| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 02/15/2006 | CN1735510A Soundproof thermal shield |
| 02/15/2006 | CN1735475A Laser trimming of resistors |
| 02/15/2006 | CN1735335A System and method for preventing electronic component for tilting in making process |
| 02/15/2006 | CN1735334A Component mounting apparatus |
| 02/15/2006 | CN1735333A Surface mounting machine |
| 02/15/2006 | CN1735321A Circuit board with improved welding plate |
| 02/15/2006 | CN1735320A Method for manufacturing flush type capacitance on printed circuit board and printed circuit board |
| 02/15/2006 | CN1735319A Photomask apparatus, photomask manufacturing method, and mask pattern forming method |
| 02/15/2006 | CN1735318A Flush type resistance manufacturing method and printed circuit board with the same |
| 02/15/2006 | CN1735317A Method for forming COF lead base plate using transfer printing mode |
| 02/15/2006 | CN1735316A Circuit base board |
| 02/15/2006 | CN1734737A Intermetallic spring structure |
| 02/15/2006 | CN1734349A Photosensitive dielectric compositions, tapes, and method of application of a dielectric sheet using the same |
| 02/15/2006 | CN1733980A Electricity conductive liquid capable of directly galvanizing the printed board |
| 02/15/2006 | CN1733469A Flexible metal foil-polyimide laminate and making method |
| 02/15/2006 | CN1733367A Dispensation of controlled quantities of material onto a substrate |
| 02/15/2006 | CN1242664C Parts installation device |
| 02/15/2006 | CN1242663C Radio communication printing circuit plate in the form of an electronic macro-component, corresponding interface structure and transfer method onto a motherboard |
| 02/15/2006 | CN1242661C Method for mfg. multilayer ceramic plate |
| 02/15/2006 | CN1242660C Printed circuit board connection method |
| 02/15/2006 | CN1242659C Process for depositing conducting layer on substrate |
| 02/15/2006 | CN1242658C Flexible printed substrate |
| 02/15/2006 | CN1242657C Improved bonding strength between conductive paste and printed substrate and its production method |
| 02/15/2006 | CN1242474C Power module and air conditioner |
| 02/15/2006 | CN1242472C Welding spot structure for increasing packing reliability |
| 02/15/2006 | CN1242463C Method for mfg. stacked semiconductor device |
| 02/15/2006 | CN1242373C Matrix display device |
| 02/15/2006 | CN1241996C Water-dispersible resin composition for use in boring hole in printed wiring board, sheet made from the same, and method for boring hole in printed wiring board using sheet |
| 02/15/2006 | CN1241989C Resin composition for coating external layer of flexible circuit |
| 02/15/2006 | CN1241976C Semiconductor having themosetting dielectric material and manufacture thereof |
| 02/15/2006 | CN1241734C Resin shaping block |
| 02/14/2006 | US6999643 Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board |
| 02/14/2006 | US6999332 Semiconductor package with a controlled impedance bus and method of forming same |
| 02/14/2006 | US6999299 Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board |
| 02/14/2006 | US6999158 Apparatus for forming pattern |
| 02/14/2006 | US6998943 High-frequency power amplifier |
| 02/14/2006 | US6998861 Wiring board and soldering method therefor |
| 02/14/2006 | US6998738 comprises stable/flat platen and support; miniaturization |
| 02/14/2006 | US6998714 Selectively coating bond pads |
| 02/14/2006 | US6998713 Wiring board and method for producing same |
| 02/14/2006 | US6998705 Semiconductor device, method for mounting the same, and method for repairing the same |
| 02/14/2006 | US6998696 Integrated thin film capacitor/inductor/interconnect system and method |
| 02/14/2006 | US6998572 Light energy processing device and method |
| 02/14/2006 | US6998540 Electrical circuit board and a method for making the same |
| 02/14/2006 | US6998539 Standoff/mask structure for electrical interconnect |
| 02/14/2006 | US6998532 Electronic component-built-in module |
| 02/14/2006 | US6998346 Method for the patterned, selective metallization of a surface of a substrate |
| 02/14/2006 | US6998344 Method for fabricating semiconductor components by forming conductive members using solder |
| 02/14/2006 | US6998339 Method of forming conductor wiring pattern |
| 02/14/2006 | US6998327 Thin film transfer join process and multilevel thin film module |
| 02/14/2006 | US6998308 Substrate for carrying a semiconductor chip and a manufacturing method thereof |
| 02/14/2006 | US6998291 Cost-reducing and process-simplifying wiring board and manufacturing method thereof |
| 02/14/2006 | US6998290 Economical high density chip carrier |
| 02/14/2006 | US6998224 Plasma deposited optical waveguide |
| 02/14/2006 | US6998222 Producing an electrically-conductive structure on a non-planar surface |
| 02/14/2006 | US6997755 Connector and contact wafer |
| 02/14/2006 | US6997737 Soldering structure between a tab of a bus bar and a printed substrate |
| 02/14/2006 | US6997107 Paste container for screen printing and screen printing apparatus |
| 02/14/2006 | US6997043 Integration of atmospheric intrusion sensors in electronic component packages |
| 02/14/2006 | US6996903 Formation of multisegmented plated through holes |
| 02/14/2006 | US6996902 Method for manufacturing a circuit board |
| 02/14/2006 | US6996901 Production method of wired circuit board |
| 02/14/2006 | US6996900 Production method for micro-strip filter |
| 02/14/2006 | US6996899 Electronic assembly and a method of constructing an electronic assembly |
| 02/14/2006 | US6996898 Method of using a self-adjusting printed circuit board support |
| 02/14/2006 | US6996889 Electronic part mounting apparatus and method |
| 02/14/2006 | US6996883 Method of manufacturing a multi-piezoelectric layer ultrasonic transducer for medical imaging |
| 02/09/2006 | WO2006014861A2 Jet printing of patterned metal |
| 02/09/2006 | WO2006013950A1 Solution, material for plating, insulating sheet, laminate and printed wiring board |
| 02/09/2006 | WO2006013895A1 Reflow oven |
| 02/09/2006 | WO2006013230A2 Manufacture of a layer including a component |
| 02/09/2006 | WO2006013145A1 Printed circuit board with smd components and at least one wired component and a method for picking fixing and electrical contacting of said components |
| 02/09/2006 | WO2005124445A3 Rearview mirror element having a circuit mounted to the rear surface of the element |
| 02/09/2006 | WO2005094149A3 Support platform for electrical components, and module comprising said support platform |
| 02/09/2006 | WO2005080633A3 Method for zinc coating aluminum |
| 02/09/2006 | US20060031806 Differential delay-line |
| 02/09/2006 | US20060030197 Structure for controlled shock and vibration of electrical interconnects |
| 02/09/2006 | US20060030170 Micro-bumps to enhance LGA interconnections |
| 02/09/2006 | US20060030147 Selectively coating bond pads |
| 02/09/2006 | US20060030140 Method of making bondable leads using positive photoresist and structures made therefrom |
| 02/09/2006 | US20060030074 Method for connecting substrate and composite element |
| 02/09/2006 | US20060030073 Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components |
| 02/09/2006 | US20060030072 Methods for securing packaged semiconductor devices to carrier substrates |
| 02/09/2006 | US20060029781 Circuitized substrate and method of making same |
| 02/09/2006 | US20060029731 Conductive inks for metalization in integrated polymer microsystems |
| 02/09/2006 | US20060029447 Image forming apparatus and image forming method |
| 02/09/2006 | US20060028655 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
| 02/09/2006 | US20060028222 Interconnect for bumped semiconductor components |
| 02/09/2006 | US20060028035 Bumper-supporting structure of a motor vehicle |
| 02/09/2006 | US20060027913 Shielding for emi-sensitive electronic components and or circuits of electronic devices |
| 02/09/2006 | US20060027728 Method and apparatus for forming metal contacts on a substrate |
| 02/09/2006 | US20060027632 Method for forming metal contacts on a substrate |
| 02/09/2006 | US20060027624 Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux |
| 02/09/2006 | US20060027552 Electrically conductive textile |
| 02/09/2006 | US20060027394 Methods to provide and expose a diagnostic connector on overmolded electronic packages |
| 02/09/2006 | US20060027385 Localized enhancement of multilayer substrate thickness for high Q RF components |
| 02/09/2006 | US20060026834 Method of manufacturing liquid discharge head |
| 02/09/2006 | DE19961537B4 Verfahren zur Herstellung einer Glaskeramiktafel A process for producing a glass-ceramic panel |
| 02/09/2006 | DE102004055511B3 Production process for a power semiconductor module forms solder layer between two partner layers then three hard fixing bridges and melts solder to give exact thickness |
| 02/09/2006 | DE102004033933A1 Verfahren zum Herstellen eines Metall-Keramik-Substrates A method for producing a metal-ceramic substrate |