| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/07/2004 | US6787924 Semiconductor device capable of preventing solder balls from being removed in reinforcing pad |
| 09/07/2004 | US6787923 Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks |
| 09/07/2004 | US6787922 Semiconductor chip—mounting board |
| 09/07/2004 | US6787921 During the reflowing process, the carrier is supported by the solder balls having high-melting-temperature cores, so that the collapse level is controlled |
| 09/07/2004 | US6787920 Electronic circuit board manufacturing process and associated apparatus |
| 09/07/2004 | US6787918 Substrate structure of flip chip package |
| 09/07/2004 | US6787902 Package structure with increased capacitance and method |
| 09/07/2004 | US6787895 Leadless chip carrier for reduced thermal resistance |
| 09/07/2004 | US6787892 Semiconductor device and semiconductor device manufacturing method |
| 09/07/2004 | US6787884 Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production |
| 09/07/2004 | US6787813 Substrate exposure apparatus |
| 09/07/2004 | US6787734 System and method of laser drilling using a continuously optimized depth of focus |
| 09/07/2004 | US6787711 Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device |
| 09/07/2004 | US6787710 Wiring board and a method for manufacturing the wiring board |
| 09/07/2004 | US6787708 Printed circuit board debug technique |
| 09/07/2004 | US6787706 Ceramic circuit board |
| 09/07/2004 | US6787700 Structure of joining chip part to bus bars |
| 09/07/2004 | US6787443 PCB design and method for providing vented blind vias |
| 09/07/2004 | US6787442 Method of making a semiconductor having multi-layered electrodes including nickel and phosphorus and solder formed with tin and an alkaline earth metal |
| 09/07/2004 | US6787399 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 09/07/2004 | US6787398 Method of fabricating a high frequency signal amplification device |
| 09/07/2004 | US6787382 Method and system for singulating semiconductor components |
| 09/07/2004 | US6787286 Solvents and photoresist compositions for short wavelength imaging |
| 09/07/2004 | US6787242 Adhesion promoters for polymer coatings on metals are articulated into at least two head groups connected by a hydrocarbon spacer group. one head group reacts particularly well with polymer molecules. other head groups form a durable |
| 09/07/2004 | US6787233 Particles |
| 09/07/2004 | US6787198 Hydrothermal treatment of nanostructured films |
| 09/07/2004 | US6786762 Cable assembly module with compressive connector |
| 09/07/2004 | US6786737 Electrical connecting element and method of producing the same |
| 09/07/2004 | US6786736 Surface mount interconnect and device including same |
| 09/07/2004 | US6786391 Method of controlling solder deposition utilizing two fluxes and preform |
| 09/07/2004 | US6785960 Wave solder application for ball grid array modules |
| 09/07/2004 | CA2338670C Resin/copper/metal laminate and method of producing same |
| 09/02/2004 | WO2004075612A1 Embedded passive components |
| 09/02/2004 | WO2004075611A1 Pcb connector |
| 09/02/2004 | WO2004075282A1 Semiconductor device and radiation detector employing it |
| 09/02/2004 | WO2004075281A1 Semiconductor device and radiation detector employing it |
| 09/02/2004 | WO2004075248A2 Surface-coating method, production of microelectronic interconnections using said method and integrated circuits |
| 09/02/2004 | WO2004075211A1 Method of forming conductors at low temperatures using metallic nanocrystals and product |
| 09/02/2004 | WO2004074553A2 Plating using an insoluble anode and seperately supplied plating material |
| 09/02/2004 | WO2004074210A1 Ceramics-metal composite body and method of producing the same |
| 09/02/2004 | WO2004073975A1 Layered polyimide/metal product |
| 09/02/2004 | WO2004073924A1 Plate-like work polishing apparatus and method of polishing plate-like work |
| 09/02/2004 | WO2004073917A1 Device and method for processing electric circuit substrates by laser |
| 09/02/2004 | WO2004073890A1 Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards |
| 09/02/2004 | US20040172643 Optical head device, optical disk apparatus using optical head device, and heat radiation mechanism |
| 09/02/2004 | US20040171315 Joint structure of electronic element |
| 09/02/2004 | US20040171310 Electrical connector with continuous strip contacts |
| 09/02/2004 | US20040171301 Circuit board connector |
| 09/02/2004 | US20040171268 Feed-through manufacturing method and feed-through |
| 09/02/2004 | US20040171214 Capacitor, circuit board, method of formation of capacitor, and method of production of circuit board |
| 09/02/2004 | US20040171190 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same |
| 09/02/2004 | US20040171189 Semiconductor plastic package and process for the production thereof |
| 09/02/2004 | US20040170858 Process for producing high temperature heat resisting carrier foil clad electrolytic copper foil and high temperature heat resisting carrier foil clad electrolytic copper foil obtained by the process |
| 09/02/2004 | US20040170857 Having a blackened surface with a uniform hue and no uneven color, free from shedding of powder, superior in electromagnetic shielding ability, and high in transmittancel; for a plasma display panel |
| 09/02/2004 | US20040170846 Prepared through a wet treatment and carries tightly a metal-element-containing component or film on the surface of a resin base without having a catalyst layer, usually present when the metal film is formed through electroless plating |
| 09/02/2004 | US20040170809 Dimensionally stable composite article |
| 09/02/2004 | US20040170795 Lasable bond-ply materials for high density printed wiring boards |
| 09/02/2004 | US20040170766 Electroless plating method and device, and substrate processing method and apparatus |
| 09/02/2004 | US20040170754 polyamic acid contained in an adhesive layer is partially imidated, and after forming a porous layer, both layers are subjected to imide conversion; adhesive strength between adhesive layer and porous layer increases |
| 09/02/2004 | US20040170410 Conduits integrated in circuit board and method of manufacture |
| 09/02/2004 | US20040170006 Interconnect module with reduced power distribution impedance |
| 09/02/2004 | US20040169645 Electronic module and driving circuit board therefor |
| 09/02/2004 | US20040169288 Padless high density circuit board and manufacturing method thereof |
| 09/02/2004 | US20040169277 Multileveled printed circuit board unit including substrate interposed between stacked bumps |
| 09/02/2004 | US20040169275 Area-array device assembly with pre-applied underfill layers on printed wiring board |
| 09/02/2004 | US20040169271 Circuit device and method of manufacture thereof |
| 09/02/2004 | US20040169265 Two-stage transfer molding device to encapsulate MMC module |
| 09/02/2004 | US20040169198 Semiconductor device |
| 09/02/2004 | US20040169162 Mixing epoxy resin, amine, filler, corrosion inhibitor and oxygen scavenger, imidazole curing agent and solvent |
| 09/02/2004 | US20040169060 Screen printing squeegee for applying solder paste |
| 09/02/2004 | US20040169020 Method and device for installation |
| 09/02/2004 | US20040169004 Uniformity thin film; adhesion of paraffin fluid; masking; supplying energy to remove segments; forming pattern; ink jet recording |
| 09/02/2004 | US20040169003 On substrate; hardness; wear resistance |
| 09/02/2004 | US20040168824 Circuit board having deformation interrupting section and circuit board forming method |
| 09/02/2004 | US20040168560 Device for punching green sheets |
| 09/02/2004 | US20040168314 Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer |
| 09/02/2004 | US20040168312 PCB with inlaid outerlayer circuits and production methods thereof |
| 09/02/2004 | DE20318245U1 Building block for model railway has flat circuit board or chip carrying control circuit, resting on substrate or support board with electrical contacts and rectangular central aperture |
| 09/02/2004 | DE19901980B4 Anzeigemodul Display module |
| 09/02/2004 | DE10307846A1 Verfahren zum elektrischen Kontaktieren eines Bauteils mit einem Flachkabel A method for electrically contacting a component with a flat cable |
| 09/02/2004 | DE10306618A1 Planare Kontaktstruktur mit Kontaktzungen für eine variable Steckposition Planar contact structure with reeds for a variable slot position |
| 09/02/2004 | DE10304867A1 Manufacturing circuit board arrangement involves inserting electrically conducting pin of length at least corresponding to board thickness into carrying board to pass through board with ends exposed |
| 09/02/2004 | DE10297212T5 Klemme für austauschbare oberflächenmontierte Vorrichtungen Removable terminal surface mount devices |
| 09/02/2004 | DE10297047T5 Lötfreie Leiterplatten-Baugruppe Solderless PCB assembly |
| 09/02/2004 | DE10145752B4 Nicht-leitendes, ein Band oder einen Nutzen bildendes Substrat, auf dem eine Vielzahl von Trägerelementen ausgebildet ist Non-conductive, tape, or a benefit-forming substrate on which a plurality of carrier elements is |
| 09/01/2004 | EP1453364A1 Film for circuit board |
| 09/01/2004 | EP1453089A2 Semiconductor substrate of high reliability |
| 09/01/2004 | EP1452881A1 Printed circuit board and method of use thereof |
| 09/01/2004 | EP1452803A1 Quartz glass single hole nozzle and quartz glass multi-hole burner head for feeding fluid |
| 09/01/2004 | EP1452627A2 Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
| 09/01/2004 | EP1452536A1 Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins |
| 09/01/2004 | EP1452326A2 Method and apparatus for fixing a functional material onto a surface |
| 09/01/2004 | EP1452078A1 Depositing solid materials |
| 09/01/2004 | EP1451907A2 Multi-beam micro-machining system and method |
| 09/01/2004 | EP1451866A2 Method of manufacturing circuits |
| 09/01/2004 | EP1451831A1 Thin flexible conductors |
| 09/01/2004 | EP1451732A1 Parallel electronic design automation: shared simultaneous editing |
| 09/01/2004 | EP1451640A1 Photosensitive composition and production processes for photosensitive film and printed wiring board |
| 09/01/2004 | EP1451257A1 Method of producing coating composition and coating composition made therefrom |
| 09/01/2004 | EP1451018A2 Methods of fabricating patterned layers on a substrate |