| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/17/2004 | CA2100053C Cleaning agent |
| 08/12/2004 | WO2004068923A1 Metal core multilayer printed wiring board |
| 08/12/2004 | WO2004068922A1 Multilayer printed board, electronic apparatus, and packaging method |
| 08/12/2004 | WO2004068921A2 Electronic component |
| 08/12/2004 | WO2004068920A1 Heat dissipating arrangement for an electronic appliance |
| 08/12/2004 | WO2004068918A2 Method for producing thin silver layers |
| 08/12/2004 | WO2004068642A1 Conductive terminal and the electrical connector using the conductive terminal |
| 08/12/2004 | WO2004068641A1 Conductive terminal and the electrical connector using the conductive terminal |
| 08/12/2004 | WO2004068640A1 Conductive terminal and the electrical connector using the conductive terminal |
| 08/12/2004 | WO2004068560A2 Area array package with non-electrically connected solder balls |
| 08/12/2004 | WO2004068533A2 Method for producing an electronic module |
| 08/12/2004 | WO2004068516A1 Method of producing ceramic green sheet and method of producing electronic component using this ceramic green sheet |
| 08/12/2004 | WO2004068506A1 Conductive paste |
| 08/12/2004 | WO2004068389A2 Method of forming a conductive metal region on a substrate |
| 08/12/2004 | WO2004067806A1 Stencil manufacture |
| 08/12/2004 | WO2004067665A1 Method for gluing fpcb’s |
| 08/12/2004 | WO2004067664A1 Thermo-activated adhesive material for fpcb agglutinations |
| 08/12/2004 | WO2004067631A1 Resin composition, cured resin, cured resin sheet, laminate, prepreg, electronic part, and multilayer substrate |
| 08/12/2004 | WO2004067600A1 Electronic material composition, electronic product and method of using electronic material composition |
| 08/12/2004 | WO2004067362A1 Stanchion with an integrated device for securing a load, in particular for tarpaulin-covered transport vehicles |
| 08/12/2004 | US20040158450 Solder joint life prediction method |
| 08/12/2004 | US20040158023 Halogen-free resin composition |
| 08/12/2004 | US20040157974 Printing ink resist composition, method of forming resist film thereof, and method of producing substrate using the same |
| 08/12/2004 | US20040157482 Connector |
| 08/12/2004 | US20040157411 Integrated circuit package separator methods |
| 08/12/2004 | US20040157369 Underfilling process in a molded matrix array package using flow front modifying solder resist |
| 08/12/2004 | US20040157080 Copper foil for fine pattern printed circuits and method of production of same |
| 08/12/2004 | US20040156741 Tin-zinc lead-free solder, its mixture, and solder-joined part |
| 08/12/2004 | US20040156740 improved environmental safety |
| 08/12/2004 | US20040156583 Circuit board and circuit board connection structure |
| 08/12/2004 | US20040156533 Land appearance inspecting device, and land appearance inspecting method |
| 08/12/2004 | US20040156213 LED lamp for vehicle signal light |
| 08/12/2004 | US20040156178 Radio frequency device |
| 08/12/2004 | US20040156175 Heat dissipating structure of printed circuit board and fabricating method thereof |
| 08/12/2004 | US20040156174 System and method for dissipating heat from an electronic board |
| 08/12/2004 | US20040156028 Both side projection exposure apparatus |
| 08/12/2004 | US20040155931 Liquid jet recording head |
| 08/12/2004 | US20040155927 Liquid drop discharger, test chip processor, printer device, method of discharging liquid drop and printing method, method of processing test chip, method of producing organic electroluminescent panel, method of forming conductive pattern, and method of producing field emission display |
| 08/12/2004 | US20040155734 High frequency module |
| 08/12/2004 | US20040155724 Microwave device having a slotted coaxial cable-to-microstrip connection and related methods |
| 08/12/2004 | US20040155717 Crystal oscillator device and electronic apparatus using the same |
| 08/12/2004 | US20040155712 High-frequency circuit |
| 08/12/2004 | US20040155560 Vibrator support structure and manufacturing method for the support structure |
| 08/12/2004 | US20040155356 Ceramic circuit board and method for manufacturing the same |
| 08/12/2004 | US20040155336 Soldering method, component to be joined by the soldering method, and joining structure |
| 08/12/2004 | US20040155324 Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device |
| 08/12/2004 | US20040155323 Semiconductor device |
| 08/12/2004 | US20040155318 plurality of contiguous semiconductor devices each separated by a scribe lane; signal line; and a plurality of electrical connections, each electrically coupling a different semiconductor devices to said signal line |
| 08/12/2004 | US20040155308 Board level shield |
| 08/12/2004 | US20040155227 Conductive paste, article produced therewith with a conductive coating on glass, ceramic or enameled steel and method for the production thereof |
| 08/12/2004 | US20040155097 Soldering method and method for manufacturing component mounting board |
| 08/12/2004 | US20040155018 Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device |
| 08/12/2004 | US20040154930 Copper foil for high frequency circuit and method of production of same |
| 08/12/2004 | US20040154830 Ceramic circuit board and method for manufacturing the same |
| 08/12/2004 | US20040154828 Method and electrode for defining and replicating structures in conducting materials |
| 08/12/2004 | US20040154827 Plated via interposer and method of making |
| 08/12/2004 | US20040154726 Photoreactive resin composition, method for making circuit substrate using same, and method for making ceramic multilayer substrate using same |
| 08/12/2004 | US20040154530 Configuration and a method for reducing contamination with particles on a substrate in a process tool |
| 08/12/2004 | US20040154529 Substrate holder, method for producing substrate holder, and method for producing mold |
| 08/12/2004 | US20040154451 Integrated circuit package separators |
| 08/12/2004 | US20040154166 Masking; selective exposure; surface patterns; electrically connecting circuits; preventing damage; filling spacing with solder photoresist; grinding; plating |
| 08/12/2004 | US20040154162 Method for interconnecting multi-layer printed circuit board |
| 08/12/2004 | DE202004009138U1 Stanzeinrichtung und Stanzstempel für diese Punch and punch for this |
| 08/12/2004 | DE202004004260U1 Circuit plate for installation of light bulbs in an automobile is produced as a copper coated metal pressing |
| 08/12/2004 | DE202004003701U1 Flacher Transponder Flat transponder |
| 08/12/2004 | DE10361643A1 Verfahren zum Herstellen von Leiterplatten mit geschützten Zwischenräumen zwischen Spuren A method of producing printed circuit boards with protected spaces between traces |
| 08/12/2004 | DE10301682A1 Fastening high power shunt-resistance foil onto ceramic substrate, employs bonding agent forming intermetallic phase |
| 08/12/2004 | DE102004004612A1 Harzfilm und mehrlagige Leiterplatte unter Verwendung desselben Of the same resin film and multilayer printed circuit board using |
| 08/12/2004 | DE102004004279A1 Vorrichtung und Verfahren zum korrektiven Löten Apparatus and method for corrective soldering |
| 08/12/2004 | DE10196930T5 Elektroplattierungschemie zum Füllen von Submikro-Merkmalen von VLSI/ULSI Verbindungen mit Kupfer Elektroplattierungschemie for filling sub-micron features of VLSI / ULSI compounds with copper |
| 08/12/2004 | DE10059139B4 Verwendung einer organischen Schwefelverbindung in einem sauren Elektrolyten zur Abscheidung von Zinn-Kupfer-Legierung Use of an organic sulfur compound in an acidic electrolyte for deposition of tin-copper alloy |
| 08/12/2004 | CA2514265A1 Stencil manufacture |
| 08/11/2004 | EP1446000A1 A shield can for shielding electronics components on a PWB |
| 08/11/2004 | EP1445999A1 A method of providing a PWB with a shield can and a PWB therefor |
| 08/11/2004 | EP1445998A1 A shield can for shielding electronic components on a PWB |
| 08/11/2004 | EP1445996A2 Build-up multilayer printed circuit board |
| 08/11/2004 | EP1445995A1 Method of mounting an electronic component on a circuit board |
| 08/11/2004 | EP1445994A1 WIRING BOARD SHEET AND ITS MANUFACTURING METHOD, MULTILAYER BOARD, AND ITS MANUFACTURNG METHOD |
| 08/11/2004 | EP1445795A2 Methof of manufacturing a circuit carrier with integrated passive circuit elements |
| 08/11/2004 | EP1445620A1 Wafer-level burn-in or testing method using a burn-in or test cartridge |
| 08/11/2004 | EP1445347A1 Method of plating nonconductor product |
| 08/11/2004 | EP1444728A1 Method for producing a protection for chip edges and system for the protection of chip edges |
| 08/11/2004 | EP1444549A2 Method of patterning electrically conductive polymers |
| 08/11/2004 | EP1444284A2 Planarized microelectronic substrates |
| 08/11/2004 | EP1444055A1 Tape compositions for the deposition of electronic features |
| 08/11/2004 | EP1161469B1 Thermally reactive near infrared absorption polymer coatings, method of preparing and methods of use |
| 08/11/2004 | EP1023770A4 Surface mount lc filter with polymer layers |
| 08/11/2004 | CN2632997Y Rapid sliding positioner with adjustable angle |
| 08/11/2004 | CN2632989Y Cleaner of circuit board |
| 08/11/2004 | CN1520704A Core substrate, and multilayer circuit board using it |
| 08/11/2004 | CN1520703A Method for forming image on object surface including circuit substrate |
| 08/11/2004 | CN1520469A Surface treatment agent for copper and copper alloy |
| 08/11/2004 | CN1520448A Anisotropic conductive adhesives having enhanced viscosity and bondng methods and integrated circuit packages using same |
| 08/11/2004 | CN1520446A Water-dispersible resin compsn. for use in boring hole in printed wiring board, sheet comprising compsn., and method for boring hole in printed wiring board using sheet |
| 08/11/2004 | CN1520250A Method for mutually connecting multolayer printed circuit board |
| 08/11/2004 | CN1520249A Laser processing method, laser welding method and laser processor |
| 08/11/2004 | CN1520248A Method for setting up conducting terminals onto circuit board |
| 08/11/2004 | CN1520247A Welding method between electric components |
| 08/11/2004 | CN1520246A Serpentine composite drawing method for laying out circitry |
| 08/11/2004 | CN1519913A Plate for forming metal wires and method of forming metal wires using same |