| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/19/2004 | US20040159391 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus |
| 08/19/2004 | US20040159264 using an adhesion promoting composition of an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer for acid resistance such as inorganic (poly)sulfides, dialkyldithiocarbamates, and trithiocarbonates |
| 08/19/2004 | US20040159257 Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit |
| 08/19/2004 | US20040158980 Component built-in module and method for producing the same |
| 08/19/2004 | US20040158978 Molding method and mold for encapsulating both sides of PCB module with wafer level package mounted PCB |
| 08/19/2004 | DE202004008357U1 Sieve type printing template for solder printing, especially of SMD circuit boards or for wafer bumping, has a flexible template films with solder deposition holes and a rigid mask that supports the film outside the print area |
| 08/19/2004 | DE202004004980U1 Parallelspeisungsband und biegsames Leuchtband Parallel feed belt and flexible lighting tape |
| 08/19/2004 | CA2515408A1 Direct mount led lamp |
| 08/19/2004 | CA2515105A1 Templated cluster assembled wires |
| 08/18/2004 | EP1448037A2 Power module and method for producing the same |
| 08/18/2004 | EP1448036A1 Copper foil for fine pattern printed circuits and method of production same |
| 08/18/2004 | EP1448035A1 Chip-on-film use copper foil |
| 08/18/2004 | EP1448034A1 Method and device for mounting electronic component on circuit board |
| 08/18/2004 | EP1448033A1 Method and device for mounting electronic component on a circuit board |
| 08/18/2004 | EP1448032A2 Screen printing method and screen printing apparatus |
| 08/18/2004 | EP1447850A2 Electronic parts packaging structure and method of manufacturing the same |
| 08/18/2004 | EP1447846A2 Socket and method for connecting electronic components |
| 08/18/2004 | EP1447712A1 METHODS OF PRODUCING PHOTOSENSITIVE CERAMIC COMPOSITION AND MULTI−LAYER SUBSTRATE USING IT |
| 08/18/2004 | EP1447280A2 Vehicle electronic control unit |
| 08/18/2004 | EP1447214A1 Polyimide metal layered products and polyamideimide metal layered product |
| 08/18/2004 | EP1446993A1 I-channel surface-mount connector with extended flanges |
| 08/18/2004 | EP1446992A1 Method of forming a mask on a surface |
| 08/18/2004 | EP1446991A1 Circuit formation by laser ablation of ink |
| 08/18/2004 | EP1446990A1 Multilayer flexible fr4 circuit |
| 08/18/2004 | EP1446251A1 Highly filled composites of powdered fillers and polymer matrix |
| 08/18/2004 | EP1446238A2 Ultrasonic printed circuit board transducer |
| 08/18/2004 | EP1446237A2 Manufacture having double sided features in a metal-containing web formed by etching |
| 08/18/2004 | EP1325673B1 Printed circuit board and method for producing a printed circuit board of this type and for producing a laminar composite material for such a printed circuit board |
| 08/18/2004 | EP1295516B1 Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures |
| 08/18/2004 | EP1295337A4 Process for the manufacture of printed circuit boards with plated resistors |
| 08/18/2004 | EP1174006B1 Method for drilling circuit boards |
| 08/18/2004 | EP1150947B1 Method for producing alkanesulfonic acids |
| 08/18/2004 | EP0839439B1 Method for forming fiducial mark in resin stencil and stencil formed thereby |
| 08/18/2004 | CN1522481A Mechanical-contact adapter |
| 08/18/2004 | CN1522467A Using the wave soldering process to attach motherboard chipset heat sinks |
| 08/18/2004 | CN1522452A 电容器 Capacitors |
| 08/18/2004 | CN1522287A Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constitutents |
| 08/18/2004 | CN1522197A Partition plate and method for producing a partition plate for a multi-layer pressed stack |
| 08/18/2004 | CN1522187A Method for the calibration of the optical system on a laser machine for machining electrical circuit substrates |
| 08/18/2004 | CN1522185A Method of ablating an opening in a hard, non-metallic substrate |
| 08/18/2004 | CN1522105A Desmear and texturing method |
| 08/18/2004 | CN1522104A Vacuum porefilling method for printed circuit board and porefilling apparatus being used |
| 08/18/2004 | CN1521911A Terminal box and welding method for printed circuit board of terminal box |
| 08/18/2004 | CN1521884A High-frequency circuit |
| 08/18/2004 | CN1521847A Electronic parts packaging structure and method of manufacturing the same |
| 08/18/2004 | CN1521821A Manufacturing method for electronic component module and electromagnetically readable data carrier |
| 08/18/2004 | CN1521769A Formation of thin film resistors |
| 08/18/2004 | CN1521768A Formation of thin film resistors |
| 08/18/2004 | CN1520974A Punching tool with re-usable, neutral structural groups |
| 08/18/2004 | CN1163110C Vibrator holder |
| 08/18/2004 | CN1162942C Method for electrically connecting two sets of electrode terminals of arrays on electronic board unit |
| 08/18/2004 | CN1162904C 半导体器件 Semiconductor devices |
| 08/18/2004 | CN1162818C Indicator |
| 08/18/2004 | CN1162524C Water-based detergent composition for printed circuit board |
| 08/18/2004 | CN1162311C System for conveying and supporting sheets |
| 08/18/2004 | CN1162245C Laser processing device and its method |
| 08/18/2004 | CN1162225C Cleaning process |
| 08/17/2004 | US6778406 Resilient contact structures for interconnecting electronic devices |
| 08/17/2004 | US6778405 Power module adapter |
| 08/17/2004 | US6778404 Stackable ball grid array |
| 08/17/2004 | US6778403 Wiring board having terminal |
| 08/17/2004 | US6778247 Method for cutting tape carrier packages of a LCD and LCD structure |
| 08/17/2004 | US6778198 Glass substrate printed wiring board printhead for electric paper |
| 08/17/2004 | US6778142 Electronic device and a circuit arrangement |
| 08/17/2004 | US6778058 Embedded 3D coil inductors in a low temperature, co-fired ceramic substrate |
| 08/17/2004 | US6778043 Method and apparatus for adding inductance to printed circuits |
| 08/17/2004 | US6777821 Ball grid array x-ray orientation mark |
| 08/17/2004 | US6777804 Flip-chip package substrate |
| 08/17/2004 | US6777798 Stacked semiconductor device structure |
| 08/17/2004 | US6777794 Circuit mounting method, circuit mounted board, and semiconductor device |
| 08/17/2004 | US6777788 Method and structure for applying thick solder layer onto die attach pad |
| 08/17/2004 | US6777645 High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
| 08/17/2004 | US6777620 Circuit board |
| 08/17/2004 | US6777464 Circuit connecting material, and structure and method of connecting circuit terminal |
| 08/17/2004 | US6777314 Method of forming electrolytic contact pads including layers of copper, nickel, and gold |
| 08/17/2004 | US6777108 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil |
| 08/17/2004 | US6777105 Part |
| 08/17/2004 | US6777071 Electrical interconnect using locally conductive adhesive |
| 08/17/2004 | US6777036 Method for the deposition of materials from mesomorphous films |
| 08/17/2004 | US6776928 Powder coating; containing metallic fibers; antistatic agent |
| 08/17/2004 | US6776893 Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
| 08/17/2004 | US6776864 Plastic lab-on-a-chip system fabricated by coupling a plastic substrate having a metal pattern with another plastic substrate in a reversible or irreversible way. |
| 08/17/2004 | US6776862 Improvements in densification of a multilayered ceramic board fabricated by a so-called ?non-shrinkage process? |
| 08/17/2004 | US6776861 Suppression of planar shrinkage in ltcc ceramic tape laminate structures without externally applied forces |
| 08/17/2004 | US6776859 Anisotropic bonding system and method using dynamic feedback |
| 08/17/2004 | US6776852 Process of removing holefill residue from a metallic surface of an electronic substrate |
| 08/17/2004 | US6776828 Electroless gold plating composition comprising one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more uniformity enhancers |
| 08/17/2004 | US6776827 Method and solution for treating fluorocarbon surfaces |
| 08/17/2004 | US6776826 Composition for coating surface of non-conductive substrate which is to be plated with metal, including binding solution, carbon black powder, and aluminum powder |
| 08/17/2004 | US6776649 Contact assembly for a plug connector, in particular for a PCB plug connector |
| 08/17/2004 | US6776623 Transceiver mounting adapters |
| 08/17/2004 | US6776337 Electronic verification machine for documents |
| 08/17/2004 | US6776330 Hydrogen fluxless soldering by electron attachment |
| 08/17/2004 | US6776325 Electronic components carrier for collecting electronic components dropping from a circuit board and related method |
| 08/17/2004 | US6776090 Printing plate, and printing method using the same |
| 08/17/2004 | US6776089 Screen printer |
| 08/17/2004 | US6775907 Process for manufacturing a printed wiring board |
| 08/17/2004 | US6775906 Method of manufacturing an integrated circuit carrier |
| 08/17/2004 | US6775899 Method for inspecting printing state and substrate |
| 08/17/2004 | CA2327002C Electrical contact cleaner |