Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2006
03/01/2006CN1741715A Surface-mounting attachment of component
03/01/2006CN1741714A Method for welding inter-circuit board
03/01/2006CN1741713A Manufacturing methods and electroless plating apparatus for manufacturing wiring circuit boards
03/01/2006CN1741712A Method of forming wiring pattern and method of forming gate electrode for TFT
03/01/2006CN1741711A Method for forming two-side graph or pattern
03/01/2006CN1741710A Method of manufacturing package substrate with fine circuit pattern using anodic oxidation
03/01/2006CN1741709A Circuit board and method for producing the same
03/01/2006CN1741708A Circuit board and method for producing a circuit board
03/01/2006CN1741707A Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
03/01/2006CN1741706A Wiring board
03/01/2006CN1741705A Printed circuit board and inspection method therefor
03/01/2006CN1739969A Droplet discharge apparatus
03/01/2006CN1244262C Frequency regulation method and configuration for voltage-controlled oscillator
03/01/2006CN1244261C Structure for preventing mosaic copper metal damage and method thereof
03/01/2006CN1244260C Method and apparatus for producing single ceramic electronic element
03/01/2006CN1244259C Method of producing ceramic element for bonding, ceramic element for bonding, vacuum switch and vacuum container
03/01/2006CN1244258C Circuit device and its manufacturing method
03/01/2006CN1244183C Solder-holder for supplying solder to connector
03/01/2006CN1244148C Electronic element and its producing method
03/01/2006CN1244112C Coated particle
03/01/2006CN1243849C A method for wet etching
03/01/2006CN1243810C Ultraviolet activatable adhesive film
02/2006
02/28/2006US7007125 Pass through circuit for reduced memory latency in a multiprocessor system
02/28/2006US7006879 Boring method for circuit board
02/28/2006US7006359 Modular electronic assembly and method of making
02/28/2006US7006201 Photosensitive tabular member suction mechanism and image recording device
02/28/2006US7005955 Inductor or transformer having a ferromagnetic core that is formed on a printed circuit board
02/28/2006US7005932 Electronic device having adjustable VCO
02/28/2006US7005870 Interconnect bump plate
02/28/2006US7005754 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly
02/28/2006US7005753 Optimization of routing layers and board space requirements for a ball grid array land pattern
02/28/2006US7005751 Layered microelectronic contact and method for fabricating same
02/28/2006US7005750 Substrate with reinforced contact pad structure
02/28/2006US7005745 Method and structure to reduce risk of gold embrittlement in solder joints
02/28/2006US7005742 Socket grid array
02/28/2006US7005740 Thick film millimeter wave transceiver module
02/28/2006US7005736 Semiconductor device power interconnect striping
02/28/2006US7005735 Array printed circuit board
02/28/2006US7005731 Plastic lead frames for semiconductor devices and packages including same
02/28/2006US7005604 Operating method for a laser machining system
02/28/2006US7005585 Mounting board and electronic device using same
02/28/2006US7005584 Compact navigation device assembly
02/28/2006US7005378 Processes for fabricating conductive patterns using nanolithography as a patterning tool
02/28/2006US7005325 Semiconductor package with passive device integration
02/28/2006US7005318 Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times
02/28/2006US7005311 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof
02/28/2006US7005310 Manufacturing method of solid-state image sensing device
02/28/2006US7005241 Process for making circuit board or lead frame
02/28/2006US7005179 Producing three-dimensional microfluidic channels in flexible polymer substrate and filling with conductive ink
02/28/2006US7005054 Method for manufacturing probes of a probe card
02/28/2006US7005033 Apparatus and method for laminating dry film using microwave
02/28/2006US7004984 Resistor and, or capacitor on cermic core; firing, trimming; controlling sintering temperature
02/28/2006US7004798 Bus bar with L-shaped terminals
02/28/2006US7004766 Tine plate
02/28/2006US7004761 Display apparatus and connecting cables used in the display apparatus
02/28/2006US7004376 Solder printing mask, wiring board and production method thereof, electrooptical apparatus and production method thereof and electronic device and production method thereof
02/28/2006US7003970 Power module and air conditioner
02/28/2006US7003875 Method for manufacturing piezo-resonator
02/28/2006US7003874 Methods of bonding solder balls to bond pads on a substrate
02/28/2006US7003873 Method of making conformal fluid data sensor
02/28/2006US7003872 Electronic component mounting apparatus and method
02/28/2006US7003871 Solder paste stencil manufacturing system
02/23/2006WO2006020349A1 Depositing material on photosensitive material
02/23/2006WO2006019802A1 Method and apparatus for printing viscous material
02/23/2006WO2006018370A1 Method for machining a workpiece by using pulse laser radiation with controllable energy of individual laser pulses and time intervals between two successive laser pulses, and a laser machining system therefor
02/23/2006WO2006018351A1 Printed circuit board comprising at least one thermally critical smd component and method for producing, equipping and soldering a printed circuit board
02/23/2006WO2005101503A3 Device, in particular intelligent power module with planar connection
02/23/2006WO2005092043A3 Process for fabrication of printed circuit boards
02/23/2006US20060040522 Method for making a microelectronic interposer
02/23/2006US20060040426 Circuitized substrate, method of making same and information handling system using same
02/23/2006US20060040095 Identifiable flexible printed circuit board and method of fabricating the same
02/23/2006US20060040094 Electronic parts board and method of producing the same
02/23/2006US20060038639 Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias
02/23/2006US20060038630 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same
02/23/2006US20060038299 Carbon nanotube device, process for producing the same and carbon nanotube transcriptional body
02/23/2006US20060038022 Chipcard and method for production of a chipcard
02/23/2006US20060037997 Joining apparatus and method
02/23/2006US20060037991 Electronic parts assembling and testing method, and electronic circuit baseboard manufactured by the method
02/23/2006US20060037889 Apparatus for reclamation of precious metals from circuit board scrap
02/23/2006US20060037775 Attachment system for an electrical device for installation in aircraft cabins
02/23/2006US20060037700 Method and apparatus for removing material from a substrate surface
02/23/2006US20060037690 Adding binder lacquer solution to slurry of ceramic powder; high pressure dispersion through a wet jet mill; smoothed on its surface, reduced surface roughness of the electrode coating during stacking, suppress defects, reduced short circuit
02/23/2006US20060037193 Single-sided circuit board and method for manufacturing the same
02/23/2006US20060037192 Printed wiring board without traces on surface layers enabling PWB's without solder resist
02/23/2006DE20321127U1 Method of soldering components onto a printed circuit board involves applying fluid solder by machine to a locally defined area of the circuit board
02/23/2006DE102005039198A1 Verfahren zur Anordnung eines Anschlusses an einer gedruckten Karte, sowie gedruckte Karte mit angeordnetem Anschluss und elektrisches Verbindergehäuse zur Aufnahme der gedruckten Karte mit dem hieran angeordneten Anschluss, beide durch das Verfahren hergestellt A method of assembly of a connector to a printed map, and printed card with connection and arranged electrical connector housing for receiving the printed card with the connector arranged thereon, both manufactured by the process
02/23/2006DE102005038670A1 Verfahren zum Trennen eines Halbleitersubstrats A method for separating a semiconductor substrate
02/23/2006DE102005038513A1 Modularisierte Schaltungskomponente Modularized circuit component
02/23/2006DE102004039023A1 Verfahren zur Bearbeitung eines Werkstücks mittels Laserstrahlung, Laserbearbeitungssystem A method of machining a workpiece using laser radiation, the laser processing system
02/23/2006DE102004038970A1 HF intermediate connection for multiple wiring structures comprises an electrically conducting filler or coating on the wall of a via
02/23/2006DE102004038964A1 Leiterplatte mit wenigstens einem thermisch kritischen SMD-Bauteil und Verfahren zum Herstellen, Bestücken und Löten einer Leiterplatte Circuit board with at least one thermally critical SMD component and method of manufacturing, assembling and soldering a circuit board
02/23/2006DE102004037336A1 Verfahren zum Herstellen einer Schicht-Anordnung und Schicht-Anordnung A method for producing a layer arrangement and layer arrangement
02/23/2006DE102004030930A1 Zinnbeschichtete Leiterplatten mit geringer Neigung zur Whiskerbildung Tin plated circuit boards with little tendency to whisker
02/22/2006EP1628511A2 Module for electrical or electonic device
02/22/2006EP1628510A2 Methods of forming printed circuit boards
02/22/2006EP1628509A2 Electronic module with form in-place pedestal
02/22/2006EP1628508A1 Process of manufacturing an electronic module
02/22/2006EP1628363A1 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
02/22/2006EP1628333A1 Method of producing film-thinning circuit board having penetrated structure and protecting adhesive tape
02/22/2006EP1627935A1 Surface treating agent for tin or tin alloy material