| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/10/2006 | CN1770929A Easy-to-maintenance voice transport unit |
| 05/10/2006 | CN1770176A Management system for managing inventory information about printed circuit board |
| 05/10/2006 | CN1769021A Carrier film, method for processing ceramic circuit substrate used the same and method for manufacturing electronic parts |
| 05/10/2006 | CN1256007C Laminated ceramic electronic component and manufacturing method thereof |
| 05/10/2006 | CN1256006C Circuit board |
| 05/10/2006 | CN1255868C Connecting materials |
| 05/10/2006 | CN1255824C Inductive components, laminated electronic components, laminated electronic components modulars and method for mfg. these components and modulars |
| 05/10/2006 | CN1255695C Three-D installed element, its mfg. method and optical transmission device |
| 05/10/2006 | CN1255492C Binding-aid composition, multilayer printed circuit making method and rotary coating copper surface |
| 05/10/2006 | CN1255255C Operation table for punching device and punching device thereof |
| 05/09/2006 | US7043704 Methods and apparatus for verifying circuit board design |
| 05/09/2006 | US7042703 Energy conditioning structure |
| 05/09/2006 | US7042702 Wound capacitor |
| 05/09/2006 | US7042679 Magnetic head device having magnetic head and base plate interconnected by folding flexible wiring board |
| 05/09/2006 | US7042547 Method of repairing pit defect and salient defect of electrode pattern |
| 05/09/2006 | US7042331 Fabrication of thick film electrical components |
| 05/09/2006 | US7042307 Coupler resource module |
| 05/09/2006 | US7042303 Energy conditioning circuit assembly |
| 05/09/2006 | US7042149 Circuit array substrate for display device |
| 05/09/2006 | US7042088 Package structure with two solder arrays |
| 05/09/2006 | US7042087 Hybrid integrated circuit device |
| 05/09/2006 | US7042083 Package substrate and a flip chip mounted semiconductor device |
| 05/09/2006 | US7042080 Semiconductor interconnect having compliant conductive contacts |
| 05/09/2006 | US7042067 Transmission line with integrated connection pads for circuit elements |
| 05/09/2006 | US7041906 Flat flex cable |
| 05/09/2006 | US7041771 Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering |
| 05/09/2006 | US7041589 Metal bump with an insulating sidewall and method of fabricating thereof |
| 05/09/2006 | US7041535 Power module and method of manufacturing the same |
| 05/09/2006 | US7041533 Stereolithographic method for fabricating stabilizers for semiconductor devices |
| 05/09/2006 | US7040914 Electric connecting terminal |
| 05/09/2006 | US7040906 Connection structure between bus bars and relay terminals |
| 05/09/2006 | US7040903 Method of connecting a contact with a solder and an electronic device using the method |
| 05/09/2006 | US7040902 Electrical contact |
| 05/09/2006 | US7040817 Three-dimensional mounted assembly and optical transmission device |
| 05/09/2006 | US7040779 LED lamp assembly |
| 05/09/2006 | US7040526 Electronic parts assembling and testing method, and electronic circuit baseboard manufactured by the method |
| 05/09/2006 | US7040523 Method and apparatus for applying viscous or paste material onto a substrate |
| 05/09/2006 | US7040013 System and method for printed circuit board net routing |
| 05/09/2006 | US7040012 Method of electrically and mechanically connecting electronic devices to one another |
| 05/09/2006 | US7040011 Wiring substrate manufacturing method |
| 05/09/2006 | CA2069495C Catalytic, water-soluble polymeric films for metal coatings |
| 05/04/2006 | WO2006047771A1 Extended terminal ceramic smd |
| 05/04/2006 | WO2006047220A2 Enhanced connection arrangement for co-planar vertical surface mounting of subassemblies on a mother board |
| 05/04/2006 | WO2006046764A1 Exposure method and apparatus |
| 05/04/2006 | WO2006046554A1 Ceramic multilayer substrate and its producing method |
| 05/04/2006 | WO2006046510A1 Multilayer printed wiring board and method for manufacturing multilayer printed wiring board |
| 05/04/2006 | WO2006046461A1 Multilayer substrate incorporating chip type electronic component and production method therefor |
| 05/04/2006 | WO2006045267A1 Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method |
| 05/04/2006 | WO2006045266A1 Method and apparatus for transferring a solder depot arrangement |
| 05/04/2006 | WO2006023926A3 Method for forming radio frequency antenna |
| 05/04/2006 | WO2005087497A3 3d-ink jet structuring of highly topographic surfaces |
| 05/04/2006 | WO2005079249A3 Circuit board mounting bracket |
| 05/04/2006 | US20060094848 Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the same |
| 05/04/2006 | US20060094295 Management system for managing inventory information about printed circuit board |
| 05/04/2006 | US20060094269 Electrical contact and connector and method of manufacture |
| 05/04/2006 | US20060094268 Conductive terminal and the electrical connector using the conductive terminal |
| 05/04/2006 | US20060093622 Erysipelothrix rhusiopathiae-haemophilus parasuis vaccine and methods of using the same |
| 05/04/2006 | US20060093259 Electro-Optical Module Comprising Flexible Connection Cable and Method of Making the Same |
| 05/04/2006 | US20060092421 System and method for attenuating the effect of ambient light on an optical sensor |
| 05/04/2006 | US20060092229 Fluid ejection device having an elongate micro-electromechanical actuator |
| 05/04/2006 | US20060091553 Wiring board and method for producing same |
| 05/04/2006 | US20060091526 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 05/04/2006 | US20060091521 Stacking system and method |
| 05/04/2006 | US20060091019 Method of adhesion of conductive materials, laminate, and adhesive composition |
| 05/04/2006 | US20060090933 Apparatus and method for improving printed circuit board signal layer transitions |
| 05/04/2006 | US20060090932 Solder-bearing wafer for use in soldering operations |
| 05/04/2006 | US20060090928 Printed wiring board for plasma display and process for producing the same |
| 05/04/2006 | US20060090927 Circuit board cam-action standoff connector |
| 05/04/2006 | US20060090819 Tin plating method |
| 05/04/2006 | US20060090657 Support system and method for a screen printing unit |
| 05/04/2006 | US20060090328 Method for manufacturing quartz crystal unit and electronic apparatus having quartz crystal unit |
| 05/04/2006 | DE102004052748A1 Process to apply a two-dimensional hot solder electrically conducting pattern to a substrate surface |
| 05/04/2006 | DE102004050391A1 Verfahren zum Herstellen einer Schicht-Anordnung und Schicht-Anordnung A method for producing a layer arrangement and layer arrangement |
| 05/04/2006 | DE102004047117B3 Bauelement für Leiterplattenbestückung Component for PCB Assembly |
| 05/04/2006 | DE102004036662B3 Verfahren zum Einringen von Durchbrechungen in eine Schablone oder Maske A method for out ahead of perforations in a stencil or mask |
| 05/04/2006 | CA2585195A1 Strip-type assembly comprising a printed conductor structure and electronic components that are connected to said structure, in particular an illumination strip comprising illumination elements |
| 05/03/2006 | EP1653789A1 Printed-wiring board and method of producing the same |
| 05/03/2006 | EP1653788A1 Shadow mask for generating an electrical conductive region on a three-dimensional circuit board |
| 05/03/2006 | EP1652414A1 Support element for a second printed circuit board arranged on a first circuit board |
| 05/03/2006 | EP1652232A1 Multichip circuit module and method for the production thereof |
| 05/03/2006 | EP1652231A1 Device comprising at least one heat source formed by a functional element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sink and made of a thermally conducting material, and thermally conducting material, especially for use in such a device |
| 05/03/2006 | EP1651997A1 Electronic apparatus with a wiring terminal |
| 05/03/2006 | EP1651795A1 Electroless deposition methods and systems |
| 05/03/2006 | EP1651439A1 Device for step-wise lamination of steps |
| 05/03/2006 | EP1584222B1 Placement of a camera module in a portable device |
| 05/03/2006 | EP1442503B1 Assembly comprised of a panel-like constructed module and of a connection unit, production method and device |
| 05/03/2006 | EP1410700A4 Integrated circuit carrier with recesses |
| 05/03/2006 | EP1334647A4 An integrated circuit carrier |
| 05/03/2006 | EP1219693B1 Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same |
| 05/03/2006 | EP1126973A4 Electrically conductive adhesive transfers |
| 05/03/2006 | CN2777906Y Sn damping clamp assembly |
| 05/03/2006 | CN2777905Y Combined circuit board |
| 05/03/2006 | CN2777904Y Micro-adhesive film carried flexible printed circuit board |
| 05/03/2006 | CN2777903Y Flexible printed circuitboard capable of keeping microconnection after die cutting |
| 05/03/2006 | CN1768559A Multilayer printed wiring board |
| 05/03/2006 | CN1768558A Surface treating method for wiring board and method for manufacturing electrical device |
| 05/03/2006 | CN1768557A Circuit board and process for producing the same |
| 05/03/2006 | CN1768454A Anisotropic electrically conductive film and method of producing the same |
| 05/03/2006 | CN1768099A Thermally conductive adhesive composition and process for device attachment |
| 05/03/2006 | CN1768089A Thermosetting resin composition, multilayer body using same, and circuit board |