| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/01/2004 | EP1378150B1 Retainer element for electrical components for assembly on circuit supports |
| 09/01/2004 | EP1322798B1 Bath and method of electroless plating of silver on metal surfaces |
| 09/01/2004 | EP1311644A4 Process for improving polymer to metal adhesion |
| 09/01/2004 | EP1147234B1 Method for treating a brittle thin metal strip and magnetic parts made from a nanocrystalline alloy strip |
| 09/01/2004 | CN2638393Y Clamping checking device for printed circuit board electroplating transportation |
| 09/01/2004 | CN2637048Y Miniature drilling bit improved structure for printed circuit board |
| 09/01/2004 | CN1526183A Apparatus and methods to pre-stress anisotropic conductive elastomer meterials |
| 09/01/2004 | CN1526168A Single package containing multiple integrated circuit devices |
| 09/01/2004 | CN1526166A Electronic package with high density interconnect and associated methods |
| 09/01/2004 | CN1526165A Improved surface mount package |
| 09/01/2004 | CN1525806A Method for manufacturing circuit board |
| 09/01/2004 | CN1525805A Wiring material, wiring substrate and manufacturing method thereof and display panel |
| 09/01/2004 | CN1525804A Circuit board and its manufacturing method |
| 09/01/2004 | CN1525600A Method of making an electrical connector |
| 09/01/2004 | CN1525559A Wiring substrate |
| 09/01/2004 | CN1525556A Wiring substrate |
| 09/01/2004 | CN1525544A Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 09/01/2004 | CN1525502A Method of trimming reactance element |
| 09/01/2004 | CN1525492A Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
| 09/01/2004 | CN1525421A Safety label not revivable after being deactivated and making method thereof |
| 09/01/2004 | CN1525185A Electrical inspection apparatus |
| 09/01/2004 | CN1525184A Printed board checking apparatus |
| 09/01/2004 | CN1165210C Process for preparing sealing resin of circuit board for shielding electromagnetic wave |
| 09/01/2004 | CN1165209C Method for manufacturing multilayer integrated substrate and multilayer ceramic element |
| 09/01/2004 | CN1165032C Display device using COF |
| 09/01/2004 | CN1164800C Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 09/01/2004 | CN1164372C Binding agent coating method for electronic circuit board |
| 08/31/2004 | US6785148 Easy mount socket |
| 08/31/2004 | US6785147 Circuit module |
| 08/31/2004 | US6785008 Board for measuring offset of component mounting apparatus, and method for measuring offset of component mounting apparatus |
| 08/31/2004 | US6784780 Coupling adjusting structure for double-tuned circuit |
| 08/31/2004 | US6784765 Multilayer ceramic device |
| 08/31/2004 | US6784656 Hybrid conductor-board for multi-conductor routing |
| 08/31/2004 | US6784598 Electronic component and method for forming substrate electrode of the same |
| 08/31/2004 | US6784556 Design of interconnection pads with separated probing and wire bonding regions |
| 08/31/2004 | US6784554 Semiconductor device and manufacturing method thereof |
| 08/31/2004 | US6784543 Projection-like connection terminals |
| 08/31/2004 | US6784527 Electronic card formed of a double-sided printed circuit board with static electricity prevention circuit |
| 08/31/2004 | US6784526 Integrated circuit device module |
| 08/31/2004 | US6784521 Directional coupler |
| 08/31/2004 | US6784399 Micromachining with high-energy, intra-cavity Q-switched CO2 laser pulses |
| 08/31/2004 | US6784389 Flexible circuit piezoelectric relay |
| 08/31/2004 | US6784377 Method and structure for repairing or modifying surface connections on circuit boards |
| 08/31/2004 | US6784376 Solderable injection-molded integrated circuit substrate and method therefor |
| 08/31/2004 | US6784375 Interconnection structure for interconnecting printed circuit boards |
| 08/31/2004 | US6784374 Printed wiring board and manufacturing method therefor |
| 08/31/2004 | US6784373 Printed circuit board with wiring pattern formed thereon by screen printing and process for manufacturing the same |
| 08/31/2004 | US6784372 Orthogonal electrical connection using a ball edge array |
| 08/31/2004 | US6784369 Connection structure of coaxial cable |
| 08/31/2004 | US6784088 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped |
| 08/31/2004 | US6784086 Lead-free solder structure and method for high fatigue life |
| 08/31/2004 | US6783921 Method for etching laminated assembly including polyimide layer |
| 08/31/2004 | US6783920 Photosensitive glass variable laser exposure patterning method |
| 08/31/2004 | US6783867 High melting point metallizing layer, which consists mainly of a high melting point metal such as w and/or mo, and an intervening metal layer, which has a melting point of not greater than 1,000 degrees c. and consists mainly of at least |
| 08/31/2004 | US6783860 Laminated entry and exit material for drilling printed circuit boards |
| 08/31/2004 | US6783841 Low signal loss bonding ply for multilayer circuit boards |
| 08/31/2004 | US6783840 Resist ink composition |
| 08/31/2004 | US6783828 Resin composition, adhesive film for semiconductor device, and laminated film with metallic foil and semiconductor device using the same |
| 08/31/2004 | US6783797 Device for collectively filling blind cavities |
| 08/31/2004 | US6783690 Method of stripping silver from a printed circuit board |
| 08/31/2004 | US6783688 Method and apparatus for structuring printed circuit boards |
| 08/31/2004 | US6783654 Using wiring board as one pole and insoluble electrode as other; applying forward/reverse current; copper plating solution includes iron ions; filling microvia holes in board with metal plating |
| 08/31/2004 | US6783652 Process for manufacturing a wiring board |
| 08/31/2004 | US6783620 Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
| 08/31/2004 | US6783392 Connector mounting structure |
| 08/31/2004 | US6783376 Fastening arrangement having a fastening plate and employment of the fastening arrangement |
| 08/31/2004 | US6783375 Electrical connector with improved terminals |
| 08/31/2004 | US6783371 Solder-down printed circuit board connection structure |
| 08/31/2004 | US6783077 Conductor track supporting layer for laminating inside a chip card, chip card comprising a conductor track supporting layer, and method for producing a chip card |
| 08/31/2004 | US6783057 Comprising tin/lead/silver in order to provide a wider solidification range and achieve balance between the surface tension of both side of a small leadless component |
| 08/31/2004 | US6782615 Method of surface-mounting electronic components |
| 08/31/2004 | US6782613 Interposer structures having formed thereon a plurality of conductive pillars or recesses that are adapted to make electrical contact with the leads of an integrated circuit package |
| 08/31/2004 | US6782612 Manufacturing process of IC module |
| 08/31/2004 | US6782611 Method of assembling a multi-chip device |
| 08/31/2004 | US6782610 Method for fabricating a wiring substrate by electroplating a wiring film on a metal base |
| 08/31/2004 | CA2145870C Process for treating plastic surfaces and swelling solution |
| 08/31/2004 | CA2127006C Hot pluggable motherboard bus connector method |
| 08/26/2004 | WO2004073370A1 Multilayer board and its manufacturing method |
| 08/26/2004 | WO2004073369A1 Multilayer printed wiring board and process for producing the same |
| 08/26/2004 | WO2004073368A1 High frequency multilayer printed wiring board |
| 08/26/2004 | WO2004073063A1 Electronic device and semiconductor device |
| 08/26/2004 | WO2004072993A1 Electronic parts board and method of producing the same |
| 08/26/2004 | WO2004072331A2 Apparatus and method for highly controlled electrodeposition |
| 08/26/2004 | WO2004072330A2 Electro-plating method and apparatus |
| 08/26/2004 | WO2004047507A3 Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof |
| 08/26/2004 | WO2004030035A3 Via interconnect forming process and electronic component product thereof |
| 08/26/2004 | US20040168142 Method and system for designing an integrated circuit with reduced noise |
| 08/26/2004 | US20040167053 non-azeotropic combinations of nonflammable and flammable solvents that segregate during cleaning operations, including certain vapor degreasing processes, yet remain nonflammable throughout the cleaning operation |
| 08/26/2004 | US20040167047 Cleaning solution for substrates of electronic materials |
| 08/26/2004 | US20040166827 interposing curable adhesive, particularly an epoxy terminated silane like a glycidyloxy methoxy silane, between a thin profile battery such as a button battery and a substrate; and curing |
| 08/26/2004 | US20040166763 Manufacturing method of solid-state image sensing device |
| 08/26/2004 | US20040166709 High current, high mechanical strength connectors for insulated metal substrate circuit boards |
| 08/26/2004 | US20040166706 SMT-compatible through-hole electrical connector |
| 08/26/2004 | US20040166705 Electrical connector with a terminal pin alignment plate |
| 08/26/2004 | US20040166701 Mechanical-contact adapter |
| 08/26/2004 | US20040166660 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
| 08/26/2004 | US20040166617 Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times |
| 08/26/2004 | US20040166608 Electronic device and a method of manufacturing the same |
| 08/26/2004 | US20040166438 water soluble polymer between metallic surface and polymer layer, especially a patterned photoactive polymer; enhanced adhesion; prevents "curling" or lifting of the other polymer from the metallic surface and prevents undercutting during etching |
| 08/26/2004 | US20040166340 high temperature stability and structural integrity |