| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/20/2006 | DE10348734B4 Verfahren zum selektiven Galvanisieren von Metalloberflächen und Selektiv-Galvanisierungssystem für Metalloberflächen A method for selective electroplating of metal surfaces and selective electroplating system for metal surfaces |
| 04/20/2006 | DE10301480B4 Verfahren zur Herstellung von Halbleiter-Bauelement-Pins Process for the preparation of semiconductor device pins |
| 04/20/2006 | DE10230135B4 Verfahren und System zur Erstellung eines Entwurfs und Sicherstellen der Verbindung mehrerer gedruckter Schaltungsplatinen A method and system for creating a design and ensuring the connection of a plurality of printed circuit boards |
| 04/20/2006 | DE102004049453A1 Elektrischer Schaltkreis mit einer Nanostruktur und Verfahren zum Herstellen einer Kontaktierung einer Nanostruktur Electrical circuit with a nanostructure and methods for manufacturing a contact of a nanostructure |
| 04/20/2006 | DE10047153B4 Befestigungseinrichtung Mounting means |
| 04/19/2006 | EP1648210A1 Bank structure for defining wire-formation regions |
| 04/19/2006 | EP1648209A1 Producing method of wired circuit board |
| 04/19/2006 | EP1648028A1 Composite electronic component |
| 04/19/2006 | EP1647170A1 Method for manufacturing a midplane |
| 04/19/2006 | EP1647168A1 Overmolded mcm with increased surface mount component reliability |
| 04/19/2006 | EP1647051A2 Semiconductor power module with strip conductors which are detached from a substrate as external connections |
| 04/19/2006 | EP1479060A4 Compact display assembly |
| 04/19/2006 | EP1448378B1 Separating plate-composite component for producing printed circuit board components and method for producing a composite component of this type |
| 04/19/2006 | EP1404481B1 A laser machining system and method |
| 04/19/2006 | EP1194024B1 Multilayer printed-circuit board and method of manufacture |
| 04/19/2006 | CN2774079Y Automatic assembling mechanism of resonator chip and lead wire strip |
| 04/19/2006 | CN2774078Y Double-station dynamic positioner of resonator lead wire strip |
| 04/19/2006 | CN2774077Y Infrared hot-air composite heater of reflux welder |
| 04/19/2006 | CN2774076Y Selective peak welding system |
| 04/19/2006 | CN2774075Y Minute drilling bit clip transmission device |
| 04/19/2006 | CN2773945Y Fixed structure and electric connector therewith |
| 04/19/2006 | CN1762186A Multilayer printed wiring board and method for manufacturing the multilayer printed wiring board |
| 04/19/2006 | CN1762185A Process for producing electronic component and electronic component |
| 04/19/2006 | CN1761773A Novel imidazole compound and usage thereof |
| 04/19/2006 | CN1761565A Pressure control system for printing a viscous material |
| 04/19/2006 | CN1761381A Method of installing integrated circuit package, its method and formed assembly thereof |
| 04/19/2006 | CN1761380A Methods of forming printed circuit boards |
| 04/19/2006 | CN1761379A Producing method of wired circuit board |
| 04/19/2006 | CN1761378A Method of drilling a hole through Co2 laser directly |
| 04/19/2006 | CN1761377A Circuit component mounting device |
| 04/19/2006 | CN1761056A Interconnection structure and forming method thereof |
| 04/19/2006 | CN1761041A Method for leading out ball grid array of mixed assembled IC |
| 04/19/2006 | CN1760262A Soldering pallet for printing circuit board, and preparing method |
| 04/19/2006 | CN1253059C Chemical-corrosive process for substrate |
| 04/19/2006 | CN1253058C No-welding needle connection in printed circuit board |
| 04/19/2006 | CN1252753C Lead stripping method, microelectronic element connecting method and element bearing body mfg. system |
| 04/19/2006 | CN1252322C Device and method for electrolytic metallization of workpiece |
| 04/19/2006 | CN1252206C Binder and adhesive film |
| 04/19/2006 | CN1252204C Method for adhering substrates using light activatable adhesive film |
| 04/19/2006 | CN1252144C Adhesive of fixing matrix for microelectronic device |
| 04/19/2006 | CN1252096C Phenol-novolacs with improved optical properties |
| 04/19/2006 | CN1251808C Size coating apparatus and size coating method |
| 04/18/2006 | US7031511 Hole inspection apparatus and method |
| 04/18/2006 | US7031165 Electronic control unit |
| 04/18/2006 | US7030873 System for generating printed board three-dimensional shape data |
| 04/18/2006 | US7030712 Radio frequency (RF) circuit board topology |
| 04/18/2006 | US7030508 Substrate for semiconductor package and wire bonding method using thereof |
| 04/18/2006 | US7030500 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 04/18/2006 | US7030481 High density chip carrier with integrated passive devices |
| 04/18/2006 | US7030480 Multilayer board and a semiconductor device |
| 04/18/2006 | US7030479 Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
| 04/18/2006 | US7030477 Optical semiconductor device |
| 04/18/2006 | US7030445 Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET |
| 04/18/2006 | US7030343 Controller system for bathing installation |
| 04/18/2006 | US7030048 Thick film dielectric compositions for use on aluminum nitride substrates |
| 04/18/2006 | US7030033 Method for manufacturing circuit devices |
| 04/18/2006 | US7029971 Thin film dielectrics for capacitors and methods of making thereof |
| 04/18/2006 | US7029962 Methods for forming a high performance capacitor |
| 04/18/2006 | US7029954 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
| 04/18/2006 | US7029953 Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device |
| 04/18/2006 | US7029761 Bonding layer for bonding resin on copper surface |
| 04/18/2006 | US7029624 High-speed fabrication of highly uniform metallic microspheres |
| 04/18/2006 | US7029529 Method and apparatus for metallization of large area substrates |
| 04/18/2006 | US7029295 Land grid array connector assembly with readily removable pick-up cap |
| 04/18/2006 | US7029292 Electrical connector and contact |
| 04/18/2006 | US7029289 Interconnection device and system |
| 04/18/2006 | US7029288 Electrical contact and connector and method of manufacture |
| 04/18/2006 | US7029284 Floating contact assembly for a steering wheel |
| 04/18/2006 | US7029266 Methods and apparatuses for shaping a printed circuit board |
| 04/18/2006 | US7028867 Conformal coating applicator and method |
| 04/18/2006 | US7028399 Electrically interconnecting each metal wiring interconnects with one another such that each is electrically short-circuited relative to one another; reinforcing conductor starting layer by electrodepositing and separating interconnections between each metal wiring interconnects to avoid short-circuiting |
| 04/18/2006 | US7028398 Contactor, a method of manufacturing the contactor and a device and method of testing electronic component using the contactor |
| 04/18/2006 | US7028397 Method of attaching a semiconductor chip to a chip mounting substrate |
| 04/18/2006 | US7028396 Semiconductor chip pick and place process and equipment |
| 04/18/2006 | US7028391 Method and apparatus for supporting a substrate |
| 04/13/2006 | WO2006039633A2 Structure and method of making interconnect element, and multilayer wiring board including the interconnect element |
| 04/13/2006 | WO2006039246A1 Reliable printed wiring board assembly employing packages with solder joints and related assembly technique |
| 04/13/2006 | WO2006038907A2 Lead-free solder composition for substrates |
| 04/13/2006 | WO2006038547A1 Pressure-sensitive adhesive having its adherence lost by actinic energy radiation, adhesive sheet having its adherence lost by actinic energy radiation obtained by application of the pressure-sensitive adhesive, and process for producing etched metallic material |
| 04/13/2006 | WO2006038496A1 Long film circuit board, and production method and production device therefor |
| 04/13/2006 | WO2006038492A1 Circuit board connecting structure and circuit board manufacturing method |
| 04/13/2006 | WO2006038414A1 Assembled board and assembled board dividing method |
| 04/13/2006 | WO2006038011A2 Active filler particles in inks |
| 04/13/2006 | WO2006037969A1 Strain gauge |
| 04/13/2006 | WO2006037915A1 Component provided with an assembly of hard conductive microtips and method for electrical connection of said component and a component provided with ductile conductive protrusions |
| 04/13/2006 | WO2006037520A1 Wave soldering device |
| 04/13/2006 | WO2005115072A3 Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 04/13/2006 | WO2005054948A3 Device and method for large area lithography |
| 04/13/2006 | WO2005027197A3 Coupler resource module |
| 04/13/2006 | US20060079858 Method and system for non-vascular sensor implantation |
| 04/13/2006 | US20060079609 Heat curable resin composition having a low elastic modulus, heat curable film using same, and cured products |
| 04/13/2006 | US20060079022 Frame attaching process |
| 04/13/2006 | US20060078732 Securing electrical conductors |
| 04/13/2006 | US20060078669 Transfer sheet and wiring board using the same, and method of manufacturing the same |
| 04/13/2006 | US20060077641 Electronic card with braced structure |
| 04/13/2006 | US20060076686 Method for manufacturing an electronic module, and an electronic module |
| 04/13/2006 | US20060076422 Conductive pattern and method of making |
| 04/13/2006 | US20060076388 Method and apparatus for mounting and removing an electronic component |
| 04/13/2006 | US20060076323 Method and apparatus for laser drilling |
| 04/13/2006 | US20060076241 Device and method for electrolytically treating an at least superficially electrically conducting work piece |