| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/04/2004 | CN1160765C Method and device for mfg. electronic parts |
| 08/04/2004 | CN1160742C Resistor and method of producing the same |
| 08/04/2004 | CN1160588C Flexible wiring base plate, electrooptical apparatus and electronic aparatus |
| 08/03/2004 | US6771807 Method and system for detecting defects on a printed circuit board |
| 08/03/2004 | US6771805 Perspective viewing inspection system |
| 08/03/2004 | US6771505 Power electronics unit |
| 08/03/2004 | US6771486 Storage cell for surface mounting |
| 08/03/2004 | US6771485 Ceramic electronic device, paste coating method, and paste coating apparatus |
| 08/03/2004 | US6771470 Magnetic head assembly having a rotational arm for electrically connecting the magnetic head to an external circuit and methods of manufacturing the same |
| 08/03/2004 | US6771348 Displaying substrate and liquid crystal display device having the same |
| 08/03/2004 | US6771244 Display apparatus and assembly of its driving circuit |
| 08/03/2004 | US6770978 Metal line, method for fabricating the metal line, thin film transistor employing the metal line and display device |
| 08/03/2004 | US6770976 Process for manufacturing copper foil on a metal carrier substrate |
| 08/03/2004 | US6770970 High-frequency module, method of manufacturing thereof and method of molding resin |
| 08/03/2004 | US6770969 High performance capacitor |
| 08/03/2004 | US6770956 Sensor circuit module and electronic device using the same |
| 08/03/2004 | US6770955 Shielded antenna in a semiconductor package |
| 08/03/2004 | US6770866 Direct pattern writer |
| 08/03/2004 | US6770843 Laser processing apparatus and method |
| 08/03/2004 | US6770837 Method for connecting a printed circuit to a liquid crystal display |
| 08/03/2004 | US6770822 High frequency device packages and methods |
| 08/03/2004 | US6770510 Flip chip process of flux-less no-flow underfill |
| 08/03/2004 | US6770493 Integrated circuit package capable of operating in multiple orientations |
| 08/03/2004 | US6770421 Photo- or heat-curable resin composition and multilayer printed wiring board |
| 08/03/2004 | US6770380 Resin/copper/metal laminate and method of producing same |
| 08/03/2004 | US6770337 Thermal transfer element is configured and arranged for transfer of at least a portion of microstructured layer to receptor while preserving microstructured features of that portion |
| 08/03/2004 | US6770326 Comprises polysiloxane gel and fillers (aluminum oxide, zinc oxide, and boron nitride) for encapsulating electronic circuitry |
| 08/03/2004 | US6770319 Imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance |
| 08/03/2004 | US6770159 Method of fabricating an RF substrate with selected electrical properties |
| 08/03/2004 | US6770122 Heating, decomposition copper formate-organonitrogen complex |
| 08/03/2004 | US6769924 Electrical connector having a releasable cover |
| 08/03/2004 | US6769923 Fluted signal pin, cap, membrane, and stanchion for a ball grid array |
| 08/03/2004 | US6769921 Printed circuit board electromagnetic energy device |
| 08/03/2004 | US6769619 Electronic module for chip card |
| 08/03/2004 | US6769599 Method and device for placing and remelting shaped pieces consisting of solder material |
| 08/03/2004 | US6769598 Method of connecting circuit boards |
| 08/03/2004 | US6769354 Position adjustment in laser-assisted pressing |
| 08/03/2004 | CA2327810C Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components |
| 07/30/2004 | CA2455024A1 Stacked chip electronic package having laminate carrier and method of making same |
| 07/30/2004 | CA2454971A1 Multi-chip electronic package having laminate carrier and method of making same |
| 07/29/2004 | WO2004064469A1 Board piece and composite wiring board using the board piece |
| 07/29/2004 | WO2004064468A1 Board piece, composite wiring board using the board piece, and openable/closable device |
| 07/29/2004 | WO2004064467A1 Multilayer wiring board, method for producing the same, and method for producing fiber reinforced resin board |
| 07/29/2004 | WO2004064466A1 High-frequency layered part and manufacturing method thereof |
| 07/29/2004 | WO2004064465A1 Circuit board and process for producing the same |
| 07/29/2004 | WO2004064198A2 Cover for ball-grid array connector |
| 07/29/2004 | WO2004064162A1 Wiring substrate and radiation detector using same |
| 07/29/2004 | WO2004064150A1 Method for manufacturing electronic component mount board and electronic mount board manufactured by this method |
| 07/29/2004 | WO2004064143A1 Method of microelectrode connection and connected structure of use threof |
| 07/29/2004 | WO2004064142A1 Semiconductor device and process for producing the same |
| 07/29/2004 | WO2004063733A1 Image recognition apparatus and image recognition method |
| 07/29/2004 | WO2004063415A2 Methods for coating surfaces with metal and products made thereby |
| 07/29/2004 | WO2004063302A2 High temperature resistant films and adhesive articles made therefrom |
| 07/29/2004 | WO2004062909A1 Bonding sheet and one-side metal-clad laminate |
| 07/29/2004 | WO2004062843A2 Universal remover for electronic components and unsoldering paste for removing surface mount electronics components |
| 07/29/2004 | WO2004062477A2 Improved surface for use on implantable device |
| 07/29/2004 | WO2004022351A3 Method and apparatus for releasing materials from stencils |
| 07/29/2004 | WO2003105063A3 Method for manufacturing rfid labels |
| 07/29/2004 | WO2003081641A3 Support clip |
| 07/29/2004 | WO2003074601A3 Printing of organic conductive polymers containing additives |
| 07/29/2004 | WO2003073356A8 Memory module assembly using partially defective chips |
| 07/29/2004 | US20040148582 Placement/net wiring processing system |
| 07/29/2004 | US20040148581 Layout check system |
| 07/29/2004 | US20040147765 Processes for preparing of 3,4-alkylenedioxythiophenes and 3,4-dialkoxythiophenes |
| 07/29/2004 | US20040147658 Resin containing dielectric filler for formation of built-in capactor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler, and process for producing copper double clad laminate |
| 07/29/2004 | US20040147656 Heat shields; mixture of oxide in silicone resin |
| 07/29/2004 | US20040147145 Straddle-mount electrical connector |
| 07/29/2004 | US20040147062 Filling plugs through chemical mechanical polish |
| 07/29/2004 | US20040147060 Ball grid array package having improved reliability and method of manufacturing the same |
| 07/29/2004 | US20040146659 Applying electrical potentials between electrode plates; reducing static electricity; transferring particles |
| 07/29/2004 | US20040146452 Electromagnetic wave absorption material and an associated device |
| 07/29/2004 | US20040146195 Printing inspection apparatus, printing inspection method, printing inspection data generating apparatus, and printing inspection data generating method |
| 07/29/2004 | US20040145880 Electronic equipment provided with wiring board into which press-fit terminals are press-fitted |
| 07/29/2004 | US20040145874 Method, system, and apparatus for embedding circuits |
| 07/29/2004 | US20040145873 Printed circuit board with opto-via holes and process of forming the opto-via holes |
| 07/29/2004 | US20040145858 Multilayer circuit board, manufacturing method therefor, electronic device, and electronic apparatus |
| 07/29/2004 | US20040145089 polymer Thick Film ("PTF") laminate; especially encapsulating UV-cured urethane electroluminescent layers with cured urethane envelope layers; multi-function layers enable design of conductive pathways, active zones and insulating zones |
| 07/29/2004 | US20040145064 heat-resisting sheet having of holes,.each containing a solder ball held to the interior of the hole by an adherent layer, preventing the balls from dropping upon application of a shock or shaking; holes may be formed by laser machining |
| 07/29/2004 | US20040145054 Components, methods and assemblies for stacked packages |
| 07/29/2004 | US20040145046 Power module and method of manufacturing the same |
| 07/29/2004 | US20040145043 Semiconductor device and semiconductor assembly module |
| 07/29/2004 | US20040144989 Light emitting diode and method for producing it |
| 07/29/2004 | US20040144834 Apparatus and method for aligning and attaching solder columns to a substrate |
| 07/29/2004 | US20040144829 Method of soldering lead-free solder, and joined object soldered by the soldering method |
| 07/29/2004 | US20040144564 Multi-layer back-plane |
| 07/29/2004 | US20040144563 Novel bonding structure for a hard disk drive suspension using anisotropic conductive film |
| 07/29/2004 | US20040144561 Metal/ceramic bonding substrate and method for producing same |
| 07/29/2004 | US20040144476 Resistor and, or capacitor on cermic core; firing, trimming; controlling sintering temperature |
| 07/29/2004 | US20040143959 System and method for improving suspension-to-slider attachment in a hard disk drive |
| 07/29/2004 | DE10302923A1 Electronic component group, e.g. for control for processing measuring signals and function of modules and component in car industry, containing printed circuit board with conductive path structure |
| 07/29/2004 | DE10302922A1 Electronic component group e.g. for controls for processing measuring signals and/or for controlling certain functions or components etc., containing printed circuit board |
| 07/29/2004 | DE10302921A1 Connection of flexible electrical ribbon cables to electronic circuit boards uses through hole connection inserts |
| 07/29/2004 | DE10301479A1 Printed circuit board junction box installed in vehicle, has wiring pattern and auxiliary metal pattern having bus bar and metal traces, that allow current to flow through electrical terminals mounted in board |
| 07/29/2004 | DE10300831A1 Stanzeinrichtung für Green Sheets Punching device for Green Sheets |
| 07/29/2004 | DE10300818A1 Stanzwerkzeug mit wieder verwendbaren, neutralen Baugruppen Punch with reusable, neutral assemblies |
| 07/29/2004 | DE10300768A1 Anschlussvorrichtung für die Verbindung einer mehradrigen Anschlussleitung mit einer in einem Gehäuse unterbringbaren Leiterplatte Connection device for connecting a multiconductor cable connection with a unterbringbaren in a housing board |
| 07/29/2004 | DE10009974B4 Vorrichtung und Verfahren zum Heraustrennen von Einzelleiterplatten aus Mehrfachnutzen Apparatus and method for separating out individual circuit boards from multiple benefits |
| 07/29/2004 | CA2512954A1 Improved surface for use on implantable device |
| 07/29/2004 | CA2512768A1 High temperature resistant films and adhesive articles made therefrom |
| 07/28/2004 | EP1441417A2 High density connector and method of manufacture |