Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/2004
08/11/2004CN1519904A Casing. esp. for semiconductor device, foot of such semiconductor device and mfg. method of such foot
08/11/2004CN1519903A Printing apptsl for conductive material, cleaning method of printing mask, and cleaning program of printing mask
08/11/2004CN1519867A Inductive components, laminated electronic components, laminated electronic components modulars and method for mfg. these components and modulars
08/11/2004CN1519795A Wiring substrate and electrooptic device and their mfg. method
08/11/2004CN1519570A Measured reault displaying system for printed circuit substrate, and measured result displaying method
08/11/2004CN1519292A Potting material for electronic components
08/11/2004CN1519077A Welding method and method of preparing component mounting board
08/11/2004CN1519076A Welding method, component connection welded by such welding method and connection structure
08/11/2004CN1519075A Laser working equipment and laser working method
08/11/2004CN1162060C Method for producing multi-layer printed wiring boards having blind vias
08/11/2004CN1162059C Apparatus for mfg. adhesive layer, apparatus for mfg. double-sided substrate, and apparatus for mfg. multi-layered substrate
08/11/2004CN1162057C 电子部件 Electronic components
08/11/2004CN1162056C 印刷线路板 Printed circuit boards
08/11/2004CN1161838C Package substrate
08/11/2004CN1161835C Semiconductor device and making method thereof
08/11/2004CN1161833C Mfg. method of elctronic components
08/11/2004CN1161242C Picture composition method, device, template and method for making same
08/11/2004CN1161228C Resin-coated composite foil, production thereof, and productions of multilayer copper-clad laminate and multilayer printed wiring board using sesin-coated composite foil
08/11/2004CN1161207C Non-lead solder powder, non-lead solder paste and its prepn. method
08/11/2004CN1161206C Flux composition
08/11/2004CN1161203C Laser machining apparatus
08/10/2004US6775151 Structure for mounting an electronic circuit unit
08/10/2004US6775150 Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
08/10/2004US6775149 Multichip mounted structure, electro-optical apparatus, and electronic apparatus
08/10/2004US6775146 Laminated printed circuit board fixture assembly and method
08/10/2004US6775122 Circuit board with added impedance
08/10/2004US6774931 Inspection method and device by movement of the field of view of the camera
08/10/2004US6774745 Activation layer controlled variable impedance transmission line
08/10/2004US6774650 Probe card and method of testing wafer having a plurality of semiconductor devices
08/10/2004US6774640 Substrate having reference point connected with layer being evaluated for shift of inner layer traces, and test points at distance from reference point; measuring presence of short between reference and test points indicates amount of shift
08/10/2004US6774500 Substrate for semiconductor device, semiconductor chip mounting substrate, semiconductor device and method of fabrication thereof, and circuit board, together with electronic equipment
08/10/2004US6774493 Integrated circuit coated with thermosetting polymer, with hardened adhesive polymer underfill encapsulant including intermixed reaction product of thermosetting polymer and fluxing agent that chemically immobilizes flux and by-products
08/10/2004US6774490 Electronic device
08/10/2004US6774486 Circuit boards containing vias and methods for producing same
08/10/2004US6774483 Semiconductor assembly with a semiconductor module
08/10/2004US6774474 Partially captured oriented interconnections for BGA packages and a method of forming the interconnections
08/10/2004US6774327 Hermetic seals for electronic components
08/10/2004US6774316 Wiring board and production method thereof
08/10/2004US6774315 Floating interposer
08/10/2004US6774314 Electronic device and coupler
08/10/2004US6774310 Surface mount connector lead
08/10/2004US6774021 Pattern forming method and pattern forming device
08/10/2004US6773960 Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate
08/10/2004US6773957 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures
08/10/2004US6773938 Probe card, e.g., for testing microelectronic components, and methods for making same
08/10/2004US6773935 Confocal 3D inspection system and process
08/10/2004US6773855 Printed circuit board having a solder resist film formed from the cured film
08/10/2004US6773827 Multilayer exterior electrodes
08/10/2004US6773809 Copper foil with insulating adhesive
08/10/2004US6773760 Method for metallizing surfaces of substrates
08/10/2004US6773757 Silver plate has a lower tendency to electromigrate than the same silver plate without the treatment with polymer coating
08/10/2004US6773573 Plating bath and method for depositing a metal layer on a substrate
08/10/2004US6773572 Overcoating porous resin; plating; semiconductor
08/10/2004US6773568 Metal alloy compositions and plating methods related thereto
08/10/2004US6773533 Manufacturing method of ceramic green sheet, manufacturing method of multilayer ceramic electronic components, and carrier sheet for ceramic green sheets
08/10/2004US6773269 Circuit board assembly which utilizes a pin assembly and techniques for making the same
08/10/2004US6773267 Electronic assembly having a removable power supply
08/10/2004US6773084 Printing chip for a printing head working according to the ink-jet printing principle
08/10/2004US6772937 Screen printing
08/10/2004US6772936 Method for making an electroconductive joint
08/10/2004US6772515 Method of producing multilayer printed wiring board
08/10/2004US6772514 Method of machining glass substrate and method fabricating high-frequency circuit
08/10/2004US6772511 Method for producing a semiconductor device
08/05/2004WO2004066699A1 Multi-layer ceramic substrate and method for manufacture thereof
08/05/2004WO2004066698A1 Method for manufacturing substrate, release sheet, substrate manufacturing apparatus and method for manufacturing substrate using same
08/05/2004WO2004066697A1 Multilayer printed wiring board and process for producing the same
08/05/2004WO2004066696A1 Electrical connection element, especially for electric tool switches
08/05/2004WO2004066695A1 Electronic substrate printing
08/05/2004WO2004066694A1 Member for circuit board, method for manufacturing circuit board, apparatus for manufacturing circuit board
08/05/2004WO2004066692A1 Placement of a camera module in a portable device
08/05/2004WO2004066691A1 Circuit board device and method for interconnecting wiring boards
08/05/2004WO2004066690A1 Microconnector for fpc connection and method of producing the same
08/05/2004WO2004066444A1 A tile for an antenna array
08/05/2004WO2004066364A2 Binder diffusion patterning of a thick film paste layer
08/05/2004WO2004066316A1 Conductive paste, method for producing same, circuit board using such conductive paste and method for producing same
08/05/2004WO2004065843A2 Seat buckle sensor
08/05/2004WO2004065665A1 Method and devices for electrochemical treatment of articles
08/05/2004WO2004065660A1 Metal photo-etching product and production method therefor
08/05/2004WO2004065118A1 Poly(phenylene ether)-polyvinyl thermosetting adhesives, films, and substrates made therefrom
08/05/2004WO2004065050A2 Method and system for solder connecting electrical devices
08/05/2004WO2004065027A1 Iced film substrate cleaning
08/05/2004WO2004064965A1 Transmitter for wireless control
08/05/2004WO2004034427B1 Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials
08/05/2004WO2004004017A3 Surface-mountable light-emitting diode and/or photodiode and method for the production thereof
08/05/2004WO2002029137A3 Method and associated apparatus for tilting a substrate upon entry for metal deposition
08/05/2004US20040153988 Placement/net wiring processing system
08/05/2004US20040152349 Terminal pin
08/05/2004US20040152348 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
08/05/2004US20040152345 Process for applying conductor tracks to the surface of plastics moldings, and the resultant moldings
08/05/2004US20040152313 Low species buffered rinsing fluids and methods
08/05/2004US20040152238 Flip chip interconnection using no-clean flux
08/05/2004US20040152234 Circuit device manufacturing method
08/05/2004US20040151978 Method and apparatus for direct-write of functional materials with a controlled orientation
08/05/2004US20040151941 Multilayer; pressing layers; heat conductive metallic core with coating; cold plating; surface hardness
08/05/2004US20040151939 Reactive multilayer foil with conductive and nonconductive final products
08/05/2004US20040151893 Low temperature method and composition for producing electrical conductors
08/05/2004US20040151884 Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
08/05/2004US20040151883 Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
08/05/2004US20040151882 Wiring board with core layer containing inorganic filler
08/05/2004US20040151400 Method and apparatus for recording jag-free image