Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2006
06/07/2006CN1784935A Microelectronic substrates with thermally conductive pathways and methods of making same
06/07/2006CN1784807A Coaxial waveguide microstructures and forming method
06/07/2006CN1784785A Module with built-in circuit element
06/07/2006CN1784784A Composite material, electrical circuit or electric module
06/07/2006CN1784753A Circuit protection device
06/07/2006CN1784606A Board for probe card,inspection apparatus,photo-fabrication apparatus and photo-fabrication method
06/07/2006CN1784432A Photocuring/thermosetting inkjet composition and printed wiring board using same
06/07/2006CN1784307A Screen printing device mask overlap mounting method, and screen printing device
06/07/2006CN1784287A Method and apparatus for drilling holes in an electric circuit substrate
06/07/2006CN1784277A Device, die, and method of punching, and method of positioning and fixing punching die
06/07/2006CN1784274A Vibrator and portable terminal device mounted with the vibrator
06/07/2006CN1784141A Method and apparatus for mounting electronic components
06/07/2006CN1784125A Method for producing rigid and flexible printed circuit board
06/07/2006CN1784124A Pattern forming system, pattern forming method, and electronic apparatus
06/07/2006CN1784123A Process for producing electro-optic hybrid circuit board
06/07/2006CN1784122A Flexible printed circuit board apposition method and guide pin
06/07/2006CN1784121A Method of fabricating printed circuit board having thin core layer
06/07/2006CN1784120A Method for realizing reutilization in printed circuit board design
06/07/2006CN1784119A Flexible wiring substrate, method for producing it, semiconductor device and electronic device
06/07/2006CN1784118A Printed circuit board including embedded capacitor and method of fabricating same
06/07/2006CN1784113A COF flexible printed wiring board and method of producing the wiring board
06/07/2006CN1784111A Method and apparatus for manufacturing and probing printed circuit board test access point structures
06/07/2006CN1784110A Electro-optic hybrid circuit board
06/07/2006CN1783468A Electronic component
06/07/2006CN1783467A Electronic packaging body and its soft circuit board
06/07/2006CN1783446A Method for manufacturing semiconductor device
06/07/2006CN1783379A Capacitive/resistive devices and printed wiring boards incorporating such devices, and methods of making thereof
06/07/2006CN1783378A Capacitive/resistive devices and printed wiring boards incorporating such devices, and methods of making thereof
06/07/2006CN1783377A Capacitive/resistive devices, dielectric laminates and printed wiring boards and methods of making thereof
06/07/2006CN1783227A Suspension board with circuit
06/07/2006CN1783115A RFID tag and method of manufacturing the same
06/07/2006CN1782880A Scanner system
06/07/2006CN1781702A Multi-layered structures and methods for manufacturing the multi-layered structures
06/07/2006CN1258959C Forming method of welding convex point
06/07/2006CN1258958C Wiring board having sandwich layer containing inorganic filling
06/07/2006CN1258957C V type slot circuit board
06/07/2006CN1258955C Multi-layer printed circuit board
06/07/2006CN1258954C Manufacturing method for circuit device
06/07/2006CN1258871C Laminated composite device and its manufacture
06/07/2006CN1258836C Differential signal electrical connectors
06/07/2006CN1258826C Packed piezoelectric device and its manufacture method and piezoelectric actuator
06/07/2006CN1258784C Method for mfg. laminated ceramic electronic device, assembly electronic device and laminated ceramic electronic device
06/07/2006CN1258777C High density inductor and method for producing same
06/07/2006CN1258696C Anti-corrosion pattern, its producing method and its use
06/07/2006CN1258428C Fine particle lock jointing method and formed joint
06/07/2006CN1258427C Device for separating welding flux and oxide from melting dreg
06/06/2006US7058474 Multi-layer printed circuit board fabrication system and method
06/06/2006US7057904 Multipart electronic circuit assembly with detachably interconnecting and locking component circuit substrates
06/06/2006US7057896 Power module and production method thereof
06/06/2006US7057891 Heat dissipation structure
06/06/2006US7057829 Lens barrel and imaging apparatus
06/06/2006US7057706 Exposure device
06/06/2006US7057295 IC module assembly
06/06/2006US7057293 Structure comprising a printed circuit board with electronic components mounted thereon and a method for manufacturing the same
06/06/2006US7057292 Solder bar for high power flip chips
06/06/2006US7057290 Electronic parts packaging structure and method of manufacturing the same
06/06/2006US7057279 High-frequency circuit block, its manufacturing method, high-frequency module device, and its manufacturing method
06/06/2006US7057273 Surface mount package
06/06/2006US7057133 Methods of drilling through-holes in homogenous and non-homogenous substrates
06/06/2006US7057115 Multilayered circuit board for high-speed, differential signals
06/06/2006US7057114 Circuit board with added impedance
06/06/2006US7056800 Printed circuit embedded capacitors
06/06/2006US7056448 Method for forming circuit pattern
06/06/2006US7056424 Cathode for electrochemical regeneration of permanganate etching solutions
06/06/2006US7056414 Connecting method for metal material and electric conductive plastic material and product thereby
06/06/2006US7056403 Apparatus for producing non-woven fabric
06/06/2006US7056129 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
06/06/2006US7055936 Structure and method for connecting flexible printed circuit board to inkjet print head
06/06/2006US7055932 Method of filling liquid into function liquid droplet ejection head, and ejection apparatus; method of manufacturing LCD device, organic EL device, electron emission device, PDP device, electrophoretic display device, color filter, and organic EL; and method of forming spacer, metallic wiring, lens, resist, and light diffusion member
06/06/2006US7055747 Long range optical reader
06/01/2006WO2006058324A1 Thermal attach and detach methods and systems for surface-mounted components
06/01/2006WO2006057385A1 Photosensitive resin composition, photosensitive film for permanent resist, method for forming resist pattern, printed wiring board, and semiconductor device
06/01/2006WO2006057205A1 Element mounting substrate and method for manufacturing same
06/01/2006WO2006057175A1 Method for producing substrate having through hole filled with conductive material
06/01/2006WO2006057174A1 Multilayer wiring board and method for manufacturing same
06/01/2006WO2006056808A1 Distortion compensation for printing
06/01/2006WO2006056778A2 Recycling printed circuit boards
06/01/2006WO2006056643A2 Method for manufacturing an electronics module
06/01/2006WO2006056512A1 Electronic device
06/01/2006WO2006056473A2 Improved matched-impedance surface-mount technology footprints
06/01/2006WO2006056153A1 Semiconductor component with a semiconductor chip and outer contacts, and process for producing the same
06/01/2006WO2006055996A2 Process for through hole plating an electrically insulating substrate material
06/01/2006WO2005027200A8 Method and device for contacting vo semiconductor chips on a metallic substrate
06/01/2006US20060116029 Circuit board inter-connection system and method
06/01/2006US20060116005 Reinforced flexible printed circuit board
06/01/2006US20060115994 Pb-free solder-connected structure and electronic device
06/01/2006US20060115989 Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape
06/01/2006US20060115975 Method for attaching an integrated circuit package to a circuit board
06/01/2006US20060115974 Method of making a circuitized substrate
06/01/2006US20060115932 Method for fabricating semiconductor components with conductive vias
06/01/2006US20060115927 Attachment of flip chips to substrates
06/01/2006US20060115670 Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same
06/01/2006US20060115637 Multilayer ceramic substrate and its manufacturing method
06/01/2006US20060115583 Method and apparatus for manufacturing circuit board
06/01/2006US20060115582 Method for manufacturing printed wiring board
06/01/2006US20060114673 Direct mount led lamp
06/01/2006US20060114661 Memory module
06/01/2006US20060113681 Reinforced solder bump structure and method for forming a reinforced solder bump
06/01/2006US20060113680 Microelectronic packages with solder interconnections
06/01/2006US20060113654 Package of a semiconductor device with a flexible wiring substrate and method for the same