| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/22/2006 | EP1627901A1 Primer, conductor foil with resin, laminate and process for producing the laminate |
| 02/22/2006 | EP1627424A2 Method of using pre-applied underfill encapsulant |
| 02/22/2006 | EP1627021A1 Method for applying adhesive to a substrate |
| 02/22/2006 | EP1627020A1 Method of inkjet printing a fluorpolymer solution to a substrate and articles therefrom |
| 02/22/2006 | EP1626867A1 Screen printing apparatus and screen printing method |
| 02/22/2006 | EP1350417B1 Method for the production of an electronic component |
| 02/22/2006 | CN2760901Y Wiring carrier board |
| 02/22/2006 | CN2760771Y Collector plate for fuel cell |
| 02/22/2006 | CN1739324A Multi-layer ceramic substrate and method for manufacturing thereof |
| 02/22/2006 | CN1739323A Multilayer wiring board and its manufacturing method |
| 02/22/2006 | CN1739322A Method and apparatus for manufacturing circuit board |
| 02/22/2006 | CN1738927A Metal photo-etching product and production method therefor |
| 02/22/2006 | CN1738894A Composition containing fluorinated hydrocarbons and oxygenated solvents |
| 02/22/2006 | CN1738694A Coating compositions for solder spheres, powders and preforms, methods of production and uses thereof |
| 02/22/2006 | CN1738525A Surface mounting structure |
| 02/22/2006 | CN1738518A Double layer film, production method of double layeer film, production method of printing circuit board |
| 02/22/2006 | CN1738517A Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus |
| 02/22/2006 | CN1738516A Reference position determining method and apparatus for electronic component mounting, printing method and device, mounting and processing method |
| 02/22/2006 | CN1738515A Surface metal pattern orientation deposition method based on ink-jet print |
| 02/22/2006 | CN1738514A High thermal cycle conductor system |
| 02/22/2006 | CN1738513A Printed circuit board including embedded capacitors and method of manufacturing the same |
| 02/22/2006 | CN1738512A 3d circuit module, multilayer 3d circuit module formed thereof and method for manufacturing the circuit modules |
| 02/22/2006 | CN1738040A Cof semiconductor device and a manufacturing method for the same |
| 02/22/2006 | CN1738025A Method for manufacturing trajectory with enlarged capacitive coupling and corresponding trajectory |
| 02/22/2006 | CN1737056A Epoxy resin compositions containing phosphorus and its uses |
| 02/22/2006 | CN1736653A Welding agent for braze, braze method and printing substrate |
| 02/22/2006 | CN1243460C Manufacturing method of circuit formation base plate |
| 02/22/2006 | CN1243393C Composite battery having internal breaker |
| 02/22/2006 | CN1243282C Photosensitive insulation paste and thick film multilayer circuit substrate |
| 02/22/2006 | CN1242868C Welding method of electronic device |
| 02/21/2006 | US7003744 Global equivalent circuit modeling system for substrate mounted circuit components incorporating substrate dependent characteristics |
| 02/21/2006 | US7003477 Certification method for manufacturing process |
| 02/21/2006 | US7002813 Assembly comprised of a panel-like constructed module and of a connection unit, production method and device |
| 02/21/2006 | US7002812 Electronic module and method for fabricating the same |
| 02/21/2006 | US7002807 Electronic component |
| 02/21/2006 | US7002785 Apparatus for protecting electronic circuitry |
| 02/21/2006 | US7002676 Appearance inspection apparatus and the method of inspecting the same |
| 02/21/2006 | US7002663 Both side projection exposure apparatus |
| 02/21/2006 | US7002562 Interconnecting large area display panels |
| 02/21/2006 | US7002447 Fuel tank resistor card having improved corrosion resistance |
| 02/21/2006 | US7002362 Test system for bumped semiconductor components |
| 02/21/2006 | US7002234 Low cost capacitors manufactured from conductive loaded resin-based materials |
| 02/21/2006 | US7002081 Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
| 02/21/2006 | US7002080 for mounting semiconductor chips having finely pitched external connection electrodes and an essentially small thermal expansion coefficient; applicable to semiconductor chip mounting boards, motherboards, probe cards; carbon fiber core |
| 02/21/2006 | US7002075 Intermediate substrate |
| 02/21/2006 | US7002074 Self-leaded surface mount component holder |
| 02/21/2006 | US7001666 A sol gel coating mixture comprising alkoxyzirconium, organosilane coupling agent and an organic acid catalyze, bonding to metal substrate; forming a protective film, resist to heat and corrosion, desired color, gloss, reflectivity |
| 02/21/2006 | US7001662 Transfer sheet and wiring board using the same, and method of manufacturing the same |
| 02/21/2006 | US7001658 Elevated areas of electrically conductive metal (nickel or silver) deposited on thermoplastic polymer( polypyrroles, polyaniline, polythiophenes) pillars, and the conductive material exhibits a resistivity that averages less than 800 ohm/square |
| 02/21/2006 | US7001569 Comprises shrink-suppressing layers on main surface of presintered ceramic; efficiency; electronic |
| 02/21/2006 | US7001539 Metal particles wetted with solvent |
| 02/21/2006 | US7001190 Repairable ball grid array contact |
| 02/21/2006 | US7000845 a substrate for a card with an integrated circuit having on two opposing surfaces electrically conductive layers that are electrically interconnected through the substrate |
| 02/21/2006 | US7000538 Stencil and apparatus for supporting and tensioning the stencil |
| 02/21/2006 | US7000316 Conductor board and method for producing a conductor board |
| 02/21/2006 | US7000314 Method for providing flexible circuit using discrete wiring |
| 02/21/2006 | US7000313 forming metallized vias in a substrate |
| 02/21/2006 | US7000312 Circuit board device and mounting method therefor |
| 02/16/2006 | WO2006017037A1 Connection method of conductive articles, and electric or electronic component with parts connected by the connection method |
| 02/16/2006 | WO2006016650A1 Electrode substrate |
| 02/16/2006 | WO2006016589A1 Method for producing dielectric layer-constituting material, dielectric layer-constituting material produced by such method, method for manufacturing capacitor circuit-forming member using such dielectric layer-constituting material, capacitor circuit-forming member obtained by such method, and multilayer printed wiring boa |
| 02/16/2006 | WO2006016586A1 Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the manufacturing method |
| 02/16/2006 | WO2006016474A1 Method for manufacturing multilayer flex rigid wiring board |
| 02/16/2006 | WO2006016108A1 Pad metallisation process |
| 02/16/2006 | WO2006016107A1 Centrifugal printing apparatus and a method of printing |
| 02/16/2006 | WO2006015793A1 Electrical connection |
| 02/16/2006 | WO2006015528A1 Method of improving soldered joint strengh of the tiny enameled wire in sw |
| 02/16/2006 | WO2005094394A3 Non-chrome plating on plastic |
| 02/16/2006 | WO2005062803A3 Printed circuit dielectric foil and embedded capacitors |
| 02/16/2006 | WO2005056274A3 Method and apparatus for producing a detail |
| 02/16/2006 | WO2005022966A3 A method for pattern metalization of substrates |
| 02/16/2006 | US20060036179 Ultrasound probe wiring method and apparatus |
| 02/16/2006 | US20060035105 A printed circuit board having nonconductive base layer, a layer of copper and/or a copper alloy and a protective overcoating of a tin alloy to safeguard the solderability of the copper; tin alloys containing a gradient of silver, platinum, gold, nickel, bismuth, and/or copper; crystal growth inhibitors |
| 02/16/2006 | US20060035067 Film multilayer body and flexible circuity board |
| 02/16/2006 | US20060035016 Electroless metal deposition methods |
| 02/16/2006 | US20060033873 Liquid crystal device and manufacturing method therefor |
| 02/16/2006 | US20060033872 Structure of liquid crystal display device for easy assembly and disassembly |
| 02/16/2006 | US20060033517 Probe for semiconductor devices |
| 02/16/2006 | US20060033209 Hybrid integrated circuit device |
| 02/16/2006 | US20060033207 Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication |
| 02/16/2006 | US20060033190 Vertically mountable and alignable semiconductor device packages and assemblies including the same |
| 02/16/2006 | US20060032752 Methods and structures for the production of electrically treated items and electrical connections |
| 02/16/2006 | US20060032668 Printed circuit boards and method of producing the same |
| 02/16/2006 | US20060032050 Methods of forming a contact array in situ on a substrate |
| 02/16/2006 | US20060032049 Circuit device manufacturing method |
| 02/16/2006 | DE102005028176A1 Leuchtdiode Light-emitting diode |
| 02/16/2006 | DE102005025947A1 Hierarchisches Modul Hierarchical module |
| 02/16/2006 | DE102005025153A1 LED-Kraftfahrzeugscheinwerfer LED automotive headlamp |
| 02/16/2006 | DE102004063880A1 Electrical or electronic device module, such as flexible printed circuit, has conductive track shaped to give point contact with solder deposit prior to soldering process |
| 02/16/2006 | DE102004045735B3 Laminating press with refined steel plate as heating element in each press plate, with increasd heating power in edge regions of heating element |
| 02/16/2006 | DE102004036890A1 Circuit board device, such as multilayer circuit board for high-frequency signals, has signal hole arranged in filling material within screening hole and through-contacted |
| 02/16/2006 | DE102004018468A1 Verfahren zum strukturierten Aufbringen einer laminierbaren Folie auf ein Substrat für ein Halbleitermodul Method for structured application of a laminatable film on a substrate for a semiconductor module |
| 02/16/2006 | DE102004005022B4 Verfahren zur Herstellung von metallischen Leitbahnen auf elektronischen Bauelementen A process for the production of metallic interconnects to electronic components |
| 02/15/2006 | EP1626615A1 Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the same |
| 02/15/2006 | EP1626614A1 Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film using said method |
| 02/15/2006 | EP1625680A2 Method for optimizing high frequency performance of via structures |
| 02/15/2006 | EP1440608B1 Method for opening the plastic housing of an electronic module |
| 02/15/2006 | EP1038417B1 Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
| 02/15/2006 | EP1025749B1 Process for manufacturing a multi-layer circuit board |
| 02/15/2006 | EP0728788B1 Process for producing photosensitive resin and liquid photosensitive resin composition |