreen |
| 07/15/2004 | DE10260786A1 Flachkabelstrang Flat harness |
| 07/15/2004 | DE10258961A1 Electrically-conductive adhesive film for implanting electrical modules in cards e.g. smart cards, contains elastomeric polymer, resins and conductive particles in which the conductive metal is not more noble than copper |
| 07/15/2004 | DE10247676A1 Electronic circuit boards used in such as road vehicle equipment is protected by all over cover of plastic foil |
| 07/14/2004 | EP1437930A2 Filtered electrical connector assembly for an overmolded electronic package |
| 07/14/2004 | EP1437928A1 Multi-layer wiring board, ic package, and method of manufacturing multi-layer wiring boards |
| 07/14/2004 | EP1437798A1 Assembly for the connection of a multi-wire conductor with a circuit board which is adaptable within a housing |
| 07/14/2004 | EP1437378A1 Process for the valorization of waste epoxy resin materials |
| 07/14/2004 | EP1437192A2 Method and apparatus for dispensing small amounts of liquid material |
| 07/14/2004 | EP1437037A1 Method for making conductive circuits using powdered metals |
| 07/14/2004 | EP1436839A2 Electronic unit, circuit design for the same, and production method |
| 07/14/2004 | EP1436834A2 Stacking of multilayer modules |