Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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03/01/2006 | CN1741715A Surface-mounting attachment of component |
03/01/2006 | CN1741714A Method for welding inter-circuit board |
03/01/2006 | CN1741713A Manufacturing methods and electroless plating apparatus for manufacturing wiring circuit boards |
03/01/2006 | CN1741712A Method of forming wiring pattern and method of forming gate electrode for TFT |
03/01/2006 | CN1741711A Method for forming two-side graph or pattern |
03/01/2006 | CN1741710A Method of manufacturing package substrate with fine circuit pattern using anodic oxidation |
03/01/2006 | CN1741709A Circuit board and method for producing the same |
03/01/2006 | CN1741708A Circuit board and method for producing a circuit board |
03/01/2006 | CN1741707A Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same |
03/01/2006 | CN1741706A Wiring board |
03/01/2006 | CN1741705A Printed circuit board and inspection method therefor |
03/01/2006 | CN1739969A Droplet discharge apparatus |
03/01/2006 | CN1244262C Frequency regulation method and configuration for voltage-controlled oscillator |
03/01/2006 | CN1244261C Structure for preventing mosaic copper metal damage and method thereof |
03/01/2006 | CN1244260C Method and apparatus for producing single ceramic electronic element |
03/01/2006 | CN1244259C Method of producing ceramic element for bonding, ceramic element for bonding, vacuum switch and vacuum container |
03/01/2006 | CN1244258C Circuit device and its manufacturing method |
03/01/2006 | CN1244183C Solder-holder for supplying solder to connector |
03/01/2006 | CN1244148C Electronic element and its producing method |
03/01/2006 | CN1244112C Coated particle |
03/01/2006 | CN1243849C A method for wet etching |
03/01/2006 | CN1243810C Ultraviolet activatable adhesive film |
02/28/2006 | US7007125 Pass through circuit for reduced memory latency in a multiprocessor system |
02/28/2006 | US7006879 Boring method for circuit board |
02/28/2006 | US7006359 Modular electronic assembly and method of making |
02/28/2006 | US7006201 Photosensitive tabular member suction mechanism and image recording device |
02/28/2006 | US7005955 Inductor or transformer having a ferromagnetic core that is formed on a printed circuit board |
02/28/2006 | US7005932 Electronic device having adjustable VCO |
02/28/2006 | US7005870 Interconnect bump plate |
02/28/2006 | US7005754 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly |
02/28/2006 | US7005753 Optimization of routing layers and board space requirements for a ball grid array land pattern |
02/28/2006 | US7005751 Layered microelectronic contact and method for fabricating same |
02/28/2006 | US7005750 Substrate with reinforced contact pad structure |
02/28/2006 | US7005745 Method and structure to reduce risk of gold embrittlement in solder joints |
02/28/2006 | US7005742 Socket grid array |
02/28/2006 | US7005740 Thick film millimeter wave transceiver module |
02/28/2006 | US7005736 Semiconductor device power interconnect striping |
02/28/2006 | US7005735 Array printed circuit board |
02/28/2006 | US7005731 Plastic lead frames for semiconductor devices and packages including same |
02/28/2006 | US7005604 Operating method for a laser machining system |
02/28/2006 | US7005585 Mounting board and electronic device using same |
02/28/2006 | US7005584 Compact navigation device assembly |
02/28/2006 | US7005378 Processes for fabricating conductive patterns using nanolithography as a patterning tool |
02/28/2006 | US7005325 Semiconductor package with passive device integration |
02/28/2006 | US7005318 Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times |
02/28/2006 | US7005311 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
02/28/2006 | US7005310 Manufacturing method of solid-state image sensing device |
02/28/2006 | US7005241 Process for making circuit board or lead frame |
02/28/2006 | US7005179 Producing three-dimensional microfluidic channels in flexible polymer substrate and filling with conductive ink |
02/28/2006 | US7005054 Method for manufacturing probes of a probe card |
02/28/2006 | US7005033 Apparatus and method for laminating dry film using microwave |
02/28/2006 | US7004984 Resistor and, or capacitor on cermic core; firing, trimming; controlling sintering temperature |
02/28/2006 | US7004798 Bus bar with L-shaped terminals |
02/28/2006 | US7004766 Tine plate |
02/28/2006 | US7004761 Display apparatus and connecting cables used in the display apparatus |
02/28/2006 | US7004376 Solder printing mask, wiring board and production method thereof, electrooptical apparatus and production method thereof and electronic device and production method thereof |
02/28/2006 | US7003970 Power module and air conditioner |
02/28/2006 | US7003875 Method for manufacturing piezo-resonator |
02/28/2006 | US7003874 Methods of bonding solder balls to bond pads on a substrate |
02/28/2006 | US7003873 Method of making conformal fluid data sensor |
02/28/2006 | US7003872 Electronic component mounting apparatus and method |
02/28/2006 | US7003871 Solder paste stencil manufacturing system |
02/23/2006 | WO2006020349A1 Depositing material on photosensitive material |
02/23/2006 | WO2006019802A1 Method and apparatus for printing viscous material |
02/23/2006 | WO2006018370A1 Method for machining a workpiece by using pulse laser radiation with controllable energy of individual laser pulses and time intervals between two successive laser pulses, and a laser machining system therefor |
02/23/2006 | WO2006018351A1 Printed circuit board comprising at least one thermally critical smd component and method for producing, equipping and soldering a printed circuit board |
02/23/2006 | WO2005101503A3 Device, in particular intelligent power module with planar connection |
02/23/2006 | WO2005092043A3 Process for fabrication of printed circuit boards |
02/23/2006 | US20060040522 Method for making a microelectronic interposer |
02/23/2006 | US20060040426 Circuitized substrate, method of making same and information handling system using same |
02/23/2006 | US20060040095 Identifiable flexible printed circuit board and method of fabricating the same |
02/23/2006 | US20060040094 Electronic parts board and method of producing the same |
02/23/2006 | US20060038639 Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias |
02/23/2006 | US20060038630 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same |
02/23/2006 | US20060038299 Carbon nanotube device, process for producing the same and carbon nanotube transcriptional body |
02/23/2006 | US20060038022 Chipcard and method for production of a chipcard |
02/23/2006 | US20060037997 Joining apparatus and method |
02/23/2006 | US20060037991 Electronic parts assembling and testing method, and electronic circuit baseboard manufactured by the method |
02/23/2006 | US20060037889 Apparatus for reclamation of precious metals from circuit board scrap |
02/23/2006 | US20060037775 Attachment system for an electrical device for installation in aircraft cabins |
02/23/2006 | US20060037700 Method and apparatus for removing material from a substrate surface |
02/23/2006 | US20060037690 Adding binder lacquer solution to slurry of ceramic powder; high pressure dispersion through a wet jet mill; smoothed on its surface, reduced surface roughness of the electrode coating during stacking, suppress defects, reduced short circuit |
02/23/2006 | US20060037193 Single-sided circuit board and method for manufacturing the same |
02/23/2006 | US20060037192 Printed wiring board without traces on surface layers enabling PWB's without solder resist |
02/23/2006 | DE20321127U1 Method of soldering components onto a printed circuit board involves applying fluid solder by machine to a locally defined area of the circuit board |
02/23/2006 | DE102005039198A1 Verfahren zur Anordnung eines Anschlusses an einer gedruckten Karte, sowie gedruckte Karte mit angeordnetem Anschluss und elektrisches Verbindergehäuse zur Aufnahme der gedruckten Karte mit dem hieran angeordneten Anschluss, beide durch das Verfahren hergestellt A method of assembly of a connector to a printed map, and printed card with connection and arranged electrical connector housing for receiving the printed card with the connector arranged thereon, both manufactured by the process |
02/23/2006 | DE102005038670A1 Verfahren zum Trennen eines Halbleitersubstrats A method for separating a semiconductor substrate |
02/23/2006 | DE102005038513A1 Modularisierte Schaltungskomponente Modularized circuit component |
02/23/2006 | DE102004039023A1 Verfahren zur Bearbeitung eines Werkstücks mittels Laserstrahlung, Laserbearbeitungssystem A method of machining a workpiece using laser radiation, the laser processing system |
02/23/2006 | DE102004038970A1 HF intermediate connection for multiple wiring structures comprises an electrically conducting filler or coating on the wall of a via |
02/23/2006 | DE102004038964A1 Leiterplatte mit wenigstens einem thermisch kritischen SMD-Bauteil und Verfahren zum Herstellen, Bestücken und Löten einer Leiterplatte Circuit board with at least one thermally critical SMD component and method of manufacturing, assembling and soldering a circuit board |
02/23/2006 | DE102004037336A1 Verfahren zum Herstellen einer Schicht-Anordnung und Schicht-Anordnung A method for producing a layer arrangement and layer arrangement |
02/23/2006 | DE102004030930A1 Zinnbeschichtete Leiterplatten mit geringer Neigung zur Whiskerbildung Tin plated circuit boards with little tendency to whisker |
02/22/2006 | EP1628511A2 Module for electrical or electonic device |
02/22/2006 | EP1628510A2 Methods of forming printed circuit boards |
02/22/2006 | EP1628509A2 Electronic module with form in-place pedestal |
02/22/2006 | EP1628508A1 Process of manufacturing an electronic module |
02/22/2006 | EP1628363A1 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
02/22/2006 | EP1628333A1 Method of producing film-thinning circuit board having penetrated structure and protecting adhesive tape |
02/22/2006 | EP1627935A1 Surface treating agent for tin or tin alloy material |