| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/15/2006 | CN1747621A Multi-piece substrate and method of manufacturing the substrate |
| 03/15/2006 | CN1747620A Laminated structure of printing circuit board and multi-laminate laminated structure |
| 03/15/2006 | CN1747162A Semiconductor device having tin-based solder layer and method for manufacturing the same |
| 03/15/2006 | CN1747161A Semiconductor device and method of manufacturing semiconductor device |
| 03/15/2006 | CN1747153A Substrate plate structure with tin-ball fixed welding pad and combination structure therewith |
| 03/15/2006 | CN1747141A Production of precision unit structure for chip wire rack |
| 03/15/2006 | CN1746026A Screen printing apparatus |
| 03/15/2006 | CN1245864C Sheet adhesive machine and its integrated adhesive head |
| 03/15/2006 | CN1245863C Sheet adhesive machine and its building block type adhesive head |
| 03/15/2006 | CN1245862C Parts inserting device, and parts inserting method |
| 03/15/2006 | CN1245857C Circuit board and mounting method for the same, and electronic apparatus using the same |
| 03/15/2006 | CN1245856C Alloy plating liquid for modular printed circuit board surface treatment |
| 03/15/2006 | CN1245855C Multilayer wiring board, touch face-plate and their manufacturing method |
| 03/15/2006 | CN1245854C Panel and its making method and installation method for electronic circuit component |
| 03/15/2006 | CN1245756C Base for producing semiconductor device by using three element alloy |
| 03/15/2006 | CN1245755C Film substrate, semiconductor device, circuit substrate and manufacture method thereof |
| 03/15/2006 | CN1245738C Method for forming film pattern, apparatus for manufacturing thin film, conductive film wiring |
| 03/15/2006 | CN1245699C Apparatus and control method for removing coating on conductive material of dielectric carrier |
| 03/15/2006 | CN1245632C Detection card and preparation, method thereof |
| 03/15/2006 | CN1245586C Light-emitting panel |
| 03/15/2006 | CN1245272C Wire welding tech. for copper metallized integrated circuit |
| 03/14/2006 | US7013452 Method and apparatus for intra-layer transitions and connector launch in multilayer circuit boards |
| 03/14/2006 | US7012814 Circuit board connection structure, method for forming the same, and display device having the circuit board connection structure |
| 03/14/2006 | US7012812 Memory module |
| 03/14/2006 | US7012667 Liquid crystal display device |
| 03/14/2006 | US7012666 Display, method of manufacturing display and apparatus for manufacturing display |
| 03/14/2006 | US7012489 Coaxial waveguide microstructures and methods of formation thereof |
| 03/14/2006 | US7012441 High conducting thin-film nanoprobe card and its fabrication method |
| 03/14/2006 | US7012333 Lead free bump and method of forming the same |
| 03/14/2006 | US7012331 Device for mounting a semiconductor package on a support plate via a base |
| 03/14/2006 | US7012197 Multi-layer printed circuit board and method for manufacturing the same |
| 03/14/2006 | US7012189 Computer enclosure |
| 03/14/2006 | US7012117 Water-dispersible resin composition for use in boring hole in printed wiring board, sheet comprising the composition, and method for boring hole in printed wiring board using the sheet |
| 03/14/2006 | US7012019 Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same |
| 03/14/2006 | US7012017 Partially etched dielectric film with conductive features |
| 03/14/2006 | US7011994 Method of forming wiring and method of manufacturing image display system by using the same |
| 03/14/2006 | US7011862 Method for producing wiring substrate |
| 03/14/2006 | US7011556 Contact module, connector and method of producing said contact module |
| 03/14/2006 | US7011531 Membrane probe with anchored elements |
| 03/14/2006 | US7011530 Multi-axis compliance spring |
| 03/14/2006 | US7011382 Method of jetting viscous medium |
| 03/14/2006 | US7010855 Optical module |
| 03/14/2006 | US7010854 Re-assembly process for MEMS structures |
| 03/14/2006 | US7010853 Electric-component mounting system |
| 03/14/2006 | CA2467043C Biomedical electrochemical sensor array and method of fabrication |
| 03/14/2006 | CA2273890C Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same |
| 03/09/2006 | WO2006025242A1 Double-layered flexible board and method for manufacturing same |
| 03/09/2006 | WO2006025240A1 Double layer flexible board and method for manufacturing the same |
| 03/09/2006 | WO2006025224A1 Flux for soldering |
| 03/09/2006 | WO2005119765A3 Assembly including vertical and horizontal joined circuit panels |
| 03/09/2006 | WO2005069733A3 Reactive fine particles |
| 03/09/2006 | WO2005059930A3 Printed circuit embedded capacitors |
| 03/09/2006 | US20060051895 Method for manufacturing electronic component-mounted board |
| 03/09/2006 | US20060051705 Method of imaging |
| 03/09/2006 | US20060051584 Process for producing a product having a structured surface |
| 03/09/2006 | US20060051498 Display device having a color filter |
| 03/09/2006 | US20060050484 Using the wave soldering process to attach motherboard chipset heat sinks |
| 03/09/2006 | US20060050468 Capacitor unit |
| 03/09/2006 | US20060050254 Projection exposure apparatus and method for producing a printed circuit board |
| 03/09/2006 | US20060049777 High-pressure discharge lamp operation device and illumination appliance having the same |
| 03/09/2006 | US20060049545 Securing electrical conductors |
| 03/09/2006 | US20060049516 Nickel/gold pad structure of semiconductor package and fabrication method thereof |
| 03/09/2006 | US20060049509 Printed wiring board |
| 03/09/2006 | US20060049498 Methods of making microelectronic assemblies including compliant interfaces |
| 03/09/2006 | US20060049129 Making printed circuits by by ink jet printing on dielectric a plate-resistant solvent-free acrylate ink with acid-free acrylic ester monomers and acrylates containing acid groups; polymerizing; electrolytic or electroless depositing metal layers, the upper layer of which is etch-resistant; removing ink |
| 03/09/2006 | US20060048963 Laminate, printed circuit board, and preparing method thereof |
| 03/09/2006 | US20060048655 Method and apparatus for performing operations within a stencil printer |
| 03/09/2006 | US20060048384 Thermally controlled fluidic self-assembly and conductive support |
| 03/09/2006 | US20060048382 Method and apparatus for installing a circuit device |
| 03/09/2006 | US20060048381 Die attaching apparatus, and system and method for cleaning the same |
| 03/09/2006 | US20060048380 Parts mounting device and method |
| 03/09/2006 | US20060048379 Board carrier component mounter, and method for carrying board in component mounting |
| 03/09/2006 | DE202006000087U1 Printed circuit board carrier for transport device, has a support holder which is swivelably supported at holding device, where carrier is fixable in defined carrier position and in defined feedback position |
| 03/08/2006 | EP1633175A1 Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same |
| 03/08/2006 | EP1633174A2 Wired circuit board |
| 03/08/2006 | EP1632997A2 Substrate dividing method |
| 03/08/2006 | EP1632812A1 Projection exposure apparatus and method for producing a printed circuit board |
| 03/08/2006 | EP1632797A1 Three dimensional structure and method of manufacturing the same |
| 03/08/2006 | EP1632531A1 Vulcanized fluorine rubber and cushioning material for heat press containing same |
| 03/08/2006 | EP1632369A2 Graduated stiffness for electrical connections in tires |
| 03/08/2006 | EP1632354A2 Inkjet head and manufacturing method of the same |
| 03/08/2006 | EP1631992A2 Transparent conducting structures and methods of production thereof |
| 03/08/2006 | EP1532851B1 Production of electronic organic circuits by contact printing |
| 03/08/2006 | EP1472915B1 Circuit carrier and production thereof |
| 03/08/2006 | EP1428260B1 Non-conductive substrate forming a strip or a panel, on which a plurality of carrier elements are configured |
| 03/08/2006 | EP1425949B1 Printed circuit board |
| 03/08/2006 | EP1342294A4 I-channel surface-mount connector |
| 03/08/2006 | EP1342292A4 Circuit module with universal connectivity |
| 03/08/2006 | EP1305829A4 Solder bar for high power flip chips |
| 03/08/2006 | EP1305258B1 Ceramic microelectromechanical structure |
| 03/08/2006 | EP1196015B1 Method for soldering and soldered joint |
| 03/08/2006 | EP1042092B1 Component of printed circuit boards |
| 03/08/2006 | EP0971370B1 Cable and method of manufacturing it |
| 03/08/2006 | CN2764105Y Circuit board |
| 03/08/2006 | CN1745609A Device for the metallisation of printed forms which are equipped with electrically conductive tracks and associated metallisation method |
| 03/08/2006 | CN1745608A Heat dissipating arrangement for an electronic appliance |
| 03/08/2006 | CN1745466A Method of manufacturing semiconductor device and display device |
| 03/08/2006 | CN1745465A Method of manufacturing display device |
| 03/08/2006 | CN1745437A 导电浆料 Conductive paste |
| 03/08/2006 | CN1745199A Formwork manufacture |