| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/06/2006 | US20060072060 Flat display panel and assembly process or driver components in flat display panel |
| 04/06/2006 | US20060071323 Method for processing a thin film substrate |
| 04/06/2006 | US20060071311 Surface-mounted microwave package and corresponding mounting with a multilayer circuit |
| 04/06/2006 | US20060071083 Security tag and process for making same |
| 04/06/2006 | US20060071052 Method and apparatus for determining solder paste composition quality |
| 04/06/2006 | US20060071051 Solder metal, soldering flux and solder paste |
| 04/06/2006 | US20060070978 Method for manufacturing a bump-attached wiring circuit board |
| 04/06/2006 | US20060070493 Fine metal hydride particles, their production process, dispersion containing fine metal hydride particles and metallic material |
| 04/06/2006 | DE19964099B4 Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme A process for producing three-dimensionally arranged leading and connecting structures for volume and energy flows |
| 04/06/2006 | DE19534019B4 Steckkontaktanordnung Plug contact arrangement |
| 04/06/2006 | DE10325884B4 Vorrichtung und Verfahren zum elektrischen Verbinden eines elektrischen Leiters mit einem elektronischen Bauelement Apparatus and method for electrically connecting an electrical conductor to an electronic component |
| 04/06/2006 | DE102004047357A1 Elektrische Anordnung und Verfahren zum Herstellen einer elektrischen Anordnung Electrical arrangement and method for manufacturing an electrical assembly |
| 04/05/2006 | EP1643820A1 Electronic device having a heat resistant circuit board and a connector |
| 04/05/2006 | EP1643819A2 Method of manufacturing a substrate with through electrodes |
| 04/05/2006 | EP1643818A1 Module and method for fabricating the same |
| 04/05/2006 | EP1643817A1 Etching solution, method of etching and printed wiring board |
| 04/05/2006 | EP1643596A2 Interconnect structure |
| 04/05/2006 | EP1643552A1 Module including circuit elements |
| 04/05/2006 | EP1643301A1 Partition-wall structure for forming a conductive pattern by ink jet printing |
| 04/05/2006 | EP1643300A1 Barrier structure for forming a conductive pattern by ink jet printing |
| 04/05/2006 | EP1642484A1 Testing of interconnections between stacked circuit boards |
| 04/05/2006 | EP1642346A1 Light-emitting diode thermal management system |
| 04/05/2006 | EP1642325A2 Method and system for high volume transfer of dies to substrates |
| 04/05/2006 | EP1642176A1 Ground connection of a printed circuit board placed in a wristwatch type electronic device |
| 04/05/2006 | EP1641591A1 Method for separating flat ceramic workpieces with a calculated radiation spot length |
| 04/05/2006 | EP1563720B1 Method for controlled ink-jet spreading of polymers for the insulation and/or protection of printed circuits |
| 04/05/2006 | EP1392093B1 Method for manufacturing ceramic multilayered board |
| 04/05/2006 | EP1218688B1 Method and apparatus for three dimensional inspection of electronic components |
| 04/05/2006 | EP1162867B1 Multilayer printed wiring board and method of producing multilayer printed wiring board |
| 04/05/2006 | EP1038419B1 Manufacturing method of circuit board, manufacturing apparatus for it, and porous sheet used in it |
| 04/05/2006 | EP0817548B1 Printed wiring board and method for manufacturing the same |
| 04/05/2006 | CN2770275Y Improvement of printing circuit board ground plane structure |
| 04/05/2006 | CN1757272A Multi-layer ceramic substrate, method for manufacturng the same and electronic device using the same |
| 04/05/2006 | CN1757271A Process for manufacturing printed circuit boards and a machine for this purpose |
| 04/05/2006 | CN1757270A Forming electromagnetic communication circuit components using densified metal powder |
| 04/05/2006 | CN1757144A Optical module and optical transmission/reception device |
| 04/05/2006 | CN1757139A Anisotropic conductive sheet and its manufacturing method, adaptor device and its manufacturing method, and circuit device electric test instrument |
| 04/05/2006 | CN1757111A Printed wiring board, method for manufacturing same, lead frame package and optical module |
| 04/05/2006 | CN1756716A Carbon nanotube device, process for producing the same and carbon nanotube transcriptional body |
| 04/05/2006 | CN1756654A 薄片材料及布线板 Sheet material and the wiring board |
| 04/05/2006 | CN1756462A Film peeling apparatus and method of manufacturing wiring board |
| 04/05/2006 | CN1756461A Method for forming wiring pattern, wiring pattern, and electronic apparatus |
| 04/05/2006 | CN1756460A High-density BGA printed circuit board wiring method |
| 04/05/2006 | CN1756459A Multilayer structure forming method, method of manufacturing wiring board, and method manufacturing of electronic apparatus |
| 04/05/2006 | CN1756458A Method of manufacturing a wiring substrate and an electronic instrument |
| 04/05/2006 | CN1756456A Pattern formed structure, method of forming pattern, device, electrooptical device and electronic equipment |
| 04/05/2006 | CN1756455A Flexible substrate |
| 04/05/2006 | CN1755919A Circuit device and manufacturing method thereof |
| 04/05/2006 | CN1755909A Bonding head structure of die bonder with plane double-slider parallel connection mechanism and acting process thereof |
| 04/05/2006 | CN1755354A Method for manufacturing composite cermet electrode of oxygen sensor |
| 04/05/2006 | CN1250062C Manufacturing method of modular board |
| 04/05/2006 | CN1250061C Method for producing electronic element with protective box |
| 04/05/2006 | CN1250059C Method for making layer increased circuit board with inner embedded film shape resistor assembly |
| 04/05/2006 | CN1250058C Circuit board producing method and circuit board producing device |
| 04/05/2006 | CN1250057C 信号传输结构 Signal transmission structure |
| 04/05/2006 | CN1250056C Method for processing printed circuit board |
| 04/05/2006 | CN1250055C Printed circuit board and electronic device therewith |
| 04/05/2006 | CN1250032C Oscillator and oscillator character regulating method |
| 04/05/2006 | CN1249901C Heat radiation increased and over current load avoided small sized power supply |
| 04/05/2006 | CN1249856C Holding element for holding carrier board |
| 04/05/2006 | CN1249798C Method for manufacturing mixed integrated circuit device |
| 04/05/2006 | CN1249740C Manufacturing installation for multi-layered electronic parts |
| 04/05/2006 | CN1249673C Hard disk drive comprising flexible printed circuit with damping material |
| 04/05/2006 | CN1248849C Two-layer copper polyimide substrate material |
| 04/05/2006 | CN1248836C Location hole perforating machine |
| 04/05/2006 | CN1248817C Soft brazing method |
| 04/04/2006 | US7024329 Method and apparatus for testing PCBA subcomponents |
| 04/04/2006 | US7024086 System and method for integrating optical layers in a PCB for inter-board communications |
| 04/04/2006 | US7024041 Pattern inspection apparatus and method |
| 04/04/2006 | US7023707 Information handling system |
| 04/04/2006 | US7023705 Ceramic optical sub-assembly for optoelectronic modules |
| 04/04/2006 | US7023291 Oven controlled crystal oscillator for high stability |
| 04/04/2006 | US7023288 Piezoelectric oscillator and its manufacturing method |
| 04/04/2006 | US7023084 Plastic packaging with high heat dissipation and method for the same |
| 04/04/2006 | US7023081 Land pattern configuration |
| 04/04/2006 | US7023073 Noise shield type multi-layered substrate |
| 04/04/2006 | US7022917 Construction and electrical connection technique in textile structures |
| 04/04/2006 | US7022554 Method for fabricating circuit module |
| 04/04/2006 | US7022549 Method for connecting an integrated circuit to a substrate and corresponding arrangement |
| 04/04/2006 | US7022547 Card manufacturing technique and resulting card |
| 04/04/2006 | US7022412 Member having metallic layer, its manufacturing method and its application |
| 04/04/2006 | US7022399 Semiconductor device integrated multilayer wiring board |
| 04/04/2006 | US7022373 Method of forming composite insulating layer and process of producing wiring board |
| 04/04/2006 | US7022276 Method for manufacturing circuit board and circuit board and power conversion module using the same |
| 04/04/2006 | US7022251 Methods for forming a conductor on a dielectric |
| 04/04/2006 | US7021983 Circuit array substrate for display device and method of manufacturing the same |
| 04/04/2006 | US7021946 Connector integrated with a LED element |
| 04/04/2006 | US7021517 Method and device for applying pieces of material to a workpiece |
| 04/04/2006 | US7020961 Method for manufacturing a bump-attached wiring circuit board |
| 04/04/2006 | US7020960 Systems and methods for fabricating printed circuit boards |
| 04/04/2006 | US7020958 Methods forming an integrated circuit package with a split cavity wall |
| 04/04/2006 | US7020956 Method and apparatus for feeding components, and method and apparatus for mounting components |
| 03/30/2006 | WO2006034457A1 Soldering a flexible circuit |
| 03/30/2006 | WO2006033852A2 Structured surface using ablatable radiation sensitive material |
| 03/30/2006 | WO2006033402A1 Method for manufacturing ceramic electronic component |
| 03/30/2006 | WO2006033346A2 Flexible printed wiring board |
| 03/30/2006 | WO2006033315A1 Plating method and plating apparatus |
| 03/30/2006 | WO2006032836A1 Thick-film hybrid production process |
| 03/30/2006 | WO2006032835A2 Electrical circuit package with ceramic substrate, conductive platelet and conductor body |
| 03/30/2006 | WO2006032346A1 Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper |