| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/30/2006 | CA2148040C Polyester shaped articles having an excellent heat stability |
| 05/26/2006 | WO2006055164A2 Multi-functional structural circuits |
| 05/26/2006 | WO2006054701A1 Processing method, processing apparatus, and fine structure produced by the method |
| 05/26/2006 | WO2006054684A1 Printed wiring board and production method of printed wiring borad |
| 05/26/2006 | WO2006054637A1 Wiring board, method for manufacturing same and semiconductor device |
| 05/26/2006 | WO2006054601A1 Multilayer substrate with built-in capacitor, method for manufacturing same, and cold cathode tube lighting device |
| 05/26/2006 | WO2006054354A1 Substrate processing equipment, substrate carrying equipment and substrate processing method |
| 05/26/2006 | WO2006054005A1 Component with buried ductile conductive bumps and method for electric connection between said component and a component provided with hard conductive tips |
| 05/26/2006 | WO2005120823A3 Non-covalent bonding agent for carbon nanotube reinforced polymer composites |
| 05/25/2006 | US20060111008 Method for patterning carbon nanotube coating and carbon nanotube wiring |
| 05/25/2006 | US20060110859 Electronic device and manufacturing method of the same |
| 05/25/2006 | US20060110850 Method for two-stage transfer molding device to encapsulate MMC module |
| 05/25/2006 | US20060110838 Multilayered circuit substrate, semiconductor device and method of producing same |
| 05/25/2006 | US20060110580 Article comprising conductive conduit channels |
| 05/25/2006 | US20060110099 Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical and electrical interconnects and manufacturing methods thereof |
| 05/25/2006 | US20060108717 Method for producing a ceramic substrate |
| 05/25/2006 | US20060108680 Multi-layer printed circuit board wiring layout and method for manufacturing the same |
| 05/25/2006 | US20060108607 Integrated circuit component and mounting method thereof |
| 05/25/2006 | US20060108147 Printed wiring board |
| 05/25/2006 | US20060107524 Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
| 05/25/2006 | US20060107523 Method of making a printed circuit board |
| 05/24/2006 | EP1659841A2 Printed circuit board |
| 05/24/2006 | EP1659840A1 Rigid-flex wiring board and method for producing same |
| 05/24/2006 | EP1659837A1 Contact between a component and a busbar grid |
| 05/24/2006 | EP1658968A2 Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure |
| 05/24/2006 | EP1658760A1 Potting shell |
| 05/24/2006 | EP1658661A2 Lamp base for a high-pressure discharge lamp, and corresponding high-pressure discharge lamp |
| 05/24/2006 | EP1658658A2 A flexible flat cable termination structure for a clockspring |
| 05/24/2006 | EP1658650A1 Forming electrically conductive layers by ink printing |
| 05/24/2006 | EP1658313A1 Photopatterning conductive electrode layers with electrically-conductive polymer |
| 05/24/2006 | EP1545872A4 Method of producing laminates, and laminates |
| 05/24/2006 | EP1525069A4 System and method of laser drilling using a continuously optimized depth of focus |
| 05/24/2006 | EP1293110B1 Electronic ballast for a discharge lamp |
| 05/24/2006 | DE19737787B4 Anzeigeeinrichtung Display device |
| 05/24/2006 | DE102005007405A1 Verfahren zur Herstellung hochdichter gedruckter Leiterplatten A process for producing high density printed circuit boards |
| 05/24/2006 | DE102004055955A1 Anordnung zum Kontaktieren einer in einem Gehäuse integrierten Schaltung Arrangement for contacting an integrated circuit contained in a housing |
| 05/24/2006 | DE102004047045A1 Multilayer printed circuit board fabrication method e.g. for single sided printed circuit board, involves laminating and pressing one circuit layer on insulator coated side of another circuit layer in parallel manner |
| 05/24/2006 | DE102004004741A1 Vorrichtung zur schüttelfesten Aufnahme von elektrischen Sonderbauelementen und/oder elektrischen Schaltungen Device for mounting electrical schüttelfesten special devices and / or electrical circuits |
| 05/24/2006 | DE10157983B4 Positionier- und/oder Laserbearbeitungsverfahren und Vorrichtung Positioning and / or laser machining methods and apparatus |
| 05/24/2006 | DE10063251B4 Kontaktanordnung zur Verbindung eines Steckers mit hoher Kontaktdichte mit einer Leiterplatte Contact arrangement for connecting a connector with high contact density with a circuit board |
| 05/24/2006 | CN2783711Y Ruffer material structure |
| 05/24/2006 | CN2783710Y Magnetic cover for surface installing assembly and surface installing assembly having same |
| 05/24/2006 | CN1778155A Multilayer printed wiring board-use copper-clad laminate sheet, multilayer printed wiring board and production method for multilayer printed wiring board |
| 05/24/2006 | CN1778154A Connection structure of printed wiring board |
| 05/24/2006 | CN1778153A Printed wiring board connection structure |
| 05/24/2006 | CN1778152A Connection structure for printed wiring board |
| 05/24/2006 | CN1778151A Power delivery apparatus, systems, and methods |
| 05/24/2006 | CN1777948A System and method for improving lead wire connection for hard disk driver actuator |
| 05/24/2006 | CN1777827A Optical waveguide, optoelectric hybrid substrate, and optoelectric hybrid substrate producing method |
| 05/24/2006 | CN1777705A Bronzing-surface-treated copper foil, process for producing the same, and electromagnetic wave shielding conductive mesh for front panel of plasma display utilizing the bronzing-surface-treated copper |
| 05/24/2006 | CN1777655A Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards |
| 05/24/2006 | CN1777650A Release film for printed wiring board production |
| 05/24/2006 | CN1777351A System and method for improving tin solder performance of printed circuit board for surface pasting technology |
| 05/24/2006 | CN1777350A Cleaning roller mechanism for flexible circuit board cleaning machine |
| 05/24/2006 | CN1777349A Method for forming wiring pattern, method for manufacturing device, device and electronic equipment |
| 05/24/2006 | CN1777348A Method of fabricating high density printed circuit board |
| 05/24/2006 | CN1776885A Electronic component and method for manufacturing the same |
| 05/24/2006 | CN1776489A Liquid crystal display device with improved the printed circuit board error quantity |
| 05/24/2006 | CN1257662C Integrated material feeder of sheet adhesive machine |
| 05/24/2006 | CN1257437C Exposure device and method for transfering photomask and workpiece |
| 05/24/2006 | CN1257056C Laminated plate and part using laminated plate |
| 05/23/2006 | US7050716 Exposure device |
| 05/23/2006 | US7050303 Semiconductor module with vertically mounted semiconductor chip packages |
| 05/23/2006 | US7050285 Surge protector assembly with ground-connector status indicator circuitry |
| 05/23/2006 | US7050284 Component carrier |
| 05/23/2006 | US7049743 Plant cultivating method, cultivating device, and its lighting device |
| 05/23/2006 | US7049742 Method and structure for substrate having inserted electrodes for flat display device and the device using the structure |
| 05/23/2006 | US7049704 Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board |
| 05/23/2006 | US7049693 Electrical contact array for substrate assemblies |
| 05/23/2006 | US7049692 Stacked semiconductor device |
| 05/23/2006 | US7049639 LED packaging structure |
| 05/23/2006 | US7049527 Conductor-pattern testing method, and electro-optical device |
| 05/23/2006 | US7049526 Microvia structure and fabrication |
| 05/23/2006 | US7049510 Sensor |
| 05/23/2006 | US7049234 Multiple stage electroless deposition of a metal layer |
| 05/23/2006 | US7049224 Manufacturing method of electronic components embedded substrate |
| 05/23/2006 | US7049216 Methods of providing solder structures for out plane connections |
| 05/23/2006 | US7049213 Method for producing a contact substrate and corresponding contact substrate |
| 05/23/2006 | US7049178 Method for fabricating semiconductor package and semiconductor package |
| 05/23/2006 | US7049176 Method of forming thick-film wiring and method of producing laminated electronic component |
| 05/23/2006 | US7049007 thin films comprising metallic carriers, barriers layers, a second metallic layer selected from zinc, copper and cobalt, and/or arsenic, manganese, tin, vanadium, molybdenum, antimony or tungsten, and electrodeposited overcoating, used for printed circuits; electrical and electronic apparatus; multilayer |
| 05/23/2006 | US7048866 Metal/ceramic bonding article and method for producing same |
| 05/23/2006 | US7048594 Terminal |
| 05/23/2006 | US7048553 Electric connector with tine plate |
| 05/23/2006 | US7048547 Plug |
| 05/23/2006 | US7048423 Integrated light and accessory assembly |
| 05/23/2006 | US7048173 Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly |
| 05/23/2006 | US7048172 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device |
| 05/23/2006 | US7047637 Method of manufacture of ceramic composite wiring structures for semiconductor devices |
| 05/23/2006 | US7047636 Method of connecting a connecting member and a flat circuit member |
| 05/23/2006 | US7047635 Mixture of solder material and hydrogen storage material |
| 05/23/2006 | US7047634 Method of making a multilayer wiring board |
| 05/23/2006 | US7047633 Method of using pre-applied underfill encapsulant |
| 05/23/2006 | US7047632 Method of mounting electronic components |
| 05/23/2006 | US7047631 Method for automatable insertion or removal of integrated circuit board |
| 05/23/2006 | US7047630 Method of making circuitized substrate assembly |
| 05/23/2006 | US7047629 Method of manufacturing circuit board |
| 05/23/2006 | US7047628 Impedance matching of differential pair signal traces on printed wiring boards |
| 05/23/2006 | US7047624 Method for producing a tag or a chip card having a coil antenna |
| 05/18/2006 | WO2006053206A1 Single or multi-layer printed circuit board with improved via design |