| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/18/2006 | WO2006051916A1 Ceramic multilayer substrate |
| 05/18/2006 | WO2006051889A1 Printed circuit board production method and equipment |
| 05/18/2006 | WO2006051885A1 Bonding method of interposer, and electronic component manufactured by utilizing such method |
| 05/18/2006 | WO2006051821A1 Ceramic multilayer substrate and production method therefor |
| 05/18/2006 | WO2006051693A1 Metal-clad laminate and method for production thereof |
| 05/18/2006 | WO2006050792A1 Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement |
| 05/18/2006 | WO2006050656A1 A HEAT-DISPERSING STRUCTURE FOR THE LEDs LAMP |
| 05/18/2006 | WO2006008701A3 Assembly and method of placing the assembly on an external board |
| 05/18/2006 | US20060105598 Conductive terminal and the electrical connector using the conductive terminal |
| 05/18/2006 | US20060105587 Connector, method for manufacturing the same, and wiring board structure employing it |
| 05/18/2006 | US20060105495 Device and method for reshaping the interconnection elements of an electronic module using the stress reflow method and, in particular, for restoring the flatness thereof |
| 05/18/2006 | US20060105190 High rigidity and high heat resistance and good releasability from a roughened copper foil surface, which is subjected to surface oxidization or etching treatment with acid, such as a black oxidized copper foil surface; suitable as a release film for producing multi-layer printed wiring board |
| 05/18/2006 | US20060104854 Lead-free solder, and a lead-free joint |
| 05/18/2006 | US20060104037 Multi-functional structural circuits |
| 05/18/2006 | US20060103019 Socket grid array |
| 05/18/2006 | US20060103005 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate |
| 05/18/2006 | US20060102990 Carrier for substrate film |
| 05/18/2006 | US20060102879 Methods to stop copper attach by alkaline etching agents such as ammonia and monoethanol amine (MEA) |
| 05/18/2006 | US20060102690 Lead-free solder and soldered article |
| 05/18/2006 | US20060102383 Method of fabricating high density printed circuit board |
| 05/18/2006 | US20060102382 Manufacturing method of electronic part and wiring substrate |
| 05/18/2006 | US20060102213 Nozzle arrangement |
| 05/18/2006 | US20060102195 Method of cleaning substrate |
| 05/18/2006 | US20060101640 Method of fabricating rigid-flexible printed circuit board |
| 05/18/2006 | US20060101639 Method of making innerlayer panels and printed wiring boards using X-ray identification of fiducials |
| 05/18/2006 | US20060101638 Method and structure for creating printed circuit boards with stepped thickness |
| 05/18/2006 | DE4341691B4 Verfahren zum Einsetzen eines elektrischen Drahtverbindungsanschlusses in eine gedruckte Schaltungsplatte A method for inserting an electric wire connecting terminal into a printed circuit board |
| 05/18/2006 | DE112005000014T5 Innenleiterverbindungsstruktur und Mehrschichtsubstrat Inner conductor connection structure and multi-layer substrate |
| 05/18/2006 | DE10353042B4 Verfahren zur Verifizierung von Haarrissen in einer Lötstelle, die ein Bauteil mit einer Leiterplatte verbindet A method of verification of hairline cracks in a solder joint connecting a component to a circuit board |
| 05/18/2006 | DE10347450B4 Keramiksubstrate mit integrierten mechanischen Strukturen zum direkten Fassen von optischen Bauelementen Ceramic substrates with integrated mechanical structures for direct grasp of optical components |
| 05/18/2006 | DE10343821B4 Verfahren zur Abschirmung von Bauelementen beim Laserschweißen Method for shielding components in laser welding |
| 05/18/2006 | DE10245635B4 Siebdruckvorrichtung und Siebdruckverfahren Screen printer and screen printing method |
| 05/18/2006 | DE10232612B4 Vorrichtung und Verfahren zur Überwachung eines elektrolytischen Prozesses Apparatus and method for monitoring an electrolytic process |
| 05/18/2006 | DE102004055061A1 Verfahren zur Anordnung eines Flip-Chips auf einem Substrat A process for the assembly of a flip chip on a substrate |
| 05/18/2006 | DE102004050429B3 Device for defined placement of solder powder on component e.g. substrate or circuit board, uses immersion devices with recess for receiving soldering flux |
| 05/18/2006 | DE10134944B4 Elektrische Anschlußklemme The electrical terminal |
| 05/18/2006 | DE10038424B4 Elektronisches Bauelement mit Anschluss und Anschlussklemme Electronic device with connection and terminal |
| 05/18/2006 | CA2585168A1 Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit |
| 05/17/2006 | EP1657971A1 Assembly of an electronic component and a flexible circuit board |
| 05/17/2006 | EP1657758A2 Light emitting diode with molded lens and method of manufacturing the same |
| 05/17/2006 | EP1657725A1 Insulation-coated electroconductive particles |
| 05/17/2006 | EP1657659A1 Printed circuit board return route check method and printed circuit board pattern design cad device |
| 05/17/2006 | EP1657324A1 Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement |
| 05/17/2006 | EP1657074A1 Method for making a thermal transfer donor element |
| 05/17/2006 | EP1657059A2 Piezoelectric actuator, method for manufacturing piezoelectric actuator, and liquid transporting apparatus |
| 05/17/2006 | EP1656718A1 Improved method for crimping at least one connector contact on a flexible electronic circuit |
| 05/17/2006 | EP1656256A1 Screen printing apparatus |
| 05/17/2006 | EP1565268B1 Nozzle arrangement |
| 05/17/2006 | EP1543704B1 Printing process and solder mask ink composition |
| 05/17/2006 | EP1515976B1 Dicopper(i)oxalate complexes for use as precursor substances in metallic copper deposition |
| 05/17/2006 | EP1470528B1 Method for manufacturing rfid labels |
| 05/17/2006 | EP1436445B1 Process for making thin film porous ceramic-metal composites and composites obtained by this process |
| 05/17/2006 | CN2781715Y Dismounting device for cover |
| 05/17/2006 | CN1774965A Module component and method for manufacturing the same |
| 05/17/2006 | CN1774963A Process for producing multilayer printed wiring board and multilayer printed wiring board |
| 05/17/2006 | CN1774962A Discharging solution, method for producing patterns and method for producing an electronic device using the discharging solution, and electronic device |
| 05/17/2006 | CN1774961A Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor |
| 05/17/2006 | CN1774960A Technique for accommodating electronic components on a multilayer signal routing device |
| 05/17/2006 | CN1774959A Electomagnetic interference shielding for a printed circuit board |
| 05/17/2006 | CN1774835A Grouped element transmission channel link with pedestal aspects |
| 05/17/2006 | CN1774804A EMI shielding for electronic component packaging |
| 05/17/2006 | CN1774800A Metal-base circuit board and its manufacturing method |
| 05/17/2006 | CN1774304A Improved coating for silver plated circuits |
| 05/17/2006 | CN1774165A Electronic control unit |
| 05/17/2006 | CN1774157A Circuit board plug socket material equating method and equipment |
| 05/17/2006 | CN1774156A Method and device for holding sheet-like workpiece |
| 05/17/2006 | CN1774155A Printed wiring board for plasma display and process for producing the same |
| 05/17/2006 | CN1772949A Laser induced selective chemical plating process |
| 05/17/2006 | CN1256861C Surface mounting base for printed circuit board assembly |
| 05/17/2006 | CN1256857C Method for producing copper-resin composite material |
| 05/17/2006 | CN1256856C Electronic elements and manufacture thereof |
| 05/17/2006 | CN1256761C Contact component and its manufacture and probe contact assembly using the contact component |
| 05/17/2006 | CN1256719C Suspension board with circuit |
| 05/17/2006 | CN1256620C Method for forming pattern thin film electric conduction structure on base plate |
| 05/17/2006 | CN1256465C Cathode for electrochemical regeneration of permanganate etching solutions |
| 05/17/2006 | CN1256236C Electrolyte copper foil having carrier foil, making method thereof, and layered plate using the same |
| 05/16/2006 | US7046870 Method of fabricating multi-layered printed circuit board for optical waveguides |
| 05/16/2006 | US7046522 Method for scalable architectures in stackable three-dimensional integrated circuits and electronics |
| 05/16/2006 | US7046518 Power module |
| 05/16/2006 | US7046512 Operating circuit for a lamp with a heat sink |
| 05/16/2006 | US7046501 Capacitor-embedded substrate |
| 05/16/2006 | US7046266 Scanner system |
| 05/16/2006 | US7046200 Surface-mounted antenna apparatus |
| 05/16/2006 | US7046100 Direct current cut structure |
| 05/16/2006 | US7045902 Circuitized substrate for fixing solder beads on pads |
| 05/16/2006 | US7045889 Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
| 05/16/2006 | US7045881 Electronic component with shielding and method for its production |
| 05/16/2006 | US7045720 Component lead system |
| 05/16/2006 | US7045718 Arrangement consisting of a circuit carrier and a printed circuit board or a printed circuit board assembly |
| 05/16/2006 | US7045712 Method of producing an electronic device and electronic device |
| 05/16/2006 | US7045562 Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls |
| 05/16/2006 | US7045460 Method for fabricating a packaging substrate |
| 05/16/2006 | US7045393 Method for manufacturing circuit devices |
| 05/16/2006 | US7045392 Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment |
| 05/16/2006 | US7045390 Stacked die package |
| 05/16/2006 | US7045389 Method for fabricating a semiconductor devices provided with low melting point metal bumps |
| 05/16/2006 | US7045388 Semiconductor device provided with low melting point metal bumps |
| 05/16/2006 | US7045246 Integrated thin film battery and circuit module |
| 05/16/2006 | US7045198 Prepreg and circuit board and method for manufacturing the same |
| 05/16/2006 | US7045174 Method and device for insulating electro-technical components |