| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/30/2006 | WO2005087979A3 A method and a device for deposition of a metal layer on a non-conducting surface of a substrate |
| 03/30/2006 | WO2005084259A3 Dual segment molded lead frame connector for optical transceiver modules |
| 03/30/2006 | WO2004070795A3 Radiation detector assembly |
| 03/30/2006 | WO2003061900A8 Depaneling systems |
| 03/30/2006 | US20060068635 High density connector and method of manufacture |
| 03/30/2006 | US20060068581 Method of forming via hole in resin layer |
| 03/30/2006 | US20060068087 Producing a mixture of a metal powder having a flake morphology and gas;accelerating mixture in a subsonic carrier gas jet through a straight-bore tube; directing the subsonic carrier gas jet onto the substrate; manipulating one of the subsonic carrier gas jet and the substrate for forming conductor |
| 03/30/2006 | US20060065967 Apparatus for singulating and bonding semiconductor chips, and method for the same |
| 03/30/2006 | US20060065538 Alloy composition and plating method |
| 03/30/2006 | US20060065537 Electrolytic copper plating solutions |
| 03/30/2006 | US20060065439 Wiring board and wiring board manufacturing method |
| 03/30/2006 | US20060064871 Method of manufactruing circuit board |
| 03/30/2006 | DE10313517B4 Lösung zum Ätzen von Kupfer, Verfahren zum Vorbehandeln einer Schicht aus Kupfer sowie Anwendung des Verfahrens Solution for etching copper, method for pretreating a layer of copper as well as application of the method |
| 03/30/2006 | DE102005037392A1 Schaltungsplatine und Verfahren zum Herstellen einer Schaltungsplatine Circuit board and method of manufacturing a circuit board |
| 03/30/2006 | DE102004056238B3 Verfahren und Anordnung zur Herstellung von RFID-Tags Method and apparatus for manufacturing RFID tags |
| 03/30/2006 | DE102004045896A1 Transponder has antenna wires on substrate with laterally offset connection to flip chip modules using contact surfaces on connection bridge substrate |
| 03/30/2006 | DE102004045451A1 Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper |
| 03/30/2006 | DE102004044144A1 Verfahren zum Herstellen einer Schaltung A method of manufacturing a circuit |
| 03/30/2006 | DE102004043054A1 Electrical components such as ceramic capacitors are located in plastic moulded protective housing |
| 03/30/2006 | DE102004038305A1 Verfahren zur Herstellung einer elektrisch leitenden Verbindung bei einer T-förmigen oder L-förmigen Leiterplattenkonfiguration A process for producing an electrically conductive connection with a T-shaped or L-shaped circuit board configuration |
| 03/30/2006 | DE10131236B4 Kondensator Capacitor |
| 03/29/2006 | EP1641329A1 Printed wiring board |
| 03/29/2006 | EP1641328A2 Part with electrically conductive paths |
| 03/29/2006 | EP1641096A1 Electric junction box and its assembling process |
| 03/29/2006 | EP1641081A1 Press-fit terminal, printed board connection structure using the press-fit terminal, and electrical connection box |
| 03/29/2006 | EP1640428A1 Adhesive composition for semiconductor device and cover lay film, adhesive sheet, and copper-clad polyimide film each made with the same |
| 03/29/2006 | EP1640338A1 Metal hydride fine particle, method for producing same, liquid dispersion containing metal hydride fine particle, and metallic material |
| 03/29/2006 | EP1640153A1 Multilayer body and method for producing same |
| 03/29/2006 | EP1640074A1 Structure for mounting multi-featured vibration actuator on circuit board |
| 03/29/2006 | EP1639873A2 A method of forming an integrated circuit substrate |
| 03/29/2006 | EP1639872A1 Integrated electromechanical arrangement and method of production |
| 03/29/2006 | EP1639871A1 Method for manufacturing an electrically conductive pattern |
| 03/29/2006 | EP1639870A1 Microelectronic substrates with thermally conductive pathways and methods of making same |
| 03/29/2006 | EP1639793A1 Modular terminal device |
| 03/29/2006 | EP1639614A1 Stretchable fabric switch |
| 03/29/2006 | EP1639545A2 Inspection system for and method of inspecting deposits printed on workpieces |
| 03/29/2006 | EP1639356A2 Biosensor and method of making cross-reference to related applications |
| 03/29/2006 | EP1638781A1 Method for preparing a patterned coating |
| 03/29/2006 | EP1438446A4 System and method for electrolytic plating |
| 03/29/2006 | EP1315975B1 Method and device for testing printed circuit boards with a parallel tester |
| 03/29/2006 | EP1278631A4 Method of making reactive multilayer foil and resulting product |
| 03/29/2006 | CN2768376Y Element fixing jig |
| 03/29/2006 | CN2768375Y Installing structure of flexible printed circuit plate |
| 03/29/2006 | CN2767022Y Regenerated circuit board milling cutter |
| 03/29/2006 | CN1754288A Interposed electrical connector which is intended to connect two stacked electronic circuits and to the method of mounting same |
| 03/29/2006 | CN1754285A Dielectric sheet |
| 03/29/2006 | CN1754254A Semiconductor device and radiation detector employing it |
| 03/29/2006 | CN1754234A Method for manufacturing multilayer electronic component |
| 03/29/2006 | CN1754179A Tamper-indicating rfid antenna |
| 03/29/2006 | CN1754126A Coating fluid for forming wettable pattern and method for producing article having pattern formed thereon |
| 03/29/2006 | CN1753775A Method for producing flexible metal foil-polyimide laminate |
| 03/29/2006 | CN1753755A Device and method for processing electric circuit substrates by laser |
| 03/29/2006 | CN1753752A Jet soldering apparatus |
| 03/29/2006 | CN1753603A Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus |
| 03/29/2006 | CN1753602A Method of adding welding convex block on circuit board |
| 03/29/2006 | CN1753601A Method for mfg. part with printed circuit |
| 03/29/2006 | CN1753600A Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus |
| 03/29/2006 | CN1753599A Printed board and manufacturing method thereof |
| 03/29/2006 | CN1753598A Printed circuit board material for embedded passive devices |
| 03/29/2006 | CN1752744A Check method, mfg. method and check device for distributed substrate |
| 03/29/2006 | CN1752143A Polyamide acidic composition and polyimide/copper foil laminated material |
| 03/29/2006 | CN1248564C Viscous fluid delivering equipment and method, electronic component installing equipment |
| 03/29/2006 | CN1248557C Electronic component-use material and electronic component using it |
| 03/29/2006 | CN1248556C Underlying pattern forming material for electrode and wiring material absorption and application thereof |
| 03/29/2006 | CN1248555C Method for drilling microholes using laser beam |
| 03/29/2006 | CN1248554C Technology for laminating 6-layer circuit board suitable for high-speed signals and its product |
| 03/29/2006 | CN1248553C Technology for laminating 6-layer circuit board and its product |
| 03/29/2006 | CN1248552C Printed circuit board with improved pad structure |
| 03/29/2006 | CN1248551C Circuit board capable of inhibiting electromagnetic interference and its inhibition method |
| 03/29/2006 | CN1248365C Surface mount connector lead part, electronic assembly and forming method thereof |
| 03/29/2006 | CN1248030C Film forming method and apparatus, method and apparatus for producing base plate and electronic equipment |
| 03/29/2006 | CN1247824C Back-end metallisation process |
| 03/29/2006 | CN1247723C Conductive adhesive and assembled structural body by use of said adhesive |
| 03/29/2006 | CN1247698C Resin composition |
| 03/29/2006 | CN1247377C Screen printing device and screen printing method |
| 03/29/2006 | CN1247322C Method and apparatus for member mounting |
| 03/28/2006 | US7020322 Component-mounting method and component-mounting apparatus |
| 03/28/2006 | US7019984 Interconnection system |
| 03/28/2006 | US7019983 Mounting power handling components on printed circuit boards near high density routing channels |
| 03/28/2006 | US7019975 Power module and power module with heat sink |
| 03/28/2006 | US7019959 Method for forming a printed circuit board and a printed circuit board formed thereby |
| 03/28/2006 | US7019848 Three-dimensional measuring instrument, filter striped plate, and illuminating means |
| 03/28/2006 | US7019409 Circuit device |
| 03/28/2006 | US7019408 Stackable ball grid array |
| 03/28/2006 | US7019407 Flip chip package structure |
| 03/28/2006 | US7019404 Multilayered circuit substrate, semiconductor device and method of producing same |
| 03/28/2006 | US7019403 Adhesive film and tacking pads for printed wiring assemblies |
| 03/28/2006 | US7019401 Multi-layer substrate structure for reducing layout area |
| 03/28/2006 | US7019394 Circuit package and method of plating the same |
| 03/28/2006 | US7019393 Electric circuit substrate |
| 03/28/2006 | US7019283 LED burning prevention |
| 03/28/2006 | US7019223 Solder resist opening to define a combination pin one indicator and fiducial |
| 03/28/2006 | US7019221 Printed wiring board |
| 03/28/2006 | US7019220 Supporting device for discrete electric component |
| 03/28/2006 | US7019219 Quadrax to Twinax conversion apparatus and method |
| 03/28/2006 | US7018871 Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods |
| 03/28/2006 | US7018721 Structure for interconnecting conductors and connecting method |
| 03/28/2006 | US7018705 Multilayer circuit board and method for manufacturing the same |
| 03/28/2006 | US7018703 Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
| 03/28/2006 | US7018672 Circuit board producing method and circuit board producing device |