Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/2004
09/09/2004US20040175938 Method for metalizing wafers
09/09/2004US20040175917 Metal electrode and bonding method using the metal electrode
09/09/2004US20040175915 Tape circuit board and semiconductor chip package including the same
09/09/2004US20040175879 Variable cross-section plated mushroom with stud for bumping
09/09/2004US20040175583 Printed wiring boards, IC (Integrated Circuit) packages and heat dissipation plates
09/09/2004US20040175582 Coated foil resists laser ablation, thereby resisting piercing of the foil by the laser during drilling; adhesion of the copper foil layer to the dielectric substrate
09/09/2004US20040175503 Method for producing thin homogenenous layers with the help of screen printing technology, device for carrying out said method and the use thereof
09/09/2004US20040175030 Systems and methods for detecting defects in printed solder paste
09/09/2004US20040174705 LED lamp assembly
09/09/2004US20040174663 Flexible wired circuit board
09/09/2004US20040174651 Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
09/09/2004US20040174626 Method for treating circuit board for use in disk recorder or player apparatus
09/09/2004US20040174487 Liquid crystal display device
09/09/2004US20040174486 Display device
09/09/2004US20040174257 Forming electromagnetic communication circuit components using densified metal powder
09/09/2004US20040174178 Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
09/09/2004US20040173942 Method and device for laser beam machining of laminated material
09/09/2004US20040173915 Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same
09/09/2004US20040173909 Conductive through wafer vias
09/09/2004US20040173896 Plastic lead frames for semiconductor devices
09/09/2004US20040173891 Intermediate board, intermediate board with a semiconductor device, substrate board with an intermediate board, structural member including a semiconductor device, an intermediate board and a substrate board, and method of producing an intermediate board
09/09/2004US20040173890 Front-and-back electrically conductive substrate and method for manufacturing same
09/09/2004US20040173888 Semiconductor package and semiconductor package mounting method
09/09/2004US20040173884 Flexible printed circuit substrate
09/09/2004US20040173882 Plastic lead frames for semiconductor devices and packages including same
09/09/2004US20040173879 High-frequency power amplifier
09/09/2004US20040173818 Binder diffusion transfer patterning of a thick film paste layer
09/09/2004US20040173759 Device, set and method for carrying a gas or a liquid to a surface through a tube
09/09/2004US20040173666 Improved dispersion stability; chemisorption
09/09/2004US20040173660 Method of soldering
09/09/2004US20040173633 Viscous material application apparatus
09/09/2004US20040173602 Electrical, thin film termination
09/09/2004US20040173589 Method of drilling a circuit board
09/09/2004US20040173463 Method for production of printed wiring board
09/09/2004US20040173375 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
09/09/2004US20040173372 Electronic component for adhesion of a plurality of electrodes and method of mounting the same
09/09/2004US20040173371 Surface mounting package
09/09/2004US20040173144 Formation of printed circuit board structures using piezo microdeposition
09/09/2004US20040172821 Method of forming a non-continuous conductive layer for laminated substrates
09/09/2004US20040172820 Multi-Milling Method for the Production of Printed Circuits and the Printed Circuits Thus Obtained
09/09/2004US20040172819 Wiring board, method of manufacturing the same, semiconductor device, electronic module, and electronic apparatus
09/09/2004US20040172818 Method of manufacturing solder mask of printed circuit board
09/09/2004US20040172814 Method for manufacturing printed circuit boards
09/09/2004DE19601055B4 Verfahren und Vorrichtung zum Beloten von Flächen Method and apparatus for applying brazing material surfaces of
09/09/2004DE19520700B4 Halbleiterbausteinanordnung Semiconductor chip layout
09/09/2004DE10346292A1 Elktronikgehäuse mit anschlußleitungslosem Leitungsrahmen und Sensormodul, das dasselbe umfaßt Elktronikgehäuse with connection cable and Wi-lead frame sensor module comprising the same
09/09/2004DE10308817A1 Leiterplatte und Verfahren zur Fixierung von bedrahteten Bauteilen auf der Leiterplatte Circuit board and method of fixing hole components on the circuit board
09/09/2004DE10308642A1 Manufacture of printed circuit boards for electrical appliances, e.g. PCB assembly in housing for speed controlled drive
09/09/2004DE10307309A1 Vorrichtung und Verfahren zur Bearbeitung von elektrischen Schaltungssubstraten mittels Laser Apparatus and method for processing electrical circuit substrates by laser
09/09/2004DE10303259B3 Miniature camera module support system has sinusoidal-shaped flat conductor for connection between camera module and array of electrical contact elements
09/09/2004DE10244195B4 Tintenpatrone und flexible Farb-Leiterplatte Ink cartridge and flexible color board
09/09/2004DE102004005685A1 Verfahren zum Herstellen einer elektronischen Komponente A method of manufacturing an electronic component
09/08/2004EP1455563A1 ELECTROMAGNETIC WAVE SHIELDED LIGHT−TRANSMISSIVE MATERIAL AND MANUFACTURING METHOD THEREOF
09/08/2004EP1455558A2 Printed wiring boards having capacitors and methods of making thereof
09/08/2004EP1455394A1 Transfer method, method of manufacturing thin film element, method of manufacturing integrated circuit, circuit substrate and method of manufacturing the circuit substrate, electro-optic device and method of manufacturing the electro-optic device, and ic card and electronic equipment
09/08/2004EP1455227A2 Photosensitive resin composition and printed wiring board
09/08/2004EP1455005A2 Copper foil for high frequency circuit and method of producing of same
09/08/2004EP1454973A1 Adhesive for bonding circuit members, circuit board and process for its production
09/08/2004EP1454515A1 Epoxy washer for retention of inverted smt components
09/08/2004EP1454508A1 Flexible electric circuit for heating comprising a metallised fabric
09/08/2004EP1454329A1 Electrical devices and process for making such devices
09/08/2004EP1453988A2 Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
09/08/2004EP1300059B1 Jet print apparatus and method for printed circuit board manufacturing
09/08/2004EP0834243B1 Photolithographically patterned spring contact
09/08/2004EP0766851A4 Document verification system
09/08/2004CN2638918Y Fixing driven mechanism of circuit board output terminal bevel-edge machine
09/08/2004CN1528111A Printed circuit board comprising a contact sleeve that is mounted thereon
09/08/2004CN1528110A Retainer element for electrical components for assembly on circuit supports
09/08/2004CN1528109A Method for the manufactur of a printed circuit and planar antenna manufactured with this printed circuit
09/08/2004CN1527869A Ultraviolet activatable adhesive film
09/08/2004CN1527793A Method for forming microelectronic spring structures on a substrate
09/08/2004CN1527763A Laminate and process for producing the same
09/08/2004CN1527747A Process for treating adhesion promoted metal surfaces
09/08/2004CN1527746A Method of and apparatus for substrate pre-treatment
09/08/2004CN1527657A Electric circuit base board assembling body
09/08/2004CN1527656A Magnetically controlled sputtering process of making printed circuit board
09/08/2004CN1527655A Method for producing wiring base plate
09/08/2004CN1527654A Method for producing distributing base board
09/08/2004CN1527653A Image sensor withdrawing method
09/08/2004CN1527372A Equipment for arranging and distributing welding flux column according to array
09/08/2004CN1527102A Film forming method and apparatus, method and apparatus for producing base plate and electronic equipment
09/08/2004CN1526682A Glass ceramics synthetic and sintered glass ceramics used in circuit board
09/08/2004CN1526530A Stamping device for printing circuit substrabe
09/08/2004CN1526524A Perforating apparatus and method for slab workpiece
09/08/2004CN1526523A Perforating device
09/08/2004CN1166266C Method for attaching lead parts and shield case to printed circuit board, and method for attaching chip parts, lead parts and shield case to printed circuit board
09/08/2004CN1166265C Pressure-bonded substrate, liquid crystal device, and electronic device
09/08/2004CN1166264C Electronic circuit apparatus and method for assembling the same
09/08/2004CN1166035C Add-on electrical assembly with light transmission means
09/08/2004CN1165978C Mounting structure, method of manufacturing the same
09/08/2004CN1165916C Sheet like variable resistor and mehtod for making same
09/08/2004CN1165592C Curable epoxy-based compositions
09/08/2004CN1165591C Electrically conducting adhesive, structural body for installation, LCD, electronic device and making emthod
09/07/2004US6789247 Printed board designing apparatus, printed board designing method, and recording medium on which control program for printed board design is recorded
09/07/2004US6788966 Diagnosis probe
09/07/2004US6788859 Laminate substrate containing fiber optic cables
09/07/2004US6788560 Semiconductor device and process for manufacturing the same
09/07/2004US6788545 Composite electronic component and method of producing same
09/07/2004US6788078 Apparatus for scan testing printed circuit boards
09/07/2004US6787984 Wiring substrate, manufacturing method therefor, and image display device