| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/05/2004 | US20040151080 Magneto-optical head and magneto-optical storage device |
| 08/05/2004 | US20040151014 Method of forming an electronic device |
| 08/05/2004 | US20040150978 Wire management system |
| 08/05/2004 | US20040150977 Ball grid array package with an electromagnetic shield connected directly to a printed circuit board |
| 08/05/2004 | US20040150974 Mounting structure for ball grid array type IC |
| 08/05/2004 | US20040150970 Impedance matching of differential pair signal traces on printed wiring boards |
| 08/05/2004 | US20040150969 High speed circuit board and method for fabrication |
| 08/05/2004 | US20040150967 Underfill film for printed wiring assemblies |
| 08/05/2004 | US20040150966 Integrated library core for embedded passive components and method for forming electronic device thereon |
| 08/05/2004 | US20040150931 Control device |
| 08/05/2004 | US20040150798 Fixing structure for light valve |
| 08/05/2004 | US20040150714 Optical-enhanced apparatus and method for illuminating printed circuit boards for inspection |
| 08/05/2004 | US20040150487 Semi-suspended coplanar waveguide on a printed circuit board |
| 08/05/2004 | US20040150409 Circuit pattern inspection apparatus, circuit pattern inspection method, and recording medium |
| 08/05/2004 | US20040150129 Using cured rubber elastomer printing stamp; saturated with helium |
| 08/05/2004 | US20040150116 Thermal enhance MCM package |
| 08/05/2004 | US20040150114 Multi-chip electronic package having laminate carrier and method of making same |
| 08/05/2004 | US20040150106 Selectively coating bond pads |
| 08/05/2004 | US20040150105 Contact structure for reliable metallic interconnection |
| 08/05/2004 | US20040150101 Information handling system |
| 08/05/2004 | US20040150095 Multilayer; carrier and semiconductive chips; electroconductive and dielectric layers |
| 08/05/2004 | US20040150080 Wire bonding pad for semiconductor chips |
| 08/05/2004 | US20040149863 Wire management system |
| 08/05/2004 | US20040149813 Method of making reactive multilayer foil |
| 08/05/2004 | US20040149812 Solder bump transfer sheet, method for producing the same, and methods for fabricating semiconductor device and printed board |
| 08/05/2004 | US20040149805 Solder ball dispenser |
| 08/05/2004 | US20040149804 System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication |
| 08/05/2004 | US20040149689 Method for producing metal/ceramic bonding substrate |
| 08/05/2004 | US20040149681 includes a substrate made of a glassfiber reinforced epoxy resin material and the permanent solder mask has an even and smooth outer surface |
| 08/05/2004 | US20040149585 Electroplating copper bottom layer, depositing insulation pattern and forming permeable core; adding polyimide vias and insulation then filling; forming top metal lines staggered with bottom lines and topping with protective layer |
| 08/05/2004 | US20040149490 Coaxial via hole and process of fabricating the same |
| 08/05/2004 | US20040149489 Electronic module and method for assembling same |
| 08/05/2004 | US20040149488 Flat flex cable |
| 08/05/2004 | US20040149479 Polymer-embedded solder bumps for reliable plastic package attachment |
| 08/05/2004 | US20040149377 Method of applying an edge electrode pattern to a touch screen |
| 08/05/2004 | US20040149373 Method of bonding a first body to a second body |
| 08/05/2004 | US20040149372 Method of connecting semiconductor or microelectronic device to a substrate |
| 08/05/2004 | US20040149167 Improved adhesion; for high-frequency-adaptable substrate |
| 08/05/2004 | US20040149151 Apparatus and method of screen printing |
| 08/05/2004 | US20040149084 Oxidation resistant protective coating is formed; fluxless |
| 08/05/2004 | US20040148772 Method for packaging an injection-molded image sensor |
| 08/05/2004 | US20040148770 Method for producing printed wiring boards |
| 08/05/2004 | US20040148766 Multi-layer circuit board and method for manufacturing same |
| 08/05/2004 | US20040148765 Electronic package repair process |
| 08/05/2004 | US20040148756 Alignment plate with matched thermal coefficient of expansion |
| 08/05/2004 | DE10317403A1 Verfahren zur Verklebung von FPCB's A method for bonding FPCB's |
| 08/05/2004 | DE10303294A1 Connector for electric or electronic implement, e.g. smoke alarm, radio, compact disc player, shaver etc., supplied selectively from battery or network adapter, via intermediate decoupling diodes, containing extra circuit board |
| 08/05/2004 | DE10303009A1 Elektronisches Bauelement Electronic component |
| 08/05/2004 | DE10302104A1 Verfahren zum Herstellen von Schaltungsträgern mit intergrierten passiven Bauelementen A method for manufacturing of circuit carriers with integrated passive components |
| 08/05/2004 | DE10301480A1 Manufacturing pins, especially for semiconducting components, involves coating pin or section of pin with separate metal coating only after final stamping out of pin from base body |
| 08/05/2004 | DE102004003048A1 Elektrisches Verbindungselement, insbesondere für Elektrowerkzeugschalter An electrical connection element, in particular for power tool switches |
| 08/04/2004 | EP1443811A2 High speed circuit board and method for fabrication |
| 08/04/2004 | EP1443810A1 Multilayer backplane with vias for pin connection |
| 08/04/2004 | EP1443809A2 Electronic circuit unit and method for manufacturing the same |
| 08/04/2004 | EP1443666A2 Multiband high-frequency switching module |
| 08/04/2004 | EP1443619A1 Stripping of flat conductors |
| 08/04/2004 | EP1443561A2 Stacked chip electronic package having laminate carrier and method of making same |
| 08/04/2004 | EP1443560A2 Multi-chip electronic package having laminate carrier and method of making same |
| 08/04/2004 | EP1443555A2 Semiconductor device and method of manufacturing the same |
| 08/04/2004 | EP1443548A2 Composite metal column for mounting semiconductor device |
| 08/04/2004 | EP1443529A1 Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module |
| 08/04/2004 | EP1442647A1 System and method for rapid alignment and accurate placement of electronic components on a printed circuit board |
| 08/04/2004 | EP1442642A1 Method for the selective surface treatment of planar workpieces |
| 08/04/2004 | EP1442641A1 Field decoupling capacitor |
| 08/04/2004 | EP1442503A1 Assembly comprised of a panel-like constructed module and of a connection unit, production method and device |
| 08/04/2004 | EP1442463A1 Multilayer circuit and method of manufacturing |
| 08/04/2004 | EP1442344A2 Method and device for treating objects by means of a liquid |
| 08/04/2004 | EP1442155A2 Method for the treatment of electrically conductive substrates and printed circuit boards and the like |
| 08/04/2004 | EP1441864A1 Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles |
| 08/04/2004 | EP1390568B1 Direct electrolytic metallization of non-conducting substrates |
| 08/04/2004 | EP1371273B1 Laminate comprised of flat conductor elements |
| 08/04/2004 | EP1145374B1 Remote entry integrally molded transmitter |
| 08/04/2004 | EP1121799A4 Image sensor mounted by mass reflow |
| 08/04/2004 | EP0792462B1 Probe card assembly and method of using the same |
| 08/04/2004 | CN2629853Y Carrying tool cleaning cabinet |
| 08/04/2004 | CN1518851A Method for assembly and/or disassembly of electronic module on application card, corresponding method for producing and mechanical fixing clip |
| 08/04/2004 | CN1518850A Conductor track structures and method for production thereof |
| 08/04/2004 | CN1518767A Low profile integrated module interconnects |
| 08/04/2004 | CN1518763A Extension of fatigue life for C4 solder ball in chip to substrate connection |
| 08/04/2004 | CN1518745A Material and method for making electroconductive pattern |
| 08/04/2004 | CN1518496A Laminated plate and part using laminated plate |
| 08/04/2004 | CN1518404A Electric paste etching method |
| 08/04/2004 | CN1518403A Using method of grouping element in wiring layout |
| 08/04/2004 | CN1518402A Joint area pattern structure and substrate for mounting electric assembly |
| 08/04/2004 | CN1518340A Camera assembly and its manufacturing method |
| 08/04/2004 | CN1518208A Crystal oscillating device and electronic equipment using the device |
| 08/04/2004 | CN1518105A Semiconductor chip, semiconductor wafer and semiconductor device and its manufacturing method |
| 08/04/2004 | CN1518084A Method and device for arraging and connecting solder post on sustrate |
| 08/04/2004 | CN1518083A Thin film type carrier band for mounting electronic device and final defect labelling method of using the carrier band |
| 08/04/2004 | CN1518080A Electronic element packaging structure and its manufacturing method |
| 08/04/2004 | CN1518078A Wiring substrate and its manufacturing method, semiconductor device, electronic module and electronic instrument |
| 08/04/2004 | CN1517749A Flexible electronic device and its manufacturing method |
| 08/04/2004 | CN1517702A Appearance detector and appearance detection method |
| 08/04/2004 | CN1161010C Method for producing interconnections with electrically conductive cross connections between top and bottom part of substrate and interconnections having such cross connections on substrate |
| 08/04/2004 | CN1160944C Linearity correction coil device and video display apparatus using the same |
| 08/04/2004 | CN1160854C Squelch filter for power converter |
| 08/04/2004 | CN1160848C Predistortion generator coupled with FR amplifier |
| 08/04/2004 | CN1160833C Electric connector and its electric element |
| 08/04/2004 | CN1160787C Package for electronic component |
| 08/04/2004 | CN1160781C Discrete semiconductor device and method for producing the same |