| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/03/2006 | CN1768005A Potassium hydrogen peroxymonosulfate solutions |
| 05/03/2006 | CN1768001A Templated cluster assembled wires |
| 05/03/2006 | CN1767951A Organic silver compound and it's preparation method, organic silver ink and it's direct wiring method |
| 05/03/2006 | CN1767921A Phase change lead-free super plastic solders |
| 05/03/2006 | CN1767759A Gathering data relating to electrical components picked from stacked trays |
| 05/03/2006 | CN1767729A Circuit board with recognition information and its making method |
| 05/03/2006 | CN1767728A Method for producing multilayer printed wiring board, multilayer printed wiring board, and electronic device |
| 05/03/2006 | CN1767727A Conductive ball bonding method and conductive ball bonding apparatus |
| 05/03/2006 | CN1767726A Method for mfg. radiation circuit board |
| 05/03/2006 | CN1767725A Method of forming conductive pattern, wiring substrate, electronic device and electronic equipment |
| 05/03/2006 | CN1767724A Method of coupling PCB substrate |
| 05/03/2006 | CN1767722A Printed circuit board assembly |
| 05/03/2006 | CN1767721A Metal coated substrate and manufacturing method of the same |
| 05/03/2006 | CN1767720A Printing wiring board and its production method |
| 05/03/2006 | CN1767719A Multilayer substrate and manufacturing method thereof |
| 05/03/2006 | CN1767265A Graduated stiffness for electrical connections in tires |
| 05/03/2006 | CN1767170A Component built-in module and method of manufacturing the same |
| 05/03/2006 | CN1766582A Method and apparatus for determining solder paste composition quality |
| 05/03/2006 | CN1255007C Welding method between electric components |
| 05/03/2006 | CN1255006C Method for implanting electric terminal on circuit board (A) |
| 05/03/2006 | CN1255005C Method for implanting electric terminal on circuit board (B) |
| 05/03/2006 | CN1254886C Wiring board with terminal |
| 05/03/2006 | CN1254861C Manufacturing method of circuit device |
| 05/03/2006 | CN1254860C Manufacturing method of circuit device |
| 05/03/2006 | CN1254859C Manufacturing method of circuit device |
| 05/03/2006 | CN1254856C Manufacturing method of circuit device |
| 05/03/2006 | CN1254689C Method for detecting missing element and fixing device therefor |
| 05/03/2006 | CN1254687C Probe substrate and method of mfg. probe substrate |
| 05/03/2006 | CN1254528C Solvent composition for washing |
| 05/03/2006 | CN1254512C Material for insulating substrate, printed circuit board, laminate, copper foil with resin, copper-clad laminate, polymide film, film and prepreg for TAB |
| 05/03/2006 | CN1254347C Solder alloy and soldered joint |
| 05/02/2006 | US7039892 Systems and methods for ensuring correct connectivity between circuit designs |
| 05/02/2006 | US7038917 Low loss, high density array interconnection |
| 05/02/2006 | US7038571 Polymer thick film resistor, layout cell, and method |
| 05/02/2006 | US7038478 Stress relieved contact array |
| 05/02/2006 | US7038475 Test method for semiconductor components using conductive polymer contact system |
| 05/02/2006 | US7038327 Anisotropic conductive film bonding pad |
| 05/02/2006 | US7038144 Electronic component and method and structure for mounting semiconductor device |
| 05/02/2006 | US7038143 Wiring board, fabrication method of wiring board, and semiconductor device |
| 05/02/2006 | US7038142 Support for semiconductor; core substrate, fiber reinforced metal, dielectrics and connecting layer; lightweight, thin films; rigidity |
| 05/02/2006 | US7038009 Thermally conductive elastomeric pad and method of manufacturing same |
| 05/02/2006 | US7037833 Pattern forming method, film structure, electro-optical apparatus, and electronic device |
| 05/02/2006 | US7037819 Method of making a circuitized substrate |
| 05/02/2006 | US7037812 Manufacturing method of circuit substrate, circuit substrate and manufacturing device of circuit substrate |
| 05/02/2006 | US7037597 Copper foil used for a direct drilling process by laser, which includes a covering layer of an alloy containing iron and tin for improving laser processability |
| 05/02/2006 | US7037586 Film for circuit board |
| 05/02/2006 | US7037559 Immersion plating and plated structures |
| 05/02/2006 | US7036916 Ink-jet head system |
| 05/02/2006 | US7036712 Methods to couple integrated circuit packages to bonding pads having vias |
| 05/02/2006 | US7036711 Ceramic substrate and copperl foil are heated in the reaction space formed by the interior of the capsule in a protective gas atmosphere there ("inner protective gas atmosphere") to a temperature that is below the melting temperature of the metal, but equal to the melting temperature of cu2o |
| 05/02/2006 | US7036709 Method and structure for implementing column attach coupled noise suppressor |
| 05/02/2006 | US7036222 Method for forming a multi-layer circuit assembly |
| 05/02/2006 | US7036220 Pin-deposition of conductive inks for microelectrodes and contact via filling |
| 05/02/2006 | US7036219 Method for manufacturing a high-efficiency thermal conductive base board |
| 05/02/2006 | US7036218 Method for producing a wafer interposer for use in a wafer interposer assembly |
| 05/02/2006 | US7036217 Methods of manufacturing via intersect pad for electronic components |
| 05/02/2006 | US7036216 Method and apparatus for connecting at least one chip to an external wiring configuration |
| 05/02/2006 | US7036215 Method and program for obtaining positioning errors of printed-wiring board, and electronic-circuit-component mounting system |
| 05/02/2006 | US7036214 Manufacturing method of rigid-flexible printed circuit board and structure thereof |
| 05/02/2006 | US7036212 Apparatus for performing operation on circuit substrate |
| 05/02/2006 | CA2217938C Method for connecting area grid arrays to printed wire board |
| 04/27/2006 | WO2006044767A1 Method and apparatus for supporting and clamping a substrate |
| 04/27/2006 | WO2006043474A1 Composite multilayer substrate and its manufacturing method |
| 04/27/2006 | WO2006043416A1 Multilayer printed wiring board |
| 04/27/2006 | WO2006043415A1 Multilayer printed wiring board |
| 04/27/2006 | WO2006043377A1 Sheet for forming solder bump and method for manufacture thereof |
| 04/27/2006 | WO2006042471A1 Printed circuit board and method of manufacturing the same |
| 04/27/2006 | WO2006014861A3 Jet printing of patterned metal |
| 04/27/2006 | WO2006004971A3 A process of manufacturing a micro-fluid ejection device |
| 04/27/2006 | US20060089012 Method for making a flexible flat cable |
| 04/27/2006 | US20060088953 Method for flip chip bonding by utilizing an interposer with embedded bumps |
| 04/27/2006 | US20060088723 Surface treated copper foil and circuit board |
| 04/27/2006 | US20060088715 Method for gluing fpcb's |
| 04/27/2006 | US20060087044 Electronic component, and system carrier and panel for producing an electronic component |
| 04/27/2006 | US20060086777 Method and apparatus for placing conductive balls |
| 04/27/2006 | US20060086772 System and method for improving hard drive actuator lead attachment |
| 04/27/2006 | US20060086718 Soldering method and device |
| 04/27/2006 | US20060086535 Method for producing multilayer printed wiring board, multilayer printed wiring board, and electronic device |
| 04/27/2006 | US20060086531 Electronic part manufacturing method and electronic part |
| 04/27/2006 | US20060086522 Enhanced connection arrangement for co-planar vertical surface mounting of subassemblies on a mother board |
| 04/27/2006 | DE20321155U1 Abdeckschablone und Abdeckschabloneneinheit Cover template and Abdeckschabloneneinheit |
| 04/27/2006 | DE19810617B4 Hybrid-Übertrager für HF-Mischer in gedruckter Schaltung Transformer hybrid for RF mixer in printed circuit |
| 04/27/2006 | DE19610586B4 Leiterplatte und lagegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte PCB and positionally accurate placing and soldering of electronic components on the surface of the printed circuit board |
| 04/27/2006 | DE102004050684A1 Three-dimensional injection-molded circuit substrate coated with conductive track pattern, for 3D-MID, uses high-content duroplastic material for injection molding |
| 04/27/2006 | DE10039927B4 Oberflächenmontierbares Gehäuse für ein elektronisches Bauelement Surface-mountable housing for an electronic component |
| 04/26/2006 | EP1651021A1 Suspension board with circuit |
| 04/26/2006 | EP1651020A1 Packaging electrode, package, device and process for producing device |
| 04/26/2006 | EP1651019A2 Stencil, frame to stretch said stencil as well as process and device to manufacture stencil |
| 04/26/2006 | EP1651018A1 Substrate and process for producing the same |
| 04/26/2006 | EP1651015A1 Mounting structure for an electro-optical device |
| 04/26/2006 | EP1649734A2 Method and device for filling areas situated in hollows or between tracks with a viscous product on a printed circuit board and equipment using said device |
| 04/26/2006 | EP1649732A1 Connecting flexible circuitry by stitching |
| 04/26/2006 | EP1649413A1 Peripheral card with hidden test pins |
| 04/26/2006 | EP1649410A2 Memory card with raised portion |
| 04/26/2006 | EP1649268A1 Generation of test patterns for subsequent inspection |
| 04/26/2006 | EP1423891B1 Adapter for power transfer |
| 04/26/2006 | EP1414350B1 Ultrasound probe wiring method and apparatus |
| 04/26/2006 | EP1319119B1 Connecting device for routing control and power signals to an internal combustion engine valve actuators |
| 04/26/2006 | EP1183751B1 Rf switch |
| 04/26/2006 | EP1172025B2 Method for manufacturing a multilayer printed circuit board and composite foil for use therein |