| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/13/2006 | US7060418 Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit |
| 06/13/2006 | US7060364 Film carrier tape for mounting electronic devices thereon |
| 06/13/2006 | US7060349 Resin composition, process for producing the same and electrophotographic fixing member |
| 06/13/2006 | US7059940 Jet singulation |
| 06/13/2006 | US7059872 Connector |
| 06/13/2006 | US7059707 Ink jet print head |
| 06/13/2006 | US7059049 Electronic package with optimized lamination process |
| 06/13/2006 | US7059047 Sockets for “springed” semiconductor devices |
| 06/13/2006 | US7059045 Method for handling integrated circuit die |
| 06/13/2006 | US7059044 Method and material for manufacturing circuit-formed substrate |
| 06/13/2006 | US7059043 Method for mounting an electronic part by solder position detection |
| 06/13/2006 | US7059042 Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink |
| 06/13/2006 | US7059041 Methods for producing passive components on a semiconductor substrate |
| 06/13/2006 | US7059040 Optical module with lens integral holder fabrication method |
| 06/13/2006 | US7059039 Method for producing printed wiring boards |
| 06/08/2006 | WO2006060520A2 Membrane-limited selective electroplating of a conductive surface |
| 06/08/2006 | WO2006060485A1 Methods for assembling a stack package for high density integrated circuits |
| 06/08/2006 | WO2006059951A1 Resonator for a voltage controlled oscillator and manufacturing method thereof |
| 06/08/2006 | WO2006059924A1 A printed circuit board with combined digital and high frequency applications |
| 06/08/2006 | WO2006059907A2 Carrier for electrical components with soldered-on cooling body |
| 06/08/2006 | WO2006059750A1 Curable resin composition |
| 06/08/2006 | WO2006059732A1 Interposer bonding device |
| 06/08/2006 | WO2006059731A1 Electronic component production method and electronic component production equipment |
| 06/08/2006 | WO2006059706A1 Printed board and designing method therefor and ic package terminal designing method and connecting method therefor |
| 06/08/2006 | WO2006059534A1 Pattern forming material and pattern forming method |
| 06/08/2006 | WO2006059532A1 Material for pattern formation, apparatus for pattern formation, and method for pattern formation |
| 06/08/2006 | WO2006059428A1 Process for producing multilayer wiring board |
| 06/08/2006 | WO2006059427A1 Multilayer printed circuit board and method for manufacturing same |
| 06/08/2006 | WO2006058799A1 Envelopment of components arranged on a substrate |
| 06/08/2006 | WO2006032835A3 Electrical circuit package with ceramic substrate, conductive platelet and conductor body |
| 06/08/2006 | WO2005104226A3 Method for production of through-contacts in a plastic mass and semiconductor component with said through contacts |
| 06/08/2006 | US20060121732 Circuit package and method of plating the same |
| 06/08/2006 | US20060121722 Method of making printed circuit board with varying depth conductive holes adapted for receiving pinned electrical components |
| 06/08/2006 | US20060121697 Substrate dividing method |
| 06/08/2006 | US20060121649 Methods for fabricating stiffeners for flexible substrates |
| 06/08/2006 | US20060121272 Thermo-activated adhesive material for fpcb agglutinations |
| 06/08/2006 | US20060121199 Method of forming a metal thin film in a micro hole by ink-jet printing |
| 06/08/2006 | US20060120056 Circuit component module, electronic circuit device, and method for manufacturing the circuit component module |
| 06/08/2006 | US20060120054 Electronics housing with integrated thermal dissipater |
| 06/08/2006 | US20060120015 Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards |
| 06/08/2006 | US20060120012 Capacitor device and fabricating method thereof |
| 06/08/2006 | US20060119001 Method for encasing plastic array packages |
| 06/08/2006 | US20060118940 Semiconductor device and method of fabricating the same |
| 06/08/2006 | US20060118938 Mold assembly, method and a package stack via bottom-leaded plastic (BLP) packaging |
| 06/08/2006 | US20060118905 Electronic part and manufacturing method thereof |
| 06/08/2006 | US20060118830 MSD raised metal interface features |
| 06/08/2006 | US20060118457 Film carrier tape for mounting electronic component |
| 06/08/2006 | US20060118424 Method for Manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board |
| 06/08/2006 | US20060118331 Printed circuit boards for use in optical transceivers |
| 06/08/2006 | US20060118329 Wiring base board, method of producing thereof, and electronic device |
| 06/08/2006 | US20060118233 System and method for forming high resolution electronic circuits on a substrate |
| 06/08/2006 | US20060118229 RFID label, method for producing the RFID label, device for producing the RFID label, sheet member (tag sheet) used for the RFID label, and cartridge attached to the device for producing the RFID label |
| 06/08/2006 | US20060118133 Board cleaning method, board cleaning apparatus, and component mounting method |
| 06/08/2006 | US20060117561 Conductor board and method for producing a conductor board |
| 06/08/2006 | US20060117560 Component mounting order optimization method, component mounting order optimization program, recording medium for the program, and component mounting apparatus using the method |
| 06/08/2006 | DE20122579U1 Arrangement for mounting electronic circuits on circuit bearer has continuous conveyor belt running from circuit fitting point to transition point of thermal fixing station |
| 06/08/2006 | DE19814428B4 Leiterplatte mit großflächigen, mit Lotdepots versehenen Kontaktierungsflächen (Lotpads) PCB with large, provided with solder deposits pads (solder pads) |
| 06/08/2006 | DE102005052986A1 Wieder verwendbarer elektrischer Anschlusskasten für Kraftfahrzeuge Reusable electrical connection box for motor vehicles |
| 06/08/2006 | DE102004058209A1 Verfahren und Vorrichtung zur Erzeugung von Strukturen aus Funktionsmaterialien Method and apparatus for producing structures from functional materials |
| 06/08/2006 | DE102004057505A1 Electrical functional component for vehicles has ribbon cable with three electrical conductors which are embedded in insulation layer and runs parallel to each other |
| 06/08/2006 | DE102004054063B3 Process to produce a crack free connection between two components of different thermal coefficients of expansion such a power semiconductor and heat sink uses hot gas spray |
| 06/08/2006 | DE10164879B4 Verdrahtungssubstrat Wiring substrate |
| 06/07/2006 | EP1667510A1 Method for manufacturing double-sided printed glass board |
| 06/07/2006 | EP1667509A1 Method for manufacturing double-sided printed glass board |
| 06/07/2006 | EP1667508A1 Ceramic circuit board, method for making the same, and power module |
| 06/07/2006 | EP1667507A1 A multilayer printed circuit board and a process for manufacturing the same |
| 06/07/2006 | EP1667506A1 Electroless plating solution, electroless plating process, and printed circuit board |
| 06/07/2006 | EP1667505A1 Electroplating process and process for producing a circuit board by electroplating |
| 06/07/2006 | EP1667504A1 Process for manufacturing a multilayer printed circuit board, and multilayer printed circuit board |
| 06/07/2006 | EP1667503A1 Metal pattern and process for producing the same |
| 06/07/2006 | EP1667502A2 Printed wiring board and method of manufacturing the same |
| 06/07/2006 | EP1667325A1 Programmable logic device with unified cell structure including signal interface bumps |
| 06/07/2006 | EP1667225A1 Interposer and multilayer printed wiring board |
| 06/07/2006 | EP1667220A1 RFID tag and method of manufacturing the same |
| 06/07/2006 | EP1667206A1 Thick-film capacitors and methods of making them |
| 06/07/2006 | EP1666556A1 Adhesive aid composition |
| 06/07/2006 | EP1666516A1 Latent hardener |
| 06/07/2006 | EP1666408A1 Metal nanoparticle and method for producing same, liquid dispersion of metal nanoparticle and method for producing same, metal thin line, metal film and method for producing same |
| 06/07/2006 | EP1666175A1 Metal nano particle liquid dispersion capable of being sprayed in fine particle form and being applied in laminated state |
| 06/07/2006 | EP1665915A1 High reliability multilayer circuit substrates and methods for their formation |
| 06/07/2006 | EP1665914A1 Printed circuit board comprising a holding device for retaining wired electronic components, method for the production of such a printed circuit board, and use thereof in a soldering furnace |
| 06/07/2006 | EP1665913A2 Method and system for creating fine lines using ink jet technology |
| 06/07/2006 | EP1665912A1 Methods and devices for manufacturing of electrical components and laminated structures |
| 06/07/2006 | EP1665911A1 Thin-film assembly and method for producing said assembly |
| 06/07/2006 | EP1665887A1 Warming apparatus with heater produced by pcb |
| 06/07/2006 | EP1665378A1 Chip on flex tape with dimension retention pattern |
| 06/07/2006 | EP1665360A2 Processes for fabricating conductive patterns using nanolithography as a patterning tool |
| 06/07/2006 | EP1665345A2 Improved copper bath for electroplating fine circuitry on semiconductor chips |
| 06/07/2006 | EP1665333A2 Coupler resource module |
| 06/07/2006 | EP1664817A1 A method of manufacturing an electronic device and an electronic device |
| 06/07/2006 | EP1664382A1 Adhesion promotion in printed circuit boards |
| 06/07/2006 | EP1663569A2 Closed loop backdrilling system |
| 06/07/2006 | EP1663513A2 Deposition and patterning process |
| 06/07/2006 | EP1527121B1 Liquid crystalline polymer compositions |
| 06/07/2006 | EP1465746B1 Solder-dross mixture separation method and apparatus |
| 06/07/2006 | EP1332867B1 Film with multilayered metal and process for producing the same |
| 06/07/2006 | EP1060574B1 A differential line driver |
| 06/07/2006 | EP0776150B1 Printed wiring board |
| 06/07/2006 | CN2786910Y Printed circuit compound board |
| 06/07/2006 | CN1784936A Electronic system, printed circuit and radiocommunication module comprising a coaxial connector and corresponding assembly method |