| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/26/2006 | CN2775993Y Wave peak generator of variable wave peak width |
| 04/26/2006 | CN1765167A Method of determining at least one marking element on a substrate |
| 04/26/2006 | CN1765162A Ceramic multilayer substrate |
| 04/26/2006 | CN1765161A Rigid-flex wiring board |
| 04/26/2006 | CN1765160A Method and device for electrically and mechanically connecting two printed boards |
| 04/26/2006 | CN1765159A Electric connecting part |
| 04/26/2006 | CN1765016A Laminated electronic part and its manufacturing method |
| 04/26/2006 | CN1764992A Composite electronic component |
| 04/26/2006 | CN1764744A Electrolytic copper foil with low roughness surface and process for producing the same |
| 04/26/2006 | CN1764739A Solution for etching copper surfaces and method of depositing metal on copper surfaces |
| 04/26/2006 | CN1764515A Solder paste and printed board |
| 04/26/2006 | CN1764366A Paster heating device for raising and reducing temperature rapidly |
| 04/26/2006 | CN1764352A Thin-film pattern forming method, semiconductor device, electro-optic device, and electronic apparatus |
| 04/26/2006 | CN1764351A Bank structure, method of forming bank structure, device, electro-optical device and electronic apparatus |
| 04/26/2006 | CN1764350A Method for removing resin mask layer and method for manufacturing solder bumped substrate |
| 04/26/2006 | CN1764349A Electroformed metallization |
| 04/26/2006 | CN1764348A Method of manufacturing electrical parts |
| 04/26/2006 | CN1764347A Method of stamping flexible printed circuit board by using non-connecting compound hard tool |
| 04/26/2006 | CN1764346A Method capable of reducing source impedance of printed circuit board |
| 04/26/2006 | CN1764345A Printed circuit board and its processing method |
| 04/26/2006 | CN1764344A Wired circuit board |
| 04/26/2006 | CN1763943A Wiring board and wiring board manufacturing method |
| 04/26/2006 | CN1763935A Printing circuit board and production method and electronic parts |
| 04/26/2006 | CN1763925A Design method for plating of printed circuit board strip and manufacturing method of semiconductor chip package using the same |
| 04/26/2006 | CN1763924A Electronic circuit packaging process |
| 04/26/2006 | CN1763889A Method of manufacturing electroconductive member pattern, and methods of manufacturing electron source and image displaying apparatus each using the same |
| 04/26/2006 | CN1763888A Forming method of stacking structure and manufacturing method of electron source and image display apparatus using such method |
| 04/26/2006 | CN1762706A Wiring pattern formation method, wiring pattern, and electronic device |
| 04/26/2006 | CN1254162C Method for forming circuit folded structure and multilayer printed circuit board and built-in type circuit structure |
| 04/26/2006 | CN1254161C Circuit plate and circuit element, and method for mfg. same |
| 04/26/2006 | CN1254160C Ceramic electronic component and method of producing the same |
| 04/26/2006 | CN1254159C Flexible printing circuit board |
| 04/26/2006 | CN1254154C Electroluminescence sheet |
| 04/26/2006 | CN1253964C 高频模块 High-frequency module |
| 04/26/2006 | CN1253279C Monodisperse spherical metal particles and method for preparing the same |
| 04/25/2006 | US7035591 Ceramic microelectromechanical structure |
| 04/25/2006 | US7035116 Memory system and memory subsystem |
| 04/25/2006 | US7035113 Multi-chip electronic package having laminate carrier and method of making same |
| 04/25/2006 | US7035105 Power module and method for producing the same |
| 04/25/2006 | US7035081 Semiconductor device |
| 04/25/2006 | US7034688 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith |
| 04/25/2006 | US7034652 Electrostatic discharge multifunction resistor |
| 04/25/2006 | US7034544 Methods for minimizing the impedance discontinuity between a conductive trace and a component and structures formed thereby |
| 04/25/2006 | US7034403 Durable electronic assembly with conductive adhesive |
| 04/25/2006 | US7034401 Packaging substrates for integrated circuits and soldering methods |
| 04/25/2006 | US7034389 Flip chip package, circuit board thereof and packaging method thereof |
| 04/25/2006 | US7034231 Method for the manufacture of printed circuit boards with plated resistors |
| 04/25/2006 | US7033934 Method of production of semiconductor package |
| 04/25/2006 | US7033917 Packaging substrate without plating bar and a method of forming the same |
| 04/25/2006 | US7033865 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
| 04/25/2006 | US7033859 Flip chip interconnection structure |
| 04/25/2006 | US7033667 Printed circuits on shrink film |
| 04/25/2006 | US7033468 Elastic contact element |
| 04/25/2006 | US7033463 Substrate plating method and apparatus |
| 04/25/2006 | US7033457 Method of attaching optical waveguide component to printed circuit board |
| 04/25/2006 | US7033187 Electrical connection and component assembly for constitution of a hard disk drive |
| 04/25/2006 | US7033185 Flexible circuit board |
| 04/25/2006 | US7033184 Electrical interconnect device incorporating anisotropically conductive elastomer and flexible circuit |
| 04/25/2006 | US7032825 Flexible display assembly having flexibly connected screen |
| 04/25/2006 | US7032807 Solder contact reworking using a flux plate and squeegee |
| 04/25/2006 | US7032806 Methods of positioning components using liquid prime movers and related structures |
| 04/25/2006 | US7032803 Jet nozzle structure for soldering apparatus |
| 04/25/2006 | US7032513 Printing screen cleaning method and apparatus |
| 04/25/2006 | US7032311 Stabilized wire bonded electrical connections and method of making same |
| 04/25/2006 | US7032309 Method for reinforcing the connection of flat cable member and method for manufacturing image display unit |
| 04/25/2006 | US7032307 Method for fabricating a probe pin for testing electrical characteristics of an apparatus |
| 04/25/2006 | US7032306 Method for producing module |
| 04/25/2006 | US7032305 Method for mounting integrated circuits on a printed circuit card |
| 04/25/2006 | US7032304 Method for conveying printed circuit boards |
| 04/25/2006 | US7032303 Method for mounting electric components on a printed-wiring board |
| 04/25/2006 | US7032298 Apparatus for replacing defective PCB from PCB panel |
| 04/25/2006 | CA2264908C Method for anisotropic etching of structures in conducting materials |
| 04/25/2006 | CA2225478C Electrical contact spring arm positioning arrangement |
| 04/20/2006 | WO2006041583A2 Printed circuit board printing system and method |
| 04/20/2006 | WO2006041161A1 Wiring board and method for manufacturing same |
| 04/20/2006 | WO2006041117A1 Plating material, polyamic acid solution using said plating material, polyimide resin solution, and printed wiring board using them |
| 04/20/2006 | WO2006041068A1 Packaging method of electronic component |
| 04/20/2006 | WO2006040942A1 Multilayer circuit board manufacturing method |
| 04/20/2006 | WO2006040941A1 Laminated ceramic component and method for manufacturing the same |
| 04/20/2006 | WO2006040088A2 Drilling device for drilling contact holes for assembling contact surfaces of a multilayer circuit boards |
| 04/20/2006 | WO2005081594A3 Electronic module and method for the production thereof |
| 04/20/2006 | WO2005067355A3 Patterned circuits and method for making same |
| 04/20/2006 | US20060084852 Flex circuit shielded optical sensor |
| 04/20/2006 | US20060084787 Novel cyanate ester compound, flame-retardant resin composition, and cured product thereof |
| 04/20/2006 | US20060084285 Circuit carrier and production thereof |
| 04/20/2006 | US20060083948 Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods |
| 04/20/2006 | US20060083906 lead-free and Cadmium-free glass; oxides of Ba, Sr, Ca Mg, Cu, P, Zr, Zn, Al, Si, and alkali metals; green tape and a multilayer interconnection |
| 04/20/2006 | US20060083864 Radiation curable hot melt composition and a process for the application thereof |
| 04/20/2006 | US20060083851 Method for making filled epoxy resin compositions |
| 04/20/2006 | US20060082984 Cut via structure for and manufacturing method of connecting separate conductors |
| 04/20/2006 | US20060082976 Electrical circuit having a multilayer printed circuit board |
| 04/20/2006 | US20060082953 Solid electrolytic capacitor and mounting method therefor |
| 04/20/2006 | US20060081977 Ceramic multilayer substrate |
| 04/20/2006 | US20060081974 Electronic part mounting apparatus and method |
| 04/20/2006 | US20060081583 Method and process of contact to a heat softened solder ball array |
| 04/20/2006 | US20060081479 selectively shrinking the features of an organic structure in a uniform and controllable manner using electrochemical desorption; Micro-contact printing such as Dip-Pen Nanolithography (DPN); application of patterned surfaces in fields ranging from microbiology to electronics to catalysis |
| 04/20/2006 | US20060081397 Multilayer circuit board |
| 04/20/2006 | US20060081396 Circuit substrate and method of manufacturing plated through slot thereon |
| 04/20/2006 | US20060080830 Method for replacing defective PCB from PCB panel |
| 04/20/2006 | DE19611407B4 Halbleiterbaustein und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |