| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 08/25/2004 | CN1163552C Surface treatment agent for copper and copper alloy |
| 08/25/2004 | CN1163431C Borate glass based ceramic tape |
| 08/24/2004 | US6782012 Laser device and method of controlling Q-switched frequency converted laser, process and system using laser device |
| 08/24/2004 | US6781850 Protection against folding and displacement for a flexible printed circuit board in a contact-making region |
| 08/24/2004 | US6781848 Single-piece molded module housing |
| 08/24/2004 | US6781845 Parallel printed circuit board assembly |
| 08/24/2004 | US6781839 Vertical surface mount apparatus with thermal carrier and method |
| 08/24/2004 | US6781816 Electronic component |
| 08/24/2004 | US6781815 Capacitor sheet, electro-optical device with capacitor, flexible substrate, composite build-up substrate, and electronic apparatus |
| 08/24/2004 | US6781662 Compression-bond connection substrate, liquid crystal device, and electronic equipment |
| 08/24/2004 | US6781506 Foils have sufficient isotropic roughness for good adhesion of the resistive material and require less resistive material to obtain a given sheet resistivity than conventional metal foils |
| 08/24/2004 | US6781245 Array structure of solder balls able to control collapse |
| 08/24/2004 | US6781234 Semiconductor device having electrodes containing at least copper nickel phosphorous and tin |
| 08/24/2004 | US6781221 Packaging substrate for electronic elements and electronic device having packaged structure |
| 08/24/2004 | US6781215 Intermediate base for a semiconductor module and a semiconductor module using the intermediate base |
| 08/24/2004 | US6781109 Active matrix substrate having transparent connecting terminals |
| 08/24/2004 | US6781093 Circuit singulation system and method |
| 08/24/2004 | US6781092 Method for drilling holes in a substrate |
| 08/24/2004 | US6781090 Quasi-CW diode-pumped, solid-state harmonic laser system and method employing same |
| 08/24/2004 | US6781089 Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device |
| 08/24/2004 | US6781065 Solder-coated articles useful for substrate attachment |
| 08/24/2004 | US6781064 Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same |
| 08/24/2004 | US6781056 Heater for temperature control integrated in circuit board and method of manufacture |
| 08/24/2004 | US6780898 Adhesive composition |
| 08/24/2004 | US6780744 Stereolithographic methods for securing conductive elements to contacts of semiconductor device components |
| 08/24/2004 | US6780738 Pattern forming method, method of making microdevice, method of making thin-film magnetic head, method of making magnetic head slider, method of making magnetic head apparatus, and method of making magnetic recording and reproducing apparatus |
| 08/24/2004 | US6780677 Process for mounting electronic device and semiconductor device |
| 08/24/2004 | US6780565 Photosensitive glass paste and method for manufacturing multilayered interconnected circuit board using the same |
| 08/24/2004 | US6780549 Photopolymerizable unsaturated compound, a compound containing an epoxy group, a photopolymerization initiator or sensitizer, and a silica sol filler with a diameter of between 5 nm-0.5 mu m |
| 08/24/2004 | US6780517 For use in semiconductor devices |
| 08/24/2004 | US6780502 Crosslinked elastic polymer in a photo- or thermally-polymerizable resin |
| 08/24/2004 | US6780494 Ceramic electronic device and method of production of same |
| 08/24/2004 | US6780493 Wiring board and a process of producing a wiring board |
| 08/24/2004 | US6780467 Plating pretreatment agent and metal plating method using the same |
| 08/24/2004 | US6780456 Electrons produced by oxidation of reducing agent are supplied to the electrode to form the desired metal only on the surface of the electrode, there by forming electroless plating film |
| 08/24/2004 | US6780267 Electronic device of ceramic |
| 08/24/2004 | US6780055 Terminal structure of high frequency signal transmitting part |
| 08/24/2004 | US6780028 Solder reserve transfer device and process |
| 08/24/2004 | US6780023 Printed wiring board having plurality of conductive patterns passing through adjacent pads, circuit component mounted on printed wiring board and circuit module containing wiring board with circuit component mounted thereon |
| 08/24/2004 | US6780001 Forming tool for forming a contoured microelectronic spring mold |
| 08/24/2004 | US6779783 Method and structure for tape ball grid array package |
| 08/24/2004 | US6779711 Self-aligned corrosion stop for copper C4 and wirebond |
| 08/24/2004 | US6779710 Mounting parts peel suppressing soldering method, electronic circuit baseboard, and electronic instrument |
| 08/24/2004 | US6779703 Method and device for pressing workpiece |
| 08/24/2004 | US6779264 Electronic device |
| 08/24/2004 | US6779262 Laminating composite foil with non-reinforced thermosetting resin layer on core; functional copper foil is electro-deposited; drilling apertures with carbon dioxide laser |
| 08/24/2004 | US6779260 Overmolded electronic package including circuit-carrying substrate |
| 08/24/2004 | US6779246 Method and system for forming RF reflective pathways |
| 08/24/2004 | CA2457299A1 Circuitized substrate and method of making same |
| 08/24/2004 | CA2319018C Process for ashing organic materials from substrates |
| 08/20/2004 | CA2419336A1 Smt-compatible through-hole electrical connector |
| 08/19/2004 | WO2004071144A1 A shield can for shielding electronic components on a pwb |
| 08/19/2004 | WO2004071140A2 Underfill film for printed wiring assemblies |
| 08/19/2004 | WO2004070904A1 Wire management system |
| 08/19/2004 | WO2004070887A1 Smt-enabled component and circuit board |
| 08/19/2004 | WO2004070827A1 Method for interconnecting terminals and method for mounting semiconductor device |
| 08/19/2004 | WO2004070826A1 Method of forming electrode connection structure and electrode connection structure |
| 08/19/2004 | WO2004070795A2 Radiation detector assembly |
| 08/19/2004 | WO2004070768A2 Direct mount led lamp |
| 08/19/2004 | WO2004069735A1 Templated cluster assembled wires |
| 08/19/2004 | WO2004049065A3 Curable covercoat compositions, cured products obtained therefrom, and methods of manufacture thereof |
| 08/19/2004 | WO2004038053A3 A lead-free solder, and a lead-free joint |
| 08/19/2004 | WO2004027866A3 Method for creating a link in an integrated metal substrate |
| 08/19/2004 | WO2003043747A8 Manufacture having double sided features in a metal-containing web formed by etching |
| 08/19/2004 | WO2003038147A3 High resolution patterning method |
| 08/19/2004 | US20040162799 Method and apparatus for predicting sporting success conditions |
| 08/19/2004 | US20040162363 Mixture of polyamic acid, photosensitive agent, dispersion and solvent; desolventizing; fineness circuit pattern; curing, exposure, development; heat resistance, dimensional stability and insulating properties |
| 08/19/2004 | US20040161906 Method of curing an anisotropic conductive compound |
| 08/19/2004 | US20040161703 Suppressed peeling of end portions peculiar to fine lines |
| 08/19/2004 | US20040161702 For fabricating circuitized substrates which reduces the formation of shorts |
| 08/19/2004 | US20040161627 a copper foil having a high etching factor, enabling formation of fine patterns excellent in linearity of bottom lines of circuit patterns and without leaving particles of copper foil forming the circuit patterns |
| 08/19/2004 | US20040161626 Tape substrate and method for fabricating the same |
| 08/19/2004 | US20040161612 Mixture of novolak epoxy resin, modified acrylonitrile-butadiene rubber, cresol-formaldehyde resin, phosphorus compound and filler |
| 08/19/2004 | US20040161593 Double-sided copper-clad laminate for forming capacitor layer and method for manufacture thereof, and printed wiring board obtained using the double-sided copper-clad laminate for forming capacitor layer |
| 08/19/2004 | US20040161545 Adhesion method |
| 08/19/2004 | US20040160754 Circuit structural body and method for manufacturing the same |
| 08/19/2004 | US20040160752 Electronic component built-in module and method of manufacturing the same |
| 08/19/2004 | US20040160751 Printed circuit board and method of manufacturing printed circuit board |
| 08/19/2004 | US20040160731 Power module and method for producing the same |
| 08/19/2004 | US20040160721 Printed circuit board having inductive vias |
| 08/19/2004 | US20040160701 Magnetic head assembly having a rotational arm for electrically connecting the magnetic head to an external circuit and methods of manufacturing the same |
| 08/19/2004 | US20040160587 Optical magnification adjustment system and projection exposure device |
| 08/19/2004 | US20040160465 Method of printing using a droplet deposition apparatus |
| 08/19/2004 | US20040160377 Low cost antennas and electromagnetic ( EMF) absorption in electronic circuit packages or transceivers using conductive loaded resin-based materials |
| 08/19/2004 | US20040159959 Assemblies for temporarily connecting microelectronic elements for testing and methods therefor |
| 08/19/2004 | US20040159958 Semiconductor device and method of manufacturing the same |
| 08/19/2004 | US20040159946 Microelectronic assemblies, electronic devices, and apparatuses for supporting microelectronic substrates |
| 08/19/2004 | US20040159933 Electronic parts packaging structure and method of manufacturing the same |
| 08/19/2004 | US20040159930 Semiconductor device, method of manufacturing the same, and electronic device using the semiconductor device |
| 08/19/2004 | US20040159921 Connector structure with bond site configured to receive solder having at least two elongated members |
| 08/19/2004 | US20040159915 Land grid array structures and methods for engineering change |
| 08/19/2004 | US20040159913 Circuit device and method of manufacture thereof |
| 08/19/2004 | US20040159902 Windowed package having embedded frame |
| 08/19/2004 | US20040159710 Compact display assembly |
| 08/19/2004 | US20040159551 dissolving metal particles in a plating system containing a cathode (especially a circuit board) and an insoluble anode and contacting with oxygen in the form of air bubbles, which is automatically or manually controlled; relatively low temperature |
| 08/19/2004 | US20040159550 plating in fine channels or in opening portions in a resist formed on a substrate surface after deaerating dissolved gas in the plating solution without needing to add a surface active agent |
| 08/19/2004 | US20040159463 Uniform force hydrostatic bolster plate |
| 08/19/2004 | US20040159462 Flexible dielectric electronic substrate and method for making same |
| 08/19/2004 | US20040159461 Vehicle electronic control unit |
| 08/19/2004 | US20040159396 Method for manufacturing electronic component |