Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/2006
04/13/2006US20060075782 Method for producing laminated dielectric
04/13/2006US20060075633 Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof
04/13/2006DE19955537B4 Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein A process for producing a support element for an IC module
04/13/2006DE19925670B4 Verfahren zum Herstellen von elektronischen Keramikbauteilen A method of manufacturing ceramic electronic components
04/13/2006DE10326086B4 Verfahren und Justiermarken zur Positionierung eines Messkopfes auf einer Leiterplatte A method for positioning and alignment of a measuring head on a printed board
04/13/2006DE102005019686B3 Liquid spreading machine for producing thin even material layer on substrate has silicon substrates on conveyer belt and has ultrasonic generator in hopper producing mist falling on substrates
04/13/2006DE102004049439A1 Bohrvorrichtung zum Bohren von Kontaktierungsbohrungen zum Verbinden von Kontaktierungsflächen von Mehrschicht-Leiterplatten A drilling device for drilling for connecting via-contacting surfaces of multi-layer printed circuit boards
04/13/2006DE102004040068A1 Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks Method for laser drilling of a multi-layered workpiece
04/13/2006DE10065896B4 Elektronisches Bauteil mit Abschirmung und Verfahren zu seiner Herstellung Electronic component with screen and method for its preparation
04/13/2006DE10047644B4 Schaltungsblock für Stromversorgung Circuit block for power supply
04/12/2006EP1646272A2 Process for soldering a lead-in-hole component on a circuit board and relais to be soldered according to the process
04/12/2006EP1646271A2 Control device and method of manufacturing thereof
04/12/2006EP1646270A1 Circuit board and process for producing the same
04/12/2006EP1646269A2 Electrical circuit comprising a multilayer circuit board
04/12/2006EP1646081A1 Packaging method and system of electric component
04/12/2006EP1645663A2 Method of electrophorectic deposition of ceramic bodies for use in manufacturing dental appliances
04/12/2006EP1645171A1 Soft magnetic material for manufacturing printed circuit boards
04/12/2006EP1645015A1 Component, double-sided printed circuit board and method for making an electrical connection of a double-sided printed circuit
04/12/2006EP1645013A2 Component for a printed circuit board and method for fitting a printed circuit board with this component
04/12/2006EP1644976A2 Stackable integrated circuit package and method therefor
04/12/2006EP1644953A2 Filling vias with thick film paste using contact printing
04/12/2006EP1644555A2 Resin substrate having a resin-metal composite layer and method for manufacturing thereof
04/12/2006EP1644453A1 Palladium complexes for printing circuits
04/12/2006EP1644153A2 Method for soldering electrical connector pins on a support by means of hot gas
04/12/2006EP1559296B1 Transparent window with non-transparent contact surface for a soldering bonding
04/12/2006EP1430360A4 Screen printing process
04/12/2006EP1352548B1 Method of forming electrically conductive elements and patterns of such elements
04/12/2006EP1195080B1 Transition between symmetric stripline and asymmetric stripline
04/12/2006EP1152069B1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil
04/12/2006CN1759642A Method and device for mounting conductive ball
04/12/2006CN1759641A Domed circuit board of an antenna amplifier for a vehicle antenna device
04/12/2006CN1759640A Pcb connector
04/12/2006CN1759639A Method and device for protection of a component or module
04/12/2006CN1759477A Method for manufacturing electronic component-mounted board
04/12/2006CN1759155A A conductive adhesive composition
04/12/2006CN1759001A System and method for bending a substantially rigid substrate
04/12/2006CN1758902A Cataplasm base and cataplasm using the same
04/12/2006CN1758833A Multi-layer board manufacturing method
04/12/2006CN1758832A Printed wiring board manufacturing method
04/12/2006CN1758831A Laser punching system and method for flexible printed circuit board
04/12/2006CN1758830A High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same
04/12/2006CN1758829A Printed circuit board and method of fabricating same
04/12/2006CN1758828A Printed circuit board structure for high-speed signal
04/12/2006CN1758423A Manufacturing method of film substrate and manufacturing method of semiconductor component, display device and electronic device using the substrate
04/12/2006CN1251563C Protection film coated on basic plate for multi-layer substrate formation use, apparatus and method for checking basic plates
04/12/2006CN1251562C Composite laminate and its manufacturing method
04/12/2006CN1251560C Parts built in module and its making method
04/12/2006CN1251364C Method and device for connecting conductors
04/12/2006CN1251362C Electric component with conducting circuit
04/12/2006CN1251350C Filter circuit apparatus and manufacturing method thereof
04/12/2006CN1251349C 微波电路 Microwave Circuits
04/12/2006CN1251319C Microelectronic component insert making method
04/12/2006CN1251185C Magnetic head device
04/12/2006CN1250971C Sensor package
04/12/2006CN1250776C Local electroplating system
04/12/2006CN1250772C Electroplating pretreatment solution and electroplating pretreatment method
04/12/2006CN1250663C Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using same
04/12/2006CN1250394C Copper-clad laminate
04/11/2006US7027304 Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
04/11/2006US7027155 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
04/11/2006US7027043 Wiring substrate connected structure, and display device
04/11/2006US7026835 Engagement probe having a grouping of projecting apexes for engaging a conductive pad
04/11/2006US7026716 Self-assembled sub-nanolayers as interfacial adhesion enhancers and diffusion barriers
04/11/2006US7026708 Low profile chip scale stacking system and method
04/11/2006US7026707 Windowed package having embedded frame
04/11/2006US7026582 Vector transient reflow of lead free solder for controlling substrate warpage
04/11/2006US7026572 Stripping insulation from flat cables
04/11/2006US7026382 Bonding semiconductor chips
04/11/2006US7026254 Manufacture of masks and electronic parts
04/11/2006US7026236 Method of forming multilayer interconnection structure, method of manufacturing circuit board, and method of manufacturing device
04/11/2006US7026190 Method of manufacturing circuit device
04/11/2006US7026188 Electronic device and method for manufacturing the same
04/11/2006US7026180 Screen-printing metal mask plate and method of resin-sealing vibrating part
04/11/2006US7026102 Plasma deposited selective wetting material
04/11/2006US7026079 Process for preparing a substantially transparent conductive layer configuration
04/11/2006US7026059 Release layer, a diffusion preventive layer and a copper electroplating layer; printed circuits
04/11/2006US7026054 Laminate utilizing a metal layer activated by nitrogen plasma treatment
04/11/2006US7026032 Controlling particle size; interpenetrating polymer nertwork; thin film, high speed digital circuits
04/11/2006US7026012 Method and apparatus for forming a metallic feature on a substrate
04/11/2006US7025906 For accelerating heat conductance; tin, bismuth, indium, and lead alloys formed via heat treatment; adhesion
04/11/2006US7025867 Direct electrolytic metallization on non-conducting substrates
04/11/2006US7025849 Method of attaching optical waveguide component to printed circuit board
04/11/2006US7025640 Circuit board inter-connection system and method
04/11/2006US7025604 High current output pin
04/11/2006US7024764 Method of making an electronic package
04/11/2006US7024763 Methods for making plated through holes usable as interconnection wire or probe attachments
04/11/2006CA2277616C Flexible circuit compression connector system and method of manufacture
04/06/2006WO2006036692A1 Flexible cable for high-speed interconnect
04/06/2006WO2006036017A1 Method of calibrating alignment section, image-drawing device with calibrated alignment section, and conveying device
04/06/2006WO2006035853A1 Printed circuit board, a printed circuit assembly and electronic apparatus
04/06/2006WO2006035807A1 Pattern formation material, pattern formation device, and pattern formation method
04/06/2006WO2006035692A1 Conductive paste and method for manufacturing multilayer printed wiring board using same
04/06/2006WO2006034830A1 Process for the preparation of a fibre-reinforced resin-coated sheet
04/06/2006US20060073737 Board-mounting device
04/06/2006US20060073641 Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors
04/06/2006US20060073639 Electronic parts packaging structure and method of manufacturing the same
04/06/2006US20060073316 HDD suspension and its manufacture
04/06/2006US20060073277 Method for producing a partially metallized film-type element
04/06/2006US20060072871 Electronic circuit board
04/06/2006US20060072202 Rearview mirror constructed for efficient assembly