| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 03/28/2006 | US7018494 Method of producing a composite sheet and method of producing a laminate by using the composite sheet |
| 03/28/2006 | US7018243 Connector |
| 03/28/2006 | US7018219 Interconnect structure and method for connecting buried signal lines to electrical devices |
| 03/28/2006 | US7018217 Structurally integrable electrode and associated assembly and fabrication method |
| 03/28/2006 | US7017822 Low cost RFID antenna manufactured from conductive loaded resin-based materials |
| 03/28/2006 | US7017815 Compact externally-driven scanner |
| 03/28/2006 | US7017795 for advanced interconnection of electronic and/or mechanical parts when the two joining parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity; low modulus, high strength |
| 03/28/2006 | US7017636 Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device |
| 03/28/2006 | US7017489 Methods and apparatus for changing web material in a stencil printer |
| 03/28/2006 | US7017265 Method for manufacturing multilayer wiring board, and multilayer wiring board manufactured thereby |
| 03/28/2006 | US7017264 Method of manufacturing multilayer wiring board |
| 03/28/2006 | US7017263 Electronic component mounting method |
| 03/28/2006 | US7017262 Component alignment methods |
| 03/28/2006 | US7017261 Component suction device, component mounting apparatus and component mounting method |
| 03/28/2006 | US7017248 Device for coupling PCB sheet |
| 03/28/2006 | CA2386172C Patterned laminates and electrodes with laser defined features |
| 03/28/2006 | CA2347568C Circuit board and method of manufacturing a circuit board |
| 03/23/2006 | WO2006032035A1 Method of attaching a solder element to a contact and the contact assembly formed thereby |
| 03/23/2006 | WO2006030665A1 Solder paste and electronic device using same |
| 03/23/2006 | WO2006030176A1 Machining spindles and shafts |
| 03/23/2006 | WO2005064228A3 Lighting device of discharge lamp, illumination apparatus and illumination system |
| 03/23/2006 | WO2005037418A3 Processes for fabricating conductive patterns using nanolithography as a patterning tool |
| 03/23/2006 | US20060063367 Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device |
| 03/23/2006 | US20060063366 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 03/23/2006 | US20060063325 Embedded capacitor structure in circuit board and method for fabricating the same |
| 03/23/2006 | US20060063303 Packaging method, packaging structure and package substrate for electronic parts |
| 03/23/2006 | US20060062979 Circuit board and a power module employing the same |
| 03/23/2006 | US20060061974 Solder foil semiconductor device and electronic device |
| 03/23/2006 | US20060061019 suppressing deformation at firing; laminating ceramic green layers containing ceramic powder, and first and second shrink-suppressing layers formed on one main surface and the other main surface of the multilayer mother substrate and containing a sintering-difficulty powder, forming grooves, firing |
| 03/23/2006 | US20060060969 Electronic circuit including circuit-connecting material |
| 03/23/2006 | US20060060968 Projected contact structures for engaging bumped semiconductor devices and methods of making the same |
| 03/23/2006 | US20060060948 Semiconductor package and semiconductor package mounting method |
| 03/23/2006 | US20060060881 Fixture for holding and for connecting optoelectronic components such as PLCC2 and PLCC4 type light emitting diodes |
| 03/23/2006 | US20060060377 Method of forming a multi-layer printed circuit board and the product thereof |
| 03/23/2006 | US20060059682 Manufacturing method of a multi-layer circuit board embedded with a passive component |
| 03/23/2006 | DE10245928B4 Verfahren zur strukturierten, selektiven Matallisierung einer Oberfläche eines Substrats A process for the structured surface of a substrate a selective Matallisierung |
| 03/22/2006 | EP1638379A2 Structure for preventing stacking connectors on boards from coming apart and electronic device |
| 03/22/2006 | EP1637554A1 Resin composition for printed wiring board, prepreg, and laminate obtained with the same |
| 03/22/2006 | EP1637314A1 Sheet for thermal pressing |
| 03/22/2006 | EP1637261A1 Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface |
| 03/22/2006 | EP1637131A1 Cataplasm base and cataplasm using the same |
| 03/22/2006 | EP1637019A1 Land grid array connector |
| 03/22/2006 | EP1637017A2 Method for production of pieces for passive electronic components and pieces obtained thus |
| 03/22/2006 | EP1636402A2 Contact surfaces for electrical contacts and method for producing the same |
| 03/22/2006 | EP1636300A2 Nanoporous laminates |
| 03/22/2006 | EP1464211B1 Electric circuit module and method for its assembly |
| 03/22/2006 | EP1446251A4 Highly filled composites of powdered fillers and polymer matrix |
| 03/22/2006 | EP1446237A4 Manufacture having double sided features in a metal-containing web formed by etching |
| 03/22/2006 | EP1410701A4 Method of manufacturing an integrated circuit carrier |
| 03/22/2006 | EP1340289A4 Board integrated resilient contact elements array and method of fabrication |
| 03/22/2006 | EP1290067B1 Flexible, insulating and heat-stable composite materials |
| 03/22/2006 | EP1042079A4 Improved miniature surface mount capacitor and method of making same |
| 03/22/2006 | EP1020908B1 Resin-sealed surface mounting type electronic parts |
| 03/22/2006 | EP0980737B1 Laser machining method, laser machining device and control method of laser machining |
| 03/22/2006 | CN1751547A Multilayer board and its manufacturing method |
| 03/22/2006 | CN1751546A Method for manufacturing an electrically conductive pattern |
| 03/22/2006 | CN1751545A Circuit board checker and circuit board checking method |
| 03/22/2006 | CN1751219A Conductor inspecting device and conductor inspecting method |
| 03/22/2006 | CN1751107A Thermally-formable and cross-linkable precursor of a thermally conductive material |
| 03/22/2006 | CN1750927A Layered polyimide/metal product |
| 03/22/2006 | CN1750750A Method for realizing connection of other device by BGA package device pin repair |
| 03/22/2006 | CN1750741A Method for producing a circuit |
| 03/22/2006 | CN1750740A Method and device for producing printed circuit substrate |
| 03/22/2006 | CN1750739A Method for producing thin film resistor on printed circuit board |
| 03/22/2006 | CN1750738A Wired circuit board |
| 03/22/2006 | CN1750737A Printed circuit board having chip package mounted theron and method of fabricating same |
| 03/22/2006 | CN1750736A Printed circuit board including embedded passive component and method of fabricating same |
| 03/22/2006 | CN1750734A Circuit board and method of manufacturing the same |
| 03/22/2006 | CN1750259A Multiple chip packaged conductor frame, its producing method and its package structure |
| 03/22/2006 | CN1750244A Wiring board, method of manufacturing the same, and semiconductor device |
| 03/22/2006 | CN1750231A Method and apparatus for removing material from a substrate surface |
| 03/22/2006 | CN1749442A Improved plating method |
| 03/22/2006 | CN1749008A Pattern forming method, method of manufacturing electronic apparatus, and method of manufacturing substrate |
| 03/22/2006 | CN1247056C Production method of film circuit plate |
| 03/22/2006 | CN1247055C Connection structure of distribution substrate and its display device |
| 03/22/2006 | CN1247054C Thin film substrate |
| 03/22/2006 | CN1247053C Multilayer circuit board and method for manufacturing multilayer circuit board |
| 03/22/2006 | CN1246902C Electronic line chip |
| 03/22/2006 | CN1246901C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 03/22/2006 | CN1246893C Contact structure member and production method thereof, and probe contact assembly using said contact structure member |
| 03/22/2006 | CN1246504C Apparatus and method for electroplating metal on work piece |
| 03/22/2006 | CN1246411C Adhesive for connection of circuit |
| 03/22/2006 | CN1246410C Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
| 03/22/2006 | CN1246130C Boring device and working table |
| 03/22/2006 | CN1246116C Method for the calibration of the optical system on a laser machine for machining electrical circuit substrates |
| 03/21/2006 | US7017128 Concurrent electrical signal wiring optimization for an electronic package |
| 03/21/2006 | US7016200 Module support for electrical/electronic components |
| 03/21/2006 | US7015713 Method and apparatus for evaluating a set of electronic components |
| 03/21/2006 | US7015637 A substrate having a wiring comprises a plurality of recesses arranged in a direction crossing the longitudinal direction of the wiring, and wherein the thickness of the wiring is 30 nm or more at the bottom of each of the plurality of recesses; noncracking; antipeeling agents |
| 03/21/2006 | US7015591 Exposed pad module integrating a passive device therein |
| 03/21/2006 | US7015590 Reinforced solder bump structure and method for forming a reinforced solder bump |
| 03/21/2006 | US7015573 Method and apparatus for molding module electronic devices and a module electronic device molded thereby |
| 03/21/2006 | US7015571 Multi-chips module assembly package |
| 03/21/2006 | US7015570 Electronic substrate with inboard terminal array, perimeter terminal array and exterior terminal array on a second surface and module and system including the substrate |
| 03/21/2006 | US7015132 Forming an electrical contact on an electronic component |
| 03/21/2006 | US7015070 Electronic device and a method of manufacturing the same |
| 03/21/2006 | US7015065 Manufacturing method of ball grid array package |
| 03/21/2006 | US7014986 Writing device and writing method |
| 03/21/2006 | US7014979 Method of forming the metal alloy pattern using the same, wherein the metal alloy pattern having improved adhesive force to a substrate, heat resistance, and resistance to atmospheric corrosion can be readily formed using the |
| 03/21/2006 | US7014786 Methods and apparatus for forming submicron patterns on films |