Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2006
06/01/2006US20060113356 Method and device for mounting electric component
06/01/2006US20060113289 High-speed, precision, laser-based method and system for processing material of one or more targets within a field
06/01/2006US20060113032 Method for manufacturing printed wiring board
06/01/2006US20060112729 Encoding tracking information into glass using single screen and laser ablation
06/01/2006US20060112554 Laser processing method of an inkjet head
06/01/2006US20060112545 Method and apparatus for mounting electronic components
06/01/2006US20060112544 Wiring board manufacturing method
06/01/2006US20060112543 Holding/convey jig and holding/convey method
06/01/2006DE19755155B4 Elektronisches Modul Electronic module
06/01/2006DE10341404B4 Schaltungsvorrichtung mit einem Schaltungsträger Circuit device having a circuit carrier
06/01/2006DE102004057700A1 Guiding machine for e.g. laser cutting system, has sheet metal covering enclosing all important units e.g. guides, of machine and circular protective band protecting opening that directs cutting energy from covering to sledge
06/01/2006DE102004057493A1 Method for encasing components arranged on a substrate for electronic devices comprises placing a foil on the components, applying a deforming composition, pressing the composition against the foil and removing the composition
05/2006
05/31/2006EP1662850A1 Method for manufacturing printed wiring board and printed wiring board
05/31/2006EP1662427A1 Memory card and method of fabricating the same
05/31/2006EP1662020A1 Method for producing a copper thin film
05/31/2006EP1661656A2 Laser method for machining through holes only in a ceramic green sheet, the latter provided with a carrier film
05/31/2006EP1661207A1 Embedded rf vertical interconnect for flexible conformal antenna
05/31/2006EP1661181A1 Surface-mounted device with leads
05/31/2006EP1661157A2 Method and device for contacting semiconductor chips
05/31/2006EP1661149A2 Ultra-thin flexible inductor
05/31/2006EP1661147A2 Fabrication of thick film electrical components
05/31/2006EP1661053A2 Circuit forming system and method
05/31/2006EP1660763A1 Adjusting device, especially for the throttle valve of an internal combustion engine
05/31/2006EP1660306A2 Method and device for the production of a three-dimensional multi-material component by means of ink-jet-type printing
05/31/2006EP1660243A2 Coating metal particles
05/31/2006EP1615734A4 Compositions and methods for cleaning contaminated articles
05/31/2006EP1590859B1 Low profile active electronically scanned antenna (aesa) for ka-band radar systems
05/31/2006EP1461345B1 Copper deposition using copper formate complexes
05/31/2006EP1144150B1 Method and apparatus for dispensing material in a printer
05/31/2006EP1065554B1 Liquid crystal display and manufacture thereof
05/31/2006EP1062848A4 Integrated circuit connection using an electrically conductive adhesive
05/31/2006CN2785312Y Assembling structure of embedded passive components
05/31/2006CN1781351A Electronic control module for a removable connector and methods of assembling same
05/31/2006CN1781350A Method for processing a thin film substrate
05/31/2006CN1781349A Article comprising lead channels
05/31/2006CN1781348A Printed wiring board, its manufacturing method, and circuit device
05/31/2006CN1781347A Printed wiring board connection structure
05/31/2006CN1781346A Connection structure of printed wiring board
05/31/2006CN1781161A Terminated conductive patterned sheet utilizing conductive conduits
05/31/2006CN1781160A Heat selective electrically conductive polymer sheet
05/31/2006CN1781039A Conductive patterned sheet utilizing multilayered conductive channels
05/31/2006CN1780881A Vulcanized fluorine rubber and cushioning material for heat press containing same
05/31/2006CN1780843A Dicopper (i) oxalate complexes as precursor for metallic copper deposition
05/31/2006CN1780714A Method of producing laser-processed product and adhesive sheet, for laser processing used therefor
05/31/2006CN1780711A Solder-dross mixture separation method and apparatus
05/31/2006CN1780536A Impedance adjustment of multi-layer printing circuit board
05/31/2006CN1780535A Laminated mould of multi-layer circuit board
05/31/2006CN1780534A Printing circuit board with plate edged long and short contacts and its processing method
05/31/2006CN1780533A Bonding apparatus using conductive material
05/31/2006CN1780532A Method of fabricating rigid-flexible printed circuit board
05/31/2006CN1780531A Method of forming conductive pattern
05/31/2006CN1780530A Method of forming a wiring pattern, method of manufacturing a device, device, and electro-optic device
05/31/2006CN1780529A Method for forming a pattern
05/31/2006CN1780527A Electric circuit substrate and its manufacture
05/31/2006CN1780526A Electronic assembly with a heat sink
05/31/2006CN1780524A Multi-layer printed circuit board
05/31/2006CN1779907A Electronic part and method for manufacturing the same
05/31/2006CN1779466A Testing electrode of single nanometer materials and production thereof
05/31/2006CN1779455A Production of disposable electrochemical biological sensor
05/31/2006CN1779453A Apparatus for measuring heat conductivity coefficient and production thereof
05/31/2006CN1258312C Device for transfering/holding sheetlike member and its method
05/31/2006CN1258308C Printed circuit board, its manufacturing method and semiconductor device
05/31/2006CN1258307C Flexible printed circuit board and producing method thereof
05/31/2006CN1258306C Through hole processing and structure for HF circuit board
05/31/2006CN1258305C Method of repairing circuit connection part, and structure and method for connecting circuit terminal of circuit repaired by method
05/31/2006CN1258304C High frequency circuit connection structure having good high frequency performance
05/31/2006CN1258245C 插座 Socket
05/31/2006CN1258114C Liquid crystal display and its making method
05/31/2006CN1257798C Printing method and printing device for non-individual body sheet
05/31/2006CN1257796C High polymer plate and conductive plate connecting body and part using the connecting plate
05/30/2006US7054798 Punch and die optimization
05/30/2006US7054159 Printed wiring board having heat radiating means and method of manufacturing the same
05/30/2006US7053530 Method for making electrical connection to ultrasonic transducer through acoustic backing material
05/30/2006US7053521 Method for enhancing epoxy adhesion to gold surfaces
05/30/2006US7053491 Sperical core of high melting metal; connector of low melting eutectic
05/30/2006US7053483 Semiconductor package using terminals formed on a conductive layer of a circuit board
05/30/2006US7053481 High capacitance package substrate
05/30/2006US7053478 Pitch change and chip scale stacking system
05/30/2006US7053472 Optical package structure
05/30/2006US7053421 Light-emitting diode
05/30/2006US7053416 LED display apparatus
05/30/2006US7053315 Junction structure and junction method for conductive projection
05/30/2006US7053313 Transparent substrate provided with electroconductive strips
05/30/2006US7053312 Flexible wiring boards
05/30/2006US7053133 High room temperature storage stability and no catalytic action before activation by ultraviolet rays; thermal press bonding; epoxy resin, an ultraviolet activatable cationic polymerization catalyst, a polymerization inhibitor and water
05/30/2006US7052935 Flip-chip package and fabricating process thereof
05/30/2006US7052825 Substrate having fine lines, method for manufacturing the same, electron-source substrate, and image display apparatus
05/30/2006US7052824 Process for thick film circuit patterning
05/30/2006US7052823 Method of manufacturing an electroconductive film, and method of manufacturing an image forming apparatus including the electroconductive film
05/30/2006US7052781 Flexible copper foil structure and fabrication method thereof
05/30/2006US7052779 Copper foil for fine pattern printed circuits and method of production of same
05/30/2006US7052619 preferential engraving electroconductive plates, then applying dielectrics; electrical and electronic apparatus
05/30/2006US7052574 Continuous processing; dimensional stability, flatness; thermoplastic liquid crystal polymer; optically anisotropic melt; heat treatment
05/30/2006US7052337 Connector having improved contacts with fusible members
05/30/2006US7052289 Conductive terminal and the electrical connector using the conductive terminal
05/30/2006US7052285 Electrode mounting structure and flat panel display employing the same
05/30/2006US7051437 Method for making an inkjet head
05/30/2006US7051432 Method for providing an electrical connection
05/30/2006US7051431 Component mounting control method
05/30/2006US7051430 Method of manufacturing a printed board assembly