| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 08/26/2004 | US20040165361 Module component and method of manufacturing the same |
| 08/26/2004 | US20040165356 Leadless leadframe electronic package and sensor module incorporating same |
| 08/26/2004 | US20040165138 Drive IC and display device having the same |
| 08/26/2004 | US20040165137 Liquid crystal module |
| 08/26/2004 | US20040164923 Transformers or inductors ("transductors") and antennas manufactured from conductive loaded resin-based materials |
| 08/26/2004 | US20040164835 High density inductor and method for producing same |
| 08/26/2004 | US20040164755 Circuit pattern inspection device, circuit pattern inspection method, and recording medium |
| 08/26/2004 | US20040164742 Method and device for testing the quality of printed circuits |
| 08/26/2004 | US20040164730 Method for forming permanent magnet targets for position sensors |
| 08/26/2004 | US20040164431 substrate having a first side configured to receive a semiconductor chip and a second side having conductive pads arranged in an array of rows and columns, wherein at least one edge of said array is not fully populated with pads. |
| 08/26/2004 | US20040164429 Chip carrier film, method of manufacturing the chip carrier film and liquid crystal display using the chip carrier film |
| 08/26/2004 | US20040164427 Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations |
| 08/26/2004 | US20040164426 Each electrically conductive adhesive bump connects a bonding pad and a corresponding bump pad, and has a smaller diameter at the central portion thereof than at the end portions thereof. |
| 08/26/2004 | US20040164424 Flexibility enhanced integrated circuit carrier |
| 08/26/2004 | US20040164412 Stackable ball grid array |
| 08/26/2004 | US20040164396 Interconnect substrate and method of manufacture thereof, electronic component and method of manufacturing thereof, circuit board and electronic instrument |
| 08/26/2004 | US20040164386 Unmolded package for a semiconductor device |
| 08/26/2004 | US20040164325 UV curing for ink jet printer |
| 08/26/2004 | US20040164060 Hole drilling method and apparatus |
| 08/26/2004 | US20040164057 Arrangement and method for processing electrical substrates using lasers |
| 08/26/2004 | US20040163964 Electroplating conductive material within opening of dielectric layer; commoning layer is used to form multiple, vertically aligned conductive openings in multilayered laminate interposer for coupling a chip to printed circuit board |
| 08/26/2004 | US20040163849 Multilayer board having precise perforations and circuit substrate having precise through-holes |
| 08/26/2004 | US20040163847 Electrical device with teeth joining layers and method for making the same |
| 08/26/2004 | US20040163844 Flexible wiring board, an intermediate product of a flexible wiring board, and a multi-layer flexible wiring board |
| 08/26/2004 | US20040163842 Flexible printed wiring board for chip-on-film |
| 08/26/2004 | US20040163841 Connecting method for structure with implantable electrodes |
| 08/26/2004 | US20040163758 Patterning solution deposited thin films with self-assembled monolayers |
| 08/26/2004 | US20040163617 Underhood electronic integration |
| 08/26/2004 | US20040163554 Uphill screen printing in the manufacturing of microelectronic components |
| 08/26/2004 | US20040163519 Punching tool with re-usable, neutral structural groups |
| 08/26/2004 | US20040163308 Method of producing plants, plant cultivating device, and light-emitting panel |
| 08/26/2004 | US20040163252 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 08/26/2004 | US20040163248 Metal core substrate printed wiring board enabling thermally enhanced ball grid array ( BGA) packages and method |
| 08/26/2004 | US20040163247 Circuit forming board and method of manufacturing circuit forming board |
| 08/26/2004 | US20040163246 Electronic device manufacturing method |
| 08/26/2004 | US20040163244 Method of manufacturing and mounting electronic devices to limit the effects of parasitics |
| 08/26/2004 | US20040163241 Method of programming a programmable electronic device by an in-line program system |
| 08/26/2004 | US20040163234 Resistive vias in a substrate |
| 08/26/2004 | DE19909245B4 Einrichtung zum Aufbringen von viskosem Material auf eine zu beschichtende Fläche Means for applying a viscous material onto a surface to be coated |
| 08/26/2004 | DE10320337A1 Semiconductor wafer manufacture for flip-chip contacts, by applying second solder paste of lower melting point to form extensions to lands formed by first solder paste |
| 08/26/2004 | DE10320090A1 Electronic assembly, especially a circuit board, has conducting tracks between components made from carbonized plastic and or agglomerated nano-particles mounted on a plastic substrate |
| 08/26/2004 | DE10317363B3 Laser-powered hole boring machine for manufacture of substrates for electrical switching circuits has scanning system with oscillating mirrors and focusing lens |
| 08/26/2004 | DE10305855A1 HF-Multilayer-Platine RF multilayer board |
| 08/25/2004 | EP1450590A2 Circuitized substrate and method of making same |
| 08/25/2004 | EP1450439A2 Planar contact structure with contact legs for variable plug position |
| 08/25/2004 | EP1450405A2 Drive IC and display device having the same |
| 08/25/2004 | EP1450401A1 Module structure and module comprising it |
| 08/25/2004 | EP1450400A1 Module part |
| 08/25/2004 | EP1450382A2 Method for forming permanent magnet targets for position sensors |
| 08/25/2004 | EP1449610A1 Laser processing method, laser soldering method, and laser processing apparatus |
| 08/25/2004 | EP1449415A1 Method and device for through-hole plating of substrates and printed circuit boards |
| 08/25/2004 | EP1449414A1 Interposer |
| 08/25/2004 | EP1449413A1 Method and apparatus for securing a circuit board to a rigid surface |
| 08/25/2004 | EP1449278A1 Plug |
| 08/25/2004 | EP1449252A2 Electronic assembly |
| 08/25/2004 | EP1449224A1 Method of producing a multilayer microelectronic substrate |
| 08/25/2004 | EP1448745A1 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices |
| 08/25/2004 | EP1448725A2 Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| 08/25/2004 | EP1448489A1 Biomedical electrochemical sensor array and method of fabrication |
| 08/25/2004 | EP1448378A1 Separating plate-composite component for producing printed circuit board components and method for producing a composite component of this type |
| 08/25/2004 | EP1448357A1 Abrasion resistant electrode and device |
| 08/25/2004 | EP1448336A1 Method of laser milling using constant tool path algorithm |
| 08/25/2004 | EP1299575B1 Acidic treatment liquid and method of treating copper surfaces |
| 08/25/2004 | EP1297086A4 Polymeric materials to metal surfaces adhesion process |
| 08/25/2004 | EP1088117B1 Method for depositing a metallic layer on a polymer surface of a workpiece |
| 08/25/2004 | EP1062849A4 Circuit board features with reduced parasitic capacitance and method therefor |
| 08/25/2004 | EP0839323B1 Microelectronic spring contact elements |
| 08/25/2004 | EP0820491B1 Melt-flowable materials and method of sealing surfaces |
| 08/25/2004 | CN2636588Y Acid washing machine having vertical swinging spray device |
| 08/25/2004 | CN1524401A Alignment of vias in circuit boards or similar structures |
| 08/25/2004 | CN1524033A Method of manufacturing ceramic laminated body |
| 08/25/2004 | CN1524026A System and method for integrating optical layers in a PCB for inter-board communications |
| 08/25/2004 | CN1523952A Apparatus for fixing platy object or flaky object |
| 08/25/2004 | CN1523951A Chip-on-film use copper foil |
| 08/25/2004 | CN1523950A Harzfilm und mehrlagige leiterplatte unter verwendung desselben |
| 08/25/2004 | CN1523664A Packaging substrate and inversion type semiconductor device |
| 08/25/2004 | CN1523658A Electronic device manufacturing method |
| 08/25/2004 | CN1523650A LSI packaging and assembly method thereof |
| 08/25/2004 | CN1523631A Method and apparatus for correcting minute graphics defect of plane substrate |
| 08/25/2004 | CN1523617A High density inductor and method for producing same |
| 08/25/2004 | CN1523409A Drive ic and display device having the same |
| 08/25/2004 | CN1523058A Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same |
| 08/25/2004 | CN1522819A 钻头 Drill |
| 08/25/2004 | CN1164160C Method and device for processing substrates |
| 08/25/2004 | CN1164158C Multi-layer circuit board for semiconductor chip assembly |
| 08/25/2004 | CN1164157C Printed circuit board capable of preventing short circuit during welding |
| 08/25/2004 | CN1164156C Screen board for supplying soldering agent into circuit board |
| 08/25/2004 | CN1164155C Electronic unit soldering apparatus |
| 08/25/2004 | CN1164154C Method for mounting terminal on circuit board and circuit board |
| 08/25/2004 | CN1164153C Method for mounting terminal on circuit board and circuit board |
| 08/25/2004 | CN1164152C Multi-layer circuit board including reactance element and method for minitrimming reactance element |
| 08/25/2004 | CN1164030C Flat electronic device and installing structure thereof |
| 08/25/2004 | CN1164010C Method for attaching solderable wire leads to lead frame and solderable electronic component |
| 08/25/2004 | CN1163963C Manufacturing method of lead-wire frame and resin sealing type semiconductor device |
| 08/25/2004 | CN1163959C Surface mounting element and mounting structure for surface mounting element |
| 08/25/2004 | CN1163958C Lamination for multi-layer printed circuit |
| 08/25/2004 | CN1163954C Semiconductor copper bonding point surface protection |
| 08/25/2004 | CN1163785C Method for mounting TCP film to display panel |
| 08/25/2004 | CN1163642C Non-crimping polyester monofilament and process for producing same |
| 08/25/2004 | CN1163553C Electronic material containing repellent, electronic component using the material and process for producing electric component |