Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2006
05/16/2006US7045011 Dual-layer compliant polymeric nozzle
05/16/2006US7044811 Plug contact having a contact region being accessible from three sides
05/16/2006US7044749 Board-to-board power connector for a projection device
05/16/2006US7044748 Electrical device for interconnecting two printed circuit boards at a large distance
05/16/2006US7043838 A multi-fluid cartridge for holding multiple fluids in segregated containment localities, and cartridge body contains fluid supply paths in fluid flow communication with the containment localities; miniaturization
05/16/2006US7043832 Manufacturing method for fixing tin balls in connectors or IC devices
05/16/2006US7043831 Method for fabricating a test interconnect for bumped semiconductor components by forming recesses and cantilevered leads on a substrate
05/16/2006US7043830 Method of forming conductive bumps
05/16/2006US7043829 Method for assembly of a motherboard into an information handling system chassis
05/16/2006US7043828 Tile-based routing method of a multi-layer circuit board
05/11/2006WO2006050362A2 Method of creating an rfid tag with substantially protected rigid electronic component
05/11/2006WO2006050204A1 Grounded electrical connector for circuit boards
05/11/2006WO2006049751A1 Packaging and manufacturing of an integrated circuit
05/11/2006WO2006049330A1 Exposure equipment
05/11/2006WO2006049069A1 Paste for soldering and soldering method using the same
05/11/2006WO2006048507A1 Printed circuit board, method of manufacturing the same, and electronic device
05/11/2006WO2006048041A1 Flexible carrier with an electrically conducting structure
05/11/2006WO2006048005A1 Flexible multi-layer circuit board provided with opposing flexible conductive structures and method for the production thereof
05/11/2006WO2006034457B1 Soldering a flexible circuit
05/11/2006WO2006033346A3 Flexible printed wiring board
05/11/2006WO2006024441A3 Multilayer body with differently microstructured areas provided with an electroconductive coating
05/11/2006WO2006013230A3 Manufacture of a layer including a component
05/11/2006US20060100822 Recycable electric junction box applicable to automotive vehicles
05/11/2006US20060100314 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
05/11/2006US20060099849 Connection device for flexible circuit
05/11/2006US20060099759 Pattern formation method and pattern formation apparatus, method for manufacturing device, electro-optical device, electronic device, and method for manufacturing active matrix substrate
05/11/2006US20060099739 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
05/11/2006US20060098410 Thermal management system and method for electronic equipment mounted on coldplates
05/11/2006US20060098155 Substrate and a liquid crystal display panel capable of being cut by using a laser and a method for manufacturing the same
05/11/2006US20060097828 Waveguide coupler
05/11/2006US20060097398 Method and structure to reduce risk of gold embrittlement in solder joints
05/11/2006US20060097376 Electronic product, a body and a method of manufacturing
05/11/2006US20060097344 Integrated thin film capacitor/inductor/interconnect system and method
05/11/2006US20060097340 Chip resistor, process for producing the same, and frame for use therein
05/11/2006US20060097246 Passive device structure
05/11/2006US20060096781 Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same
05/11/2006US20060096780 Thin film circuit integrating thick film resistors thereon
05/11/2006US20060096779 Multilayer type printed-wiring board and method of measuring impedance of multilayer type printed-wiring board
05/11/2006US20060096701 Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device
05/11/2006US20060096477 Printing in a medium
05/11/2006US20060096088 Method of manufacturing an encapsulated package for a magnetic device
05/11/2006US20060096087 Method of manufacturing a power module
05/11/2006US20060096086 Real-time monitoring of machine performance
05/11/2006US20060096085 Methods for designing and tuning one or more packaged integrated circuits
05/11/2006US20060096084 Large area alumina ceramic heater
05/11/2006DE19955214B4 Verfahren zum Herstellen von Leiterstrukturen A method for producing conductive structures
05/11/2006DE10296810B4 Laser beam positioning device calculates unknown parameter, for directing laser beam to target position on workpiece, in accordance with distance between coordinates of current and target positions
05/11/2006DE10255896B4 Elektronischer Münzprüfer Electronic coin
05/11/2006DE10255884B4 Düsenanordnung Nozzle assembly
05/11/2006DE102005042546A1 Verfahren und Vorrichtung zum Herstellen und Sondieren von Gedruckte-Schaltungsplatine-Testzugriffspunktstrukturen Method and apparatus for producing and probing of printed circuit board test access point structures
05/11/2006DE102004054223A1 Mehrlagige flexible Leiterplatte mit sich gegenüberliegenden flexiblen Leitstrukturen sowie Verfahren zu deren Herstellung Multilayer flexible printed circuit board having opposing flexible conductive structures and processes for their preparation
05/11/2006DE102004052303A1 Producing functional element structures, especially circuit boards, e.g. for use in mobile telephones, using energy radiation or energy pulses, specifically for chemical conversion of compound in substrate material
05/11/2006DE102004052301A1 Production of strip conductors for circuit boards comprises forming the strip conductors using a energy beam or energy pulse and reinforcing by metallizing
05/11/2006DE102004052300A1 Production of conductor strip structures, especially for conductor plate for PCB by use of energy beam or energy pulses useful in metallizing and in mobile phones
05/11/2006DE10138958B4 Chip-Scale-Packung, gedruckte Leiterplatte, Elektronikmodul und Leiterplatten-Entwurfsverfahren Chip-scale package, printed circuit board, electronic module and printed circuit board design techniques
05/11/2006DE10016064B4 Substrat,Einzelsubstrat und Verfahren zur Herstellung derselben Substrate, single substrate and method of manufacturing the same
05/11/2006CA2552217A1 Flexible carrier with an electrically conducting structure
05/10/2006EP1656007A1 System for managing inventory information about a printed circuit board
05/10/2006EP1656006A1 A substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same
05/10/2006EP1656005A2 A substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same
05/10/2006EP1656004A1 Multilayer printed-circuit board and method of manufacture
05/10/2006EP1655389A1 Metal loading method and device
05/10/2006EP1655094A1 Method and apparatus for dispensing small amounts of liquid material
05/10/2006EP1654916A1 Printed circuit board minimizing undesirable signal reflections in a via and methods therefor
05/10/2006EP1654915A2 Circuit board design
05/10/2006EP1654761A2 Module for epas/ehpas applications
05/10/2006EP1654125A2 Method for producing rfid labels
05/10/2006EP1576703B1 Flat cable harness
05/10/2006EP1417473A4 Confocal 3d inspection system and process
05/10/2006EP1337687B1 Systems and methods for preventing and/or reducing corrosion in various articles
05/10/2006EP1235661B1 Separating and milling device
05/10/2006EP1117283B1 Printed wiring board and its manufacturing method
05/10/2006EP1042540A4 Programmed pulse electroplating process
05/10/2006CN2779801Y An electromagnetic pump type single/double peak generator
05/10/2006CN2779800Y Presser device for printed-circuit board drilling equipment
05/10/2006CN2779799Y Wet-method shaping wrapper
05/10/2006CN2779798Y High-frequency signal transmission device and satellite frequency demultiplier
05/10/2006CN2779796Y Jumper plate for light modulation silicon box
05/10/2006CN1771773A Method for producing circuit-forming board and material for producing circuit-forming board
05/10/2006CN1771772A Multilayer printed wiring board
05/10/2006CN1771771A Multilayer printed wiring board
05/10/2006CN1771770A Wiring board manufacturing method
05/10/2006CN1771769A Soldering method
05/10/2006CN1771768A Electronic part manufacturing method and base sheet
05/10/2006CN1771767A Method for manufacturing an electronic module and an electronic module
05/10/2006CN1771627A Durable electronic assembly with conductive adhesive
05/10/2006CN1771535A An improved electrical connection between a suspension flexure cable and a head stack flexure circuit
05/10/2006CN1771501A Printed circuit board return route check method and printed circuit board pattern design CAD device
05/10/2006CN1771500A Printed circuit board design method, program thereof, recording medium containing the program, printed circuit board design device using them, and CAD system
05/10/2006CN1771274A Resin composition for printed wiring board, prepreg, and laminate obtained with the same
05/10/2006CN1771211A Non-lead glass for forming dielectric, glass ceramic composition for forming dielectric, dielectric, and process for producing laminated dielectric
05/10/2006CN1770974A Method of and apparatus for mounting an electronic part to a substrate
05/10/2006CN1770969A Method of mounting thumbwheel switch on printed circuit board and handheld electronic device incorporating same
05/10/2006CN1770960A Terminal-mounting method for printed circuit board, terminal mounting printed circuit board and electrical junction box
05/10/2006CN1770959A Wiring pattern forming method, film pattern forming method, semiconductor device, electro-optical device, and electronic equipment
05/10/2006CN1770958A Pattern forming configuration and pattern forming method, device and electro-optic device, and electronic equipment
05/10/2006CN1770957A Wiring pattern formation method, manufacturing method for multi layer wiring substrate, and electronic device
05/10/2006CN1770956A Method for making circuit board
05/10/2006CN1770954A Pore column dividing type intercommunicating pore structure and its manufacturing method
05/10/2006CN1770951A Printed circuit board distribution structure