| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/21/2006 | US7014784 Methods and apparatus for printing conductive thickfilms over thickfilm dielectrics |
| 03/21/2006 | US7014731 Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same |
| 03/21/2006 | US7014727 Method of forming high resolution electronic circuits on a substrate |
| 03/21/2006 | US7014479 Electrical contact and connector and method of manufacture |
| 03/21/2006 | US7014478 Electrical connection box and manufacturing method thereof |
| 03/21/2006 | US7014474 Electrical connection and component assembly for constitution of a hard disk drive |
| 03/21/2006 | US7014472 System for making high-speed connections to board-mounted modules |
| 03/21/2006 | US7014333 Small portable flashlight |
| 03/21/2006 | US7014094 Method of reforming reformable members of an electronic package and the resultant electronic package |
| 03/21/2006 | US7013802 Method and apparatus for simultaneous inspection and cleaning of a stencil |
| 03/21/2006 | US7013564 Method of producing an electronic device having a PB free solder connection |
| 03/21/2006 | US7013563 Method of testing spacings in pattern of openings in PCB conductive layer |
| 03/21/2006 | US7013562 Method of using micro-contact imprinted features for formation of electrical interconnects for substrates |
| 03/21/2006 | US7013561 Method for producing a capacitor-embedded circuit board |
| 03/21/2006 | US7013560 Process for fabricating a substrate |
| 03/21/2006 | US7013559 Method of fabricating a semiconductor device package |
| 03/21/2006 | US7013558 Method for shielding an electronic component |
| 03/21/2006 | US7013557 Method of packaging electronic components without creating unnecessary solder balls |
| 03/21/2006 | CA2271028C Method for production of conducting element and conducting element |
| 03/21/2006 | CA2127238C Photopolymerisable compositions |
| 03/16/2006 | WO2006028668A1 Tin/indium lead-free solders for low stress chip attachment |
| 03/16/2006 | WO2006028289A1 Modified polyimide resin and curable resin composition |
| 03/16/2006 | WO2006028098A1 Wiring board |
| 03/16/2006 | WO2006028090A1 Member for interconnecting wiring films and method for producing the same |
| 03/16/2006 | WO2006027947A1 Electroless gold plating pretreatment agent and copper clad laminate for flexible board |
| 03/16/2006 | WO2005122655A3 Pcb including a star shaped through-hole solder pad |
| 03/16/2006 | WO2005099326A3 A method for manufacturing a flexible circuit board having small thickness and flexible board manufactured thereby |
| 03/16/2006 | WO2005094409A3 Process for preparing a non-conductive substrate for electroplating |
| 03/16/2006 | WO2005091365A3 Coupling substrate for semiconductor components and method for the production thereof |
| 03/16/2006 | WO2005038995A3 Memory link processing with picosecond lasers |
| 03/16/2006 | WO2005027200A3 Method and device for contacting vo semiconductor chips on a metallic substrate |
| 03/16/2006 | US20060058472 Functionalized polymer |
| 03/16/2006 | US20060058412 Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereof |
| 03/16/2006 | US20060057902 Solder-bearing articles and method of retaining a solder mass thereon |
| 03/16/2006 | US20060057830 Method for producing bumps on an electrical component |
| 03/16/2006 | US20060057827 Method for manufacturing in electrically conductive pattern |
| 03/16/2006 | US20060057819 Electronic part producing method and electronic part |
| 03/16/2006 | US20060057417 Steel sheet plated by hot dipping with alloyed zinc with excellent adhesion and process for producing the same |
| 03/16/2006 | US20060057340 Composition of a resin of acrylate resin and an epoxy resin, a metal powder of two metals, one low-melting-point metal. and one high-melting-point metal, a phenol-type curing agent and flux; good conductivity and good adhesiveness to substrates |
| 03/16/2006 | US20060057322 Sheeted roll and methods and apparatus for sheeting a roll |
| 03/16/2006 | US20060055649 Liquid crystal display device having a drive IC mounted on a flexible board directly connected to a liquid crystal panel |
| 03/16/2006 | US20060055054 Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure |
| 03/16/2006 | US20060055034 Projected contact structures for engaging bumped semiconductor devices and methods of making the same |
| 03/16/2006 | US20060055020 Stackable ball grid array |
| 03/16/2006 | US20060054870 Dielectric composition for use in circuitized substrates and circuitized substrate including same |
| 03/16/2006 | US20060054867 Conductive particle and adhesive agent |
| 03/16/2006 | US20060054667 Method for supplying solder |
| 03/16/2006 | US20060054602 Laser beam machine and control method of the machine |
| 03/16/2006 | US20060054588 Method of Manufacturing Double-Sided Printed Circuit Board |
| 03/16/2006 | US20060054353 Method and device for protection of a component or module |
| 03/16/2006 | US20060054351 Substrate structure, a method and an arrangement for producing such substrate structure |
| 03/16/2006 | US20060054349 Cof film carrier tape and its manufacturing method |
| 03/16/2006 | US20060054347 Electric conductors |
| 03/16/2006 | US20060054338 Using special visibility materials proximate candidate component locations to enhance recognition |
| 03/16/2006 | US20060054283 Joining apparatus |
| 03/16/2006 | US20060054277 Anisotropic-electroconductive adhesive, circuit connection method and structure using the same |
| 03/16/2006 | US20060054262 Process for producing heat-resistant flexible laminate and heat-resistant flexible laminate produced thereby |
| 03/16/2006 | US20060053624 Method and equipment for mounting part |
| 03/16/2006 | US20060053607 Productoin method for surface-mounted saw device |
| 03/16/2006 | DE19541039B4 Chip-Modul sowie Verfahren zu dessen Herstellung -Chip module and method of producing the |
| 03/16/2006 | DE10297818T5 Anbringen von Flipchips an Substraten Attaching flip chips to substrates |
| 03/16/2006 | DE102005036834A1 Schaltungsplatine und Verfahren zum Herstellen einer Schaltungsplatine Circuit board and method of manufacturing a circuit board |
| 03/16/2006 | DE102005033691A1 Verfahren zur Herstellung einer Basisplatte für eine Schaltungsbaugruppe, Basisplatte für eine Schaltungsbaugruppe, und Schaltungsplatte unter Verwendung der Basisplatte A process for preparing a base plate for a circuit board, base plate for a circuit package and circuit board using the base plate |
| 03/16/2006 | DE102004052909A1 Printed circuit board for weak magnetic field sensor, has outer layers with excitation and detection circuits that are connected to respective circuits on base plate to surround soft magnetic cores, respectively |
| 03/16/2006 | DE102004043747A1 Transponder manufacturing method, involves displacing and fastening antenna aerial on substrate surface by displacement of sonotrode to form antenna, and connecting end piece of aerial with connection surface of chip by thermo compression |
| 03/16/2006 | DE102004040945A1 Verfahren und Vorrichtung zum Beschichten von Leiterplatten Method and apparatus for coating printed circuit boards |
| 03/16/2006 | DE102004037786A1 Leiterplatte mit SMD-Bauteilen und mindestens einem bedrahteten Bauteil sowie ein Verfahren zum Bestücken, Befestigen PCB with SMD components and at least one wired component and a method for fitting, fixing |
| 03/16/2006 | DE102004037629A1 Connector facilitating construction of three-dimensional circuit using circuit boards, comprises conductive surface mounting device with flexural region |
| 03/16/2006 | DE102004035020A1 Laser beam-deflecting device for laser processing machine, has beam splitter arranged in switch beam path and arranged outside of another path, when optical module is found in respective positions |
| 03/16/2006 | CA2579062A1 Capacitor layer-forming material and printed circuit board having internal capacitor circuit obtained by using capacitor layer-forming material |
| 03/15/2006 | EP1635625A2 Substrate manufacturing method and circuit board |
| 03/15/2006 | EP1635624A2 Wired circuit board |
| 03/15/2006 | EP1635390A2 Substrate dividing method |
| 03/15/2006 | EP1634683A2 Method for fabrication of industrial parts having high-aspect-ratio-through-hole section |
| 03/15/2006 | EP1634673A1 Method of producing laser-processed product and adhesive sheet, for laser processing used therefor |
| 03/15/2006 | EP1634486A1 Circuit assembly and method of its manufacture |
| 03/15/2006 | EP1634342A2 Method of fabricating electronic interconnect devices using direct imaging of dielectric material |
| 03/15/2006 | EP1634330A1 Dielectric composite material comprising benzocyclobutene which contains a filler in order to decrease the coefficient of thermal expansion |
| 03/15/2006 | EP1634326A2 Method for producing a ceramic/metal substrate |
| 03/15/2006 | EP1634127A2 Multi functional timepiece module with application specific printed circuit boards |
| 03/15/2006 | EP1633914A2 A fabric interface |
| 03/15/2006 | EP1633823A1 Process |
| 03/15/2006 | EP1633516A2 Rotary tool holder assembly |
| 03/15/2006 | EP1554688A4 Methods of optical filament scribing of circuit patterns with planar and non-planar portions |
| 03/15/2006 | EP1349135B1 Method of forming electrode for flat panel display |
| 03/15/2006 | EP1105941B1 Connector with two rows of terminals having tail portions with similar impedance |
| 03/15/2006 | EP0898603B1 Adhesive compositions and methods of use |
| 03/15/2006 | CN1748448A Multilayer substrate and method for producing same |
| 03/15/2006 | CN1748300A Semiconductor device and radiation detector employing it |
| 03/15/2006 | CN1748299A Semiconductor device and radiation detector employing it |
| 03/15/2006 | CN1747837A System and method for forming a pattern on plain or holographic metallized film and hot stamp foil |
| 03/15/2006 | CN1747799A Compositions and methods for cleaning contaminated articles |
| 03/15/2006 | CN1747630A 基板制造方法和电路板 And a circuit board substrate manufacturing method |
| 03/15/2006 | CN1747629A Production of duoble-face printing circuit board |
| 03/15/2006 | CN1747628A Electric equipment |
| 03/15/2006 | CN1747627A Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board |
| 03/15/2006 | CN1747626A Method for non-electric plating on PCB using photo-catalyst |
| 03/15/2006 | CN1747625A Method of forming wiring pattern, and method of forming source electrode and drain electrode for tft |
| 03/15/2006 | CN1747624A Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet |
| 03/15/2006 | CN1747623A Flexible pcb |