Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2006
06/15/2006US20060128176 Selective application of conductive material to substrates by pick and place of compliant contact arrays
06/15/2006US20060128143 Production method for electronic component and electronic component
06/15/2006US20060128040 Bond positioning method for wire-bonding process and substrate for the bond positioning method
06/15/2006US20060127690 Metal photo-etching product and production method therefor
06/15/2006US20060127685 Layered polyimide/metal product
06/15/2006US20060127653 Chemical etching of polycarbonate films and related applications
06/15/2006US20060127568 Multi-layer ceramic substrate and method for manufacture thereof
06/15/2006US20060126354 Automobile led light
06/15/2006US20060126316 Control circuit board and circuit structural body
06/15/2006US20060126307 Cornerbond assembly comprising three-dimensional electronic modules
06/15/2006US20060126196 Transparent window with non-transparent contact surface for a soldering bonding
06/15/2006US20060126002 Display, method of manufacturing display and apparatus for manufacturing display
06/15/2006US20060125880 Ink nozzle
06/15/2006US20060125641 RFID tags with modifiable operating parameters
06/15/2006US20060125573 Novel radio frequency (RF) circuit board topology
06/15/2006US20060125138 Methods and apparatuses for shaping a printed circuit board
06/15/2006US20060125107 Test system for semiconductor components having conductive spring contacts
06/15/2006US20060125106 Method for fabricating semiconductor components with conductive spring contacts
06/15/2006US20060125103 Information handling system
06/15/2006US20060125083 Multi-layer interconnection circuit module and manufacturing method thereof
06/15/2006US20060125076 Circuit boards, electronic devices, and methods of manufacturing thereof
06/15/2006US20060125075 Flash preventing substrate and method for fabricating the same
06/15/2006US20060124614 Method for soldering miniaturised components to a base plate
06/15/2006US20060124583 Plating a resistive material onto a portion of the insulative substrate which is between the metallic areas, such that the resistive material connects the metallic areas, and thereafter trimming at least a portion of the resistive material from the insulative substrate
06/15/2006US20060124351 Flexible multilayer wiring board and manufacture method thereof
06/15/2006US20060124350 Electronic module comprising an element exposed on one surfce and method for making same
06/15/2006US20060124345 Method for manufacturing board with built-in device and board with built-in device and method for manufacturing printed wiring board and printed wiring board
06/15/2006US20060123627 Method for moving at least two elements of a placement machine as well as such placement machine
06/15/2006US20060123626 Method of making circuitized substrate assembly
06/14/2006EP1670300A2 Printed wiring board and manufacturing method of printed wiring board
06/14/2006EP1670299A2 Electronic component
06/14/2006EP1670298A1 Substrate for a display and method for manufacturing the same
06/14/2006EP1670297A2 Printed circuit board and manufacturing method thereof
06/14/2006EP1670295A2 Ceramic substrate, ceramic package for housing light emitting element
06/14/2006EP1670091A1 Dielectric resonator, oscillator and transmitter/receiver
06/14/2006EP1668967A2 Improved method for micro-roughening treatment of copper and mixed-metal circuitry
06/14/2006EP1668697A2 Electrical circuit apparatus and methods for assembling same
06/14/2006EP1668387A1 Alignment method and apparatus for pixilated detector
06/14/2006EP1668174A2 Plating method and apparatus
06/14/2006EP1667847A1 Lamination through a mask
06/14/2006EP1667807A2 Composite metal matrix castings and solder compositions, and methods
06/14/2006EP1588419A4 Circuit board threadplate
06/14/2006EP1567300B1 Method for soldering miniaturised components to a base plate, a base plate and a substrate
06/14/2006EP1438447B1 Method and conveyorized system for electrolytically processing work pieces
06/14/2006EP1401659B1 Corrosion prevention for cac component
06/14/2006EP1317674B1 Method and device for testing the operativeness of printed circuit boards
06/14/2006EP0969557B1 Connector
06/14/2006DE10204429B4 Elektronische Komponente und Herstellungsverfahren dafür Electronic component and manufacturing method thereof
06/14/2006DE102005059215A1 Siebdruckmaschine und Druckverfahren hierfür Screen printing machine and printing method therefor
06/14/2006DE102005012396B3 Semiconductor chip e.g. flip-chip, mounting method for use on substrate, involves taking chips from sprinkler station and feeding to mounting station, where chips are again taken from initialization station and placed in sprinkler station
06/14/2006DE102004058335A1 Substrat Substratum
06/14/2006DE102004009071B4 Elektrischer Steckverbinder The electrical connector
06/14/2006CN2788521Y Printed circuit board processing machine tool discharging device
06/14/2006CN2788510Y Automatic board brushing machine
06/14/2006CN1788531A Connection structure of inner conductor and multilayer substrate
06/14/2006CN1788530A Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the same
06/14/2006CN1788529A Method and device for aligning a substrate and a printing screen during solder paste printing
06/14/2006CN1788342A Stencil and method for depositing material onto a substrate
06/14/2006CN1788275A Method for mounting an electronic component on a substrate
06/14/2006CN1788062A Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices
06/14/2006CN1787728A 印刷电路板 A printed circuit board
06/14/2006CN1787727A Flexible printed circuit board and method for connecting printed circuit board thereof
06/14/2006CN1787726A Method for drilling deep hole and PCB product obtained by same method
06/14/2006CN1787725A Method for enhancing positioning efficiency of electronic component
06/14/2006CN1787724A Method for disigning of printed circuit board and printed circuit board thereof
06/14/2006CN1787722A Wiring structure for multilayer printed circuit board and mfg. method thereof
06/14/2006CN1787718A Printed circuit board capable of preventing electrostatic discharging
06/14/2006CN1786700A Method for preparing composite thick film sensor of high molecular resistance type
06/14/2006CN1259809C Thin circuit board and method for mfg. same
06/14/2006CN1259802C Element for electromagnetic shielding and method for mfg. thereof
06/14/2006CN1259704C Circuit board manufacturing method and device
06/14/2006CN1259678C Electronic component, and electronic apparatus in which the electronic component is mounted and its manufacturing method
06/14/2006CN1259651C Flexible printed circuit board
06/14/2006CN1259349C Resins curable with actinic radiation, process for production thereof, and photo- and thermo-setting resin composition
06/14/2006CN1259200C Card type recording medium and production method therefor
06/14/2006CN1259172C High performance leadless tin-copper solder for electronic elements
06/13/2006US7062354 Multi-layer printed circuit board fabrication system and method
06/13/2006US7061599 Protective film for base substrates of multi-layered board and method and apparatus for inspecting base substrates
06/13/2006US7061434 Surface mount type chip antenna and communication equipment mounted therewith
06/13/2006US7061342 Differential transmission channel link for delivering high frequency signals and power
06/13/2006US7061257 Probe card assembly
06/13/2006US7061126 Circuit board assembly
06/13/2006US7061124 Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks
06/13/2006US7061122 Components, methods and assemblies for multi-chip packages
06/13/2006US7061116 Arrangement of vias in a substrate to support a ball grid array
06/13/2006US7061095 Printed circuit board conductor channeling
06/13/2006US7061094 Multilayer printed circuit board including first and second signal traces and a first ground trace
06/13/2006US7061084 Lead-bond type chip package and manufacturing method thereof
06/13/2006US7060937 Cartridge-type soldering iron with inert gas emitted near the tip
06/13/2006US7060912 Circuit board and method of making circuit board
06/13/2006US7060911 Conductor strip formed with slit, cutout or grooves
06/13/2006US7060784 Polyimide precursor resin solution composition sheet
06/13/2006US7060604 Multilayer wiring substrate, and method of producing same
06/13/2006US7060601 Packaging substrates for integrated circuits and soldering methods
06/13/2006US7060595 Circuit substrate and fabrication method thereof
06/13/2006US7060537 Microchip controller board manufacturing method
06/13/2006US7060534 Housing for semiconductor devices, semiconductor device pin, and method for the manufacturing of pins
06/13/2006US7060513 Method of testing FPC bonding yield and FPC having testing pads thereon
06/13/2006US7060512 Patching methods and apparatus for fabricating memory modules
06/13/2006US7060421 Conductor track structures and method for production thereof