| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/22/2004 | US20040142511 Lead frame and production process thereof and production process of thermally conductive substrate |
| 07/22/2004 | US20040142510 Apparatus and method for circuit board routing fixture |
| 07/22/2004 | US20040142507 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
| 07/22/2004 | US20040142191 using a transparent and heat resistant polyimide film as a protection coverfilm instead of using a higher cost black polyimide film and using a black epoxy adhesive containingcarbon black powder instead of using a common epoxy adhesive. |
| 07/22/2004 | US20040142165 conductive particles included in the second layer are coalesced with each other to become wiring |
| 07/22/2004 | US20040142161 Circuit board electrically insulating material, circuit board and method for manufacturing the same |
| 07/22/2004 | US20040142155 Film for circuit board |
| 07/22/2004 | US20040142136 polyvinylidene fluoride (PVDF) film suitable for use under conditions of high temperature and harsh chemical environments encountered in printed circuit board manufacturing processes |
| 07/22/2004 | US20040142118 Flexible electronic device and production method of the same |
| 07/22/2004 | US20040142099 to print circuit boards of relatively long lengths that have widths shorter than their lengths by using rotatable table |
| 07/22/2004 | US20040141299 Burrless castellation via process and product for plastic chip carrier |
| 07/22/2004 | US20040141298 Ball grid array package construction with raised solder ball pads |
| 07/22/2004 | US20040141296 Stress resistant land grid array (LGA) module and method of forming the same |
| 07/22/2004 | US20040141109 Resin application method on panel, manufacturing method of panel for display and resin applying apparatus thereof |
| 07/22/2004 | US20040140877 Microconverter and laminated magnetic-core inductor |
| 07/22/2004 | US20040140862 Miniature RF and microwave components and methods for fabricating such components |
| 07/22/2004 | US20040140858 Crystal oscillation device and electronic device using the same |
| 07/22/2004 | US20040140571 Mounting structure of electronic device |
| 07/22/2004 | US20040140561 Substrate with top-flattened solder bumps and method for manufacturing the same |
| 07/22/2004 | US20040140560 Method and apparatus for interconnecting a relatively fine pitch circuit layer and adjacent power plane(s) in a laminated construction |
| 07/22/2004 | US20040140554 Electronic module having compliant spacer |
| 07/22/2004 | US20040140551 Semiconductor device, method for manufacturing same and thin plate interconnect line member |
| 07/22/2004 | US20040140550 High-frequency package |
| 07/22/2004 | US20040140549 Wiring structure and its manufacturing method |
| 07/22/2004 | US20040140542 Prefabricated semiconductor chip carrier |
| 07/22/2004 | US20040140539 Semiconductor device with double nickel-plated leadframe |
| 07/22/2004 | US20040140538 Flex-based ic package construction employing a balanced lamination |
| 07/22/2004 | US20040140414 Surface mountable clip suitable for use in a mobile communication device |
| 07/22/2004 | US20040140299 Laser drilling method |
| 07/22/2004 | US20040140298 Iced film substrate cleaning |
| 07/22/2004 | US20040140123 Printed circuit board comprising a contact sleeve that is mounted thereon |
| 07/22/2004 | US20040140116 High voltage module and method for producing same |
| 07/22/2004 | US20040139869 Screen printing apparatus and method of screen printing |
| 07/22/2004 | US20040139604 Method and apparatus for installing a circuit device |
| 07/22/2004 | US20040139603 Wired board with bump electrode and method of fabricating the same |
| 07/22/2004 | US20040139600 Process for massively producing tape type flexible printed circuits |
| 07/22/2004 | US20040139589 Method of producing circuit carriers with integrated passive components |
| 07/22/2004 | DE10361087A1 Manufacture of printed circuit board with embedded capacitors by forming ground layer copper foil on inner layer of printed circuit board, and coating polymer capacitor paste having high-dielectric constant on ground layer copper foil |
| 07/22/2004 | DE10360441A1 Control circuit board e.g. for power distributor circuit in motor vehicles, has lateral recess coated with conductive layer, which is joined to control circuit board |
| 07/22/2004 | DE10360242A1 Metallurgisches Bonden von integriertem flexiblem Substrat Metallurgical bonding of integrated flexible substrate |
| 07/22/2004 | DE10358360A1 Verbindermontageaufbau und Verbindermontageverfahren Connector mounting assembly and connector assembly method |
| 07/22/2004 | DE10357251A1 Montageanordnung für elektronische Bauteile A mounting assembly of electronic components |
| 07/22/2004 | DE10357224A1 Spannvorrichtung zum Einpressen von Anschlüssen und Einpressvorrichtung Clamping device for pressing connections and press-in |
| 07/22/2004 | DE10329657A1 Gedruckte Schaltkarte mit darin eingebetteten Kondensatoren und Verfahren zur Herstellung derselben Printed circuit board with embedded capacitors and methods for making same |
| 07/22/2004 | DE10309502A1 Lothügelstruktur und Verfahren zur Herstellung derselben Lothügelstruktur and methods for making the same |
| 07/22/2004 | DE10297077T5 Verfahren zur Verbesserung der Stabilität von Kohlenstoffdispersionen A process for improving the stability of carbon dispersions |
| 07/22/2004 | DE10261410A1 Assembly of an integrated circuit, e.g. a chip, wafer or hybrid with substrate by provision of a packing and substrate with the same number of junction regions useful for construction of integrated circuits |
| 07/22/2004 | DE10260774A1 Device for soldering two de-insulated film cable ends together has measurement device that detects change in thickness of stack of film cable ends and solder carrying band during soldering process |
| 07/22/2004 | DE10241619B4 Vorrichtung und Verfahren zum elektrolytischen Behandeln von zumindest oberflächlich elektrisch leitfähigem Behandlungsgut Method and apparatus for electrolytic treatment of at least superficially electrically conductive material to be treated |
| 07/22/2004 | DE10234585B4 Optoelektronisches SMD-Bauteil für den Empfang von elektromagnetischer Strahlung, insbesondere Sonnenlicht, und dessen Verwendung in einem Strahlungssensor An opto-electronic SMD component for receiving electromagnetic radiation, in particular sunlight, and its use in a radiation sensor |
| 07/22/2004 | DE102004001836A1 Schaltkreis-Trägerkörper und Verfahren zu dessen Herstellung Circuit-carrier body and process for its preparation |
| 07/22/2004 | DE10130618B4 Verfahren zum Bestücken eines Trägers mit einem Bauteil und Vorrichtung zum Verbinden derselben Method of loading a carrier with a component and device for connecting the same |
| 07/22/2004 | CA2510922A1 Compositions and methods for cleaning contaminated articles |
| 07/22/2004 | CA2508889A1 A tamper-indicating rfid antenna |
| 07/22/2004 | CA2505474A1 Method for modifying the surface of a polymeric substrate |
| 07/21/2004 | EP1439744A2 Apparatus and method for aligning and attaching solder columns to a substrate |
| 07/21/2004 | EP1439743A2 Process for applying conductive tracks on the surface of plastic moulded parts and the obtained moulded parts |
| 07/21/2004 | EP1439742A1 Manufacturing method for a circuit board for electronic apparatus |
| 07/21/2004 | EP1439600A2 Connecting element by soldering |
| 07/21/2004 | EP1439581A2 Interconnection structure |
| 07/21/2004 | EP1439555A1 Potting material for electronic components |
| 07/21/2004 | EP1439551A1 SMD inductive miniatur component |
| 07/21/2004 | EP1439397A2 Method of performing a burn-in |
| 07/21/2004 | EP1439025A1 FLUX COMPOSITION FOR SOLDER, SOLDER PASTE, AND METHOD OF SOLDERING |
| 07/21/2004 | EP1439020A2 Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus |
| 07/21/2004 | EP1439019A1 Drill |
| 07/21/2004 | EP1439017A1 Monodisperse metal spherical particle and production method thereof |
| 07/21/2004 | EP1438881A2 Green ceramic insert, ceramic insert, ceramic green body or green body composite and ceramic laminated composite produced thereby |
| 07/21/2004 | EP1438447A2 Method and conveyorized system for electrolytically processing work pieces |
| 07/21/2004 | EP1438446A2 System and method for electrolytic plating |
| 07/21/2004 | EP1413004A4 Ball grid array antenna |
| 07/21/2004 | EP1360881B1 Method for producing wirings with rough conducting structures and at least one area with fine conducting structures |
| 07/21/2004 | EP1222725A4 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning |
| 07/21/2004 | EP1166361A4 Apparatus and method for an integrated circuit having high q reactive components |
| 07/21/2004 | EP0985486B1 Leadless solder |
| 07/21/2004 | EP0961809A4 Low temperature method and compositions for producing electrical conductors |
| 07/21/2004 | CN2627791Y Surface binding technical plant using continuous flexible circuit board as base plate |
| 07/21/2004 | CN1515032A Ball grid array x-ray oreintation mark |
| 07/21/2004 | CN1515031A Process for mfg. of printed circuit boards with plated resistors |
| 07/21/2004 | CN1515012A Improved method for forming magnetic layers in printed circuit boards |
| 07/21/2004 | CN1514939A Circuit pattern inspection device, circuit pattern inspection method, and recording medium |
| 07/21/2004 | CN1514764A Ceramic multilayer substrate manufacturing method unfired composite multilayer body |
| 07/21/2004 | CN1514759A Soldering flux additive |
| 07/21/2004 | CN1514757A Circle laser trepanning |
| 07/21/2004 | CN1514516A Conduvtive elastic contact system having anti overstress column |
| 07/21/2004 | CN1514492A Semiconductor storage module |
| 07/21/2004 | CN1514449A Electric resistance material |
| 07/21/2004 | CN1513634A Welding flux setting up method |
| 07/21/2004 | CN1513605A Binder coating device |
| 07/21/2004 | CN1158900C Integral holder-connector for capacitor microphone, its preparing method and mounting method |
| 07/21/2004 | CN1158681C Axial wire-guiding type electronics parts and device for installation of circuit base board |
| 07/21/2004 | CN1158676C Resistor and its manufacturing method |
| 07/21/2004 | CN1158566C Display and electronic apparatus using the same |
| 07/21/2004 | CN1158531C Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card |
| 07/21/2004 | CN1158412C Device and method for evening out thickness of metal layers on electrical contact points on items that are to be treated |
| 07/21/2004 | CN1158155C Method and apparatus for dispensing material in printer |
| 07/20/2004 | US6765934 Laser repetition rate multiplier |
| 07/20/2004 | US6765805 Circuit component |
| 07/20/2004 | US6765293 Electrode structure of a carrier substrate of a semiconductor device |
| 07/20/2004 | US6765288 Stacked chip mounting without special prepackaged unit |