Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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06/15/2006 | US20060128176 Selective application of conductive material to substrates by pick and place of compliant contact arrays |
06/15/2006 | US20060128143 Production method for electronic component and electronic component |
06/15/2006 | US20060128040 Bond positioning method for wire-bonding process and substrate for the bond positioning method |
06/15/2006 | US20060127690 Metal photo-etching product and production method therefor |
06/15/2006 | US20060127685 Layered polyimide/metal product |
06/15/2006 | US20060127653 Chemical etching of polycarbonate films and related applications |
06/15/2006 | US20060127568 Multi-layer ceramic substrate and method for manufacture thereof |
06/15/2006 | US20060126354 Automobile led light |
06/15/2006 | US20060126316 Control circuit board and circuit structural body |
06/15/2006 | US20060126307 Cornerbond assembly comprising three-dimensional electronic modules |
06/15/2006 | US20060126196 Transparent window with non-transparent contact surface for a soldering bonding |
06/15/2006 | US20060126002 Display, method of manufacturing display and apparatus for manufacturing display |
06/15/2006 | US20060125880 Ink nozzle |
06/15/2006 | US20060125641 RFID tags with modifiable operating parameters |
06/15/2006 | US20060125573 Novel radio frequency (RF) circuit board topology |
06/15/2006 | US20060125138 Methods and apparatuses for shaping a printed circuit board |
06/15/2006 | US20060125107 Test system for semiconductor components having conductive spring contacts |
06/15/2006 | US20060125106 Method for fabricating semiconductor components with conductive spring contacts |
06/15/2006 | US20060125103 Information handling system |
06/15/2006 | US20060125083 Multi-layer interconnection circuit module and manufacturing method thereof |
06/15/2006 | US20060125076 Circuit boards, electronic devices, and methods of manufacturing thereof |
06/15/2006 | US20060125075 Flash preventing substrate and method for fabricating the same |
06/15/2006 | US20060124614 Method for soldering miniaturised components to a base plate |
06/15/2006 | US20060124583 Plating a resistive material onto a portion of the insulative substrate which is between the metallic areas, such that the resistive material connects the metallic areas, and thereafter trimming at least a portion of the resistive material from the insulative substrate |
06/15/2006 | US20060124351 Flexible multilayer wiring board and manufacture method thereof |
06/15/2006 | US20060124350 Electronic module comprising an element exposed on one surfce and method for making same |
06/15/2006 | US20060124345 Method for manufacturing board with built-in device and board with built-in device and method for manufacturing printed wiring board and printed wiring board |
06/15/2006 | US20060123627 Method for moving at least two elements of a placement machine as well as such placement machine |
06/15/2006 | US20060123626 Method of making circuitized substrate assembly |
06/14/2006 | EP1670300A2 Printed wiring board and manufacturing method of printed wiring board |
06/14/2006 | EP1670299A2 Electronic component |
06/14/2006 | EP1670298A1 Substrate for a display and method for manufacturing the same |
06/14/2006 | EP1670297A2 Printed circuit board and manufacturing method thereof |
06/14/2006 | EP1670295A2 Ceramic substrate, ceramic package for housing light emitting element |
06/14/2006 | EP1670091A1 Dielectric resonator, oscillator and transmitter/receiver |
06/14/2006 | EP1668967A2 Improved method for micro-roughening treatment of copper and mixed-metal circuitry |
06/14/2006 | EP1668697A2 Electrical circuit apparatus and methods for assembling same |
06/14/2006 | EP1668387A1 Alignment method and apparatus for pixilated detector |
06/14/2006 | EP1668174A2 Plating method and apparatus |
06/14/2006 | EP1667847A1 Lamination through a mask |
06/14/2006 | EP1667807A2 Composite metal matrix castings and solder compositions, and methods |
06/14/2006 | EP1588419A4 Circuit board threadplate |
06/14/2006 | EP1567300B1 Method for soldering miniaturised components to a base plate, a base plate and a substrate |
06/14/2006 | EP1438447B1 Method and conveyorized system for electrolytically processing work pieces |
06/14/2006 | EP1401659B1 Corrosion prevention for cac component |
06/14/2006 | EP1317674B1 Method and device for testing the operativeness of printed circuit boards |
06/14/2006 | EP0969557B1 Connector |
06/14/2006 | DE10204429B4 Elektronische Komponente und Herstellungsverfahren dafür Electronic component and manufacturing method thereof |
06/14/2006 | DE102005059215A1 Siebdruckmaschine und Druckverfahren hierfür Screen printing machine and printing method therefor |
06/14/2006 | DE102005012396B3 Semiconductor chip e.g. flip-chip, mounting method for use on substrate, involves taking chips from sprinkler station and feeding to mounting station, where chips are again taken from initialization station and placed in sprinkler station |
06/14/2006 | DE102004058335A1 Substrat Substratum |
06/14/2006 | DE102004009071B4 Elektrischer Steckverbinder The electrical connector |
06/14/2006 | CN2788521Y Printed circuit board processing machine tool discharging device |
06/14/2006 | CN2788510Y Automatic board brushing machine |
06/14/2006 | CN1788531A Connection structure of inner conductor and multilayer substrate |
06/14/2006 | CN1788530A Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the same |
06/14/2006 | CN1788529A Method and device for aligning a substrate and a printing screen during solder paste printing |
06/14/2006 | CN1788342A Stencil and method for depositing material onto a substrate |
06/14/2006 | CN1788275A Method for mounting an electronic component on a substrate |
06/14/2006 | CN1788062A Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices |
06/14/2006 | CN1787728A 印刷电路板 A printed circuit board |
06/14/2006 | CN1787727A Flexible printed circuit board and method for connecting printed circuit board thereof |
06/14/2006 | CN1787726A Method for drilling deep hole and PCB product obtained by same method |
06/14/2006 | CN1787725A Method for enhancing positioning efficiency of electronic component |
06/14/2006 | CN1787724A Method for disigning of printed circuit board and printed circuit board thereof |
06/14/2006 | CN1787722A Wiring structure for multilayer printed circuit board and mfg. method thereof |
06/14/2006 | CN1787718A Printed circuit board capable of preventing electrostatic discharging |
06/14/2006 | CN1786700A Method for preparing composite thick film sensor of high molecular resistance type |
06/14/2006 | CN1259809C Thin circuit board and method for mfg. same |
06/14/2006 | CN1259802C Element for electromagnetic shielding and method for mfg. thereof |
06/14/2006 | CN1259704C Circuit board manufacturing method and device |
06/14/2006 | CN1259678C Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method |
06/14/2006 | CN1259651C Flexible printed circuit board |
06/14/2006 | CN1259349C Resins curable with actinic radiation, process for production thereof, and photo- and thermo-setting resin composition |
06/14/2006 | CN1259200C Card type recording medium and production method therefor |
06/14/2006 | CN1259172C High performance leadless tin-copper solder for electronic elements |
06/13/2006 | US7062354 Multi-layer printed circuit board fabrication system and method |
06/13/2006 | US7061599 Protective film for base substrates of multi-layered board and method and apparatus for inspecting base substrates |
06/13/2006 | US7061434 Surface mount type chip antenna and communication equipment mounted therewith |
06/13/2006 | US7061342 Differential transmission channel link for delivering high frequency signals and power |
06/13/2006 | US7061257 Probe card assembly |
06/13/2006 | US7061126 Circuit board assembly |
06/13/2006 | US7061124 Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks |
06/13/2006 | US7061122 Components, methods and assemblies for multi-chip packages |
06/13/2006 | US7061116 Arrangement of vias in a substrate to support a ball grid array |
06/13/2006 | US7061095 Printed circuit board conductor channeling |
06/13/2006 | US7061094 Multilayer printed circuit board including first and second signal traces and a first ground trace |
06/13/2006 | US7061084 Lead-bond type chip package and manufacturing method thereof |
06/13/2006 | US7060937 Cartridge-type soldering iron with inert gas emitted near the tip |
06/13/2006 | US7060912 Circuit board and method of making circuit board |
06/13/2006 | US7060911 Conductor strip formed with slit, cutout or grooves |
06/13/2006 | US7060784 Polyimide precursor resin solution composition sheet |
06/13/2006 | US7060604 Multilayer wiring substrate, and method of producing same |
06/13/2006 | US7060601 Packaging substrates for integrated circuits and soldering methods |
06/13/2006 | US7060595 Circuit substrate and fabrication method thereof |
06/13/2006 | US7060537 Microchip controller board manufacturing method |
06/13/2006 | US7060534 Housing for semiconductor devices, semiconductor device pin, and method for the manufacturing of pins |
06/13/2006 | US7060513 Method of testing FPC bonding yield and FPC having testing pads thereon |
06/13/2006 | US7060512 Patching methods and apparatus for fabricating memory modules |
06/13/2006 | US7060421 Conductor track structures and method for production thereof |