| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 07/28/2004 | EP1441389A2 Electronic parts packaging structure and method of manufacturing the same |
| 07/28/2004 | EP1441232A2 Method for connecting electronic components |
| 07/28/2004 | EP1441046A1 SURFACE−TREATED COPPER FOIL |
| 07/28/2004 | EP1440931A1 Method for manufacturing metal microstructure |
| 07/28/2004 | EP1440608A1 Method for opening the plastic housing of an electronic module |
| 07/28/2004 | EP1440606A1 Laminated model for a multilayer printed circuit wafer blank |
| 07/28/2004 | EP1440493A2 Bending a tab flex circuit via cantilevered leads |
| 07/28/2004 | EP1440471A2 Ball grid array with x-ray alignment mark |
| 07/28/2004 | EP1440465A1 Contact planarization materials that generate no volatile byproducts or residue during curing |
| 07/28/2004 | EP1440348A1 Uv curable powder suitable for use as photoresist |
| 07/28/2004 | EP1440181A2 High resolution patterning method |
| 07/28/2004 | EP1440035A1 A method of fabrication of micro-devices |
| 07/28/2004 | EP1439952A1 Copper foil with low profile bond enhancement |
| 07/28/2004 | EP1370387B1 Device for applying solder globules |
| 07/28/2004 | EP1145609B1 Improved method for wire-scribing filament circuit patterns with planar and non-planar portions; improved wire-scribed boards and smart card made by this method |
| 07/28/2004 | EP0801815B1 Electrical circuit suspension system |
| 07/28/2004 | CN2629388Y Soldering set |
| 07/28/2004 | CN2629387Y Metal connecting structure of printed circuit board |
| 07/28/2004 | CN2629386Y Rear soldering pad |
| 07/28/2004 | CN2629385Y Printing board |
| 07/28/2004 | CN2629245Y 电连接器 The electrical connector |
| 07/28/2004 | CN1516996A Heat sink |
| 07/28/2004 | CN1516727A Method for adhering substrates using ultraviolet activatable adhesive film and ultraviolet irradiation apparatus |
| 07/28/2004 | CN1516544A Method for making electrical connecting body of circuit layout of printed circuit board |
| 07/28/2004 | CN1516543A Backflow brazier |
| 07/28/2004 | CN1516542A Sheet-like matter for heat-transfer base plate and its mfg. method, and heat-transfer base plate and mfg. method using it |
| 07/28/2004 | CN1516541A Flexible printed circuit base material |
| 07/28/2004 | CN1516540A Combination struicture of electronic element and circuit board |
| 07/28/2004 | CN1516537A Circuit device and its mfg. method |
| 07/28/2004 | CN1516334A Voltage-controlled oscillator and its related making method |
| 07/28/2004 | CN1516272A Semiconductor device, its mfg. method and thin sheet interconnecting line parts |
| 07/28/2004 | CN1516251A Method for mfg. semiconductor assembly and semiconductor assembly |
| 07/28/2004 | CN1516250A Semiconductor device and mfg. method, circuit board and film carrier belt |
| 07/28/2004 | CN1516243A Crystalline grain in metal film growth control method |
| 07/28/2004 | CN1516241A Method for forming penetrating electrode and chip with penerating electrode |
| 07/28/2004 | CN1516203A Constrained sintering method for asymmetrical configurational dielectric layer |
| 07/28/2004 | CN1515928A 液晶显示器 LCD Monitor |
| 07/28/2004 | CN1159960C Laminating method and product of 8-layer circuit board |
| 07/28/2004 | CN1159959C Method for production of electrotechnical device |
| 07/28/2004 | CN1159958C Composite copper foil, process for preparing same, and copper-clad laminate and printed wiring board using the same |
| 07/28/2004 | CN1159957C Method for mfg. flexible element substrate |
| 07/28/2004 | CN1159956C Terminal electrode for circuit substrate on which chip package mounted and method for manufacturing the same |
| 07/28/2004 | CN1159795C High frequency circuit appts. antenna shared device and communication appts. |
| 07/28/2004 | CN1159734C Built-in fingered flat capacitor and resistor and making method thereof |
| 07/28/2004 | CN1159606C Miniature optical plug |
| 07/27/2004 | US6768869 Camera body, camera and method for assembling same |
| 07/27/2004 | US6768654 Multi-layered structures and methods for manufacturing the multi-layered structures |
| 07/27/2004 | US6768533 Liquid crystal device, manufacturing method therefor, and electronic apparatus |
| 07/27/2004 | US6768401 Wiring board with a waveguide tube and wiring board module for mounting plural wiring boards |
| 07/27/2004 | US6768316 Laser cutting of laminates for electrical insulation testing |
| 07/27/2004 | US6768197 Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device |
| 07/27/2004 | US6768191 Electronic component with stacked electronic elements |
| 07/27/2004 | US6768100 Continuous position calibration for servo controlled rotary system |
| 07/27/2004 | US6768083 Reflow soldering apparatus and method for selective infrared heating |
| 07/27/2004 | US6768064 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
| 07/27/2004 | US6768063 Multilayer; capacitance coupling |
| 07/27/2004 | US6768062 Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof |
| 07/27/2004 | US6768061 Multilayer circuit board |
| 07/27/2004 | US6767828 Method for forming patterns for semiconductor devices |
| 07/27/2004 | US6767817 Asymmetric plating |
| 07/27/2004 | US6767815 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 07/27/2004 | US6767763 Component mounting method and method of producing electro-optical device |
| 07/27/2004 | US6767678 Photosolder resist composition |
| 07/27/2004 | US6767644 Metallized polyimide film |
| 07/27/2004 | US6767643 Copper-alloy foil to be used for laminate sheet |
| 07/27/2004 | US6767616 Metal core substrate and process for manufacturing same |
| 07/27/2004 | US6767477 Etching process to selectively remove copper plating seed layer |
| 07/27/2004 | US6767445 Method for the manufacture of printed circuit boards with integral plated resistors |
| 07/27/2004 | US6767392 Adhesion properties and high solderability |
| 07/27/2004 | US6767140 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology |
| 07/27/2004 | US6767137 Optical connector and optical element |
| 07/27/2004 | US6766938 Apparatus and method of placing solder balls onto a substrate |
| 07/27/2004 | US6766811 Method of removing smear from via holes |
| 07/27/2004 | US6766764 Matrix assisted pulsed laser evaporation direct write |
| 07/27/2004 | US6766736 Printing stencils for electronic substrates |
| 07/27/2004 | US6766576 Method for producing a double-sided wiring board |
| 07/27/2004 | CA2307922C Surface-mount electrical connection device |
| 07/22/2004 | WO2004062335A1 Multichip module including substrate with an array of interconnect structures |
| 07/22/2004 | WO2004062037A2 Connector and printed circuit board for reducing cross-talk |
| 07/22/2004 | WO2004062025A1 Edge plated transmission line |
| 07/22/2004 | WO2004061960A2 Semiconductor device power interconnect striping |
| 07/22/2004 | WO2004061955A1 Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefrom |
| 07/22/2004 | WO2004061905A2 A method for forming ceramic film capacitors |
| 07/22/2004 | WO2004061880A1 Method for manufacturing multilayer electronic component |
| 07/22/2004 | WO2004061762A1 A tamper-indicating rfid antenna |
| 07/22/2004 | WO2004061347A2 Method and apparatus for transferring material to a substrate |
| 07/22/2004 | WO2004061164A1 Work transfer device for immerse transfer electroplating apparatus |
| 07/22/2004 | WO2004061149A1 Flexible frame for mounting a deposition mask |
| 07/22/2004 | WO2004061036A1 Thermally-formable and cross-linkable precursor of a thermally conductive material |
| 07/22/2004 | WO2004061006A1 Photocurable thermosetting conductive composition, conductive circuit formed from the conductive composition, and method of forming the same |
| 07/22/2004 | WO2004060983A1 Method for modifying the surface of a polymeric substrate |
| 07/22/2004 | WO2004060660A1 Sheet material and wiring board |
| 07/22/2004 | WO2004060619A1 Sheet-cutting apparatus |
| 07/22/2004 | WO2004060604A1 Mixed alloy lead-free solder paste |
| 07/22/2004 | WO2004060586A1 Compositions and methods for cleaning contaminated articles |
| 07/22/2004 | WO2004060579A1 Direct writing of metallic conductor patterns on insulating surfaces |
| 07/22/2004 | WO2004049070A3 Photosensitive resin composition comprising a halogen-free colorant |
| 07/22/2004 | US20040142603 Attachable modular electronic systems |
| 07/22/2004 | US20040142583 Spring interconnect structures |
| 07/22/2004 | US20040142556 Photoimageable ink is patterned to expose deposition sites on traces, within which are formed electroconductive fingers; integrated circuits |