| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/08/2006 | CN1745118A Electronic material composition, electronic product and method of using electronic material composition |
| 03/08/2006 | CN1744810A Substrate carrying apparatus |
| 03/08/2006 | CN1744801A Electrolytic copper free electroplating method of multi-layer flexible printing substrate |
| 03/08/2006 | CN1744800A Multilayer wiring board and process for fabricating a multilayer wiring board |
| 03/08/2006 | CN1744799A Wire-laying circuit substrate |
| 03/08/2006 | CN1744798A Method for forming projection of welding on circuit board |
| 03/08/2006 | CN1744797A Circuit wiring forming method |
| 03/08/2006 | CN1744796A Method for producing electroconductive pattern and use thereof |
| 03/08/2006 | CN1744795A Circuit device and manufacture method for circuit device |
| 03/08/2006 | CN1744794A Step type printed circuit board and its manufacturing method |
| 03/08/2006 | CN1744791A Wiring substrate and semiconductor device using the same |
| 03/08/2006 | CN1744314A Semiconductor device having laminated structure and manufacturing method |
| 03/08/2006 | CN1744303A Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device |
| 03/08/2006 | CN1743961A Projection exposure apparatus and method for producing a printed circuit board |
| 03/08/2006 | CN1245062C Target position producing method by two or above press fitting printed circuit boards |
| 03/08/2006 | CN1245061C Printed wiring board and method of production thereof |
| 03/08/2006 | CN1245060C A method for manufacturing plated-through-hole non-formaldehyde electrolytic thick copper |
| 03/08/2006 | CN1245059C Electronic parts module and electric equipment |
| 03/08/2006 | CN1244720C Plating method of electrolytic copper |
| 03/07/2006 | US7010766 Parallel design processes for integrated circuits |
| 03/07/2006 | US7009299 Kinetically controlled solder |
| 03/07/2006 | US7009157 Procedure for soldering the constituent layers of a multilayer printed circuit and the machine used for same |
| 03/07/2006 | US7009142 System and method for joining flat flexible cables |
| 03/07/2006 | US7009138 Laser processing method, laser welding method, and laser processing apparatus |
| 03/07/2006 | US7009117 Printed circuit board and structure for soldering electronic parts thereto |
| 03/07/2006 | US7009115 Optimization of routing layers and board space requirements for a ball grid array package |
| 03/07/2006 | US7009114 includes substrate having wiring pattern and line-shaped insulation pattern disposed on substrate so as to intersect wiring pattern and to define portion of wiring pattern for land electrode |
| 03/07/2006 | US7008809 Pattern formation method and pattern formation apparatus, method for manufacturing device, electro-optical device, electronic device, and method for manufacturing active matrix substrate |
| 03/07/2006 | US7008758 Photomasks; photolithography; plasma enhanced chemical vapor deposition |
| 03/07/2006 | US7008754 Method for forming image on object surface including circuit substrate |
| 03/07/2006 | US7008549 Circuit board, process for producing the same and a power module employing the same |
| 03/07/2006 | US7008483 Curing printed circuit board coatings |
| 03/07/2006 | US7008272 Electrical contact |
| 03/07/2006 | US7008265 Circuit board connector |
| 03/07/2006 | US7008236 Set of printed circuit boards comprising replacement board |
| 03/07/2006 | US7008045 Liquid drop discharger, test chip processor, printer device, method of discharging liquid drop and printing method, method of processing test chip, method of producing organic electroluminescent panel, method of forming conductive pattern, and method of producing field emission display |
| 03/07/2006 | US7007835 Solder bonding technique for assembling a tilted chip or substrate |
| 03/07/2006 | US7007833 Forming solder balls on substrates |
| 03/07/2006 | US7007379 Production method of printed circuit board |
| 03/07/2006 | US7007378 Connector design; flashing gold to exterior surface |
| 03/07/2006 | US7007377 Electronic component placement method |
| 03/02/2006 | WO2006023926A2 Method for forming radio frequency antenna |
| 03/02/2006 | WO2006023294A1 Package with failure-resistant conductive traces |
| 03/02/2006 | WO2006022312A1 Method for manufacturing conductive pattern material |
| 03/02/2006 | WO2006021445A1 Method for coating substrates containing antimony compounds with tin and tin alloys |
| 03/02/2006 | WO2006021423A2 Method and device for coating circuit boards |
| 03/02/2006 | WO2005089076A3 Film type conductive sheet, method for manufacturing the same, and conductive tape using the same |
| 03/02/2006 | US20060047355 Method and apparatus for adjusting characteristics of multi-layer electronic components |
| 03/02/2006 | US20060047043 Silver-based powder, method of preparation thereof, and curable silicone composition |
| 03/02/2006 | US20060047014 Printing process and solder mask ink composition |
| 03/02/2006 | US20060046462 Circuitized substrate, method of making same and information handling system using same |
| 03/02/2006 | US20060046082 Functional thin-film element, producing method thereof, and article using functional thin-film element |
| 03/02/2006 | US20060046040 Composite laminate and method for manufacturing the same |
| 03/02/2006 | US20060044778 Dial module, manufacturing method thereof, led display element, display module, movement module, connector module and meter using them |
| 03/02/2006 | US20060044731 Method for manufacturing multilayer electronic component |
| 03/02/2006 | US20060043991 Circuit board checker and circuit board checking method |
| 03/02/2006 | US20060043635 Singular and co-molded pre-forms |
| 03/02/2006 | US20060043346 Precursor compositions for the deposition of electrically conductive features |
| 03/02/2006 | US20060042952 Methods for forming interconnects in vias and microelectronic workpieces including such interconnects |
| 03/02/2006 | US20060042826 Circuit board, multi-layer wiring board method for making circuity board, and method for making multi-layer wiring board |
| 03/02/2006 | US20060042824 Printed wiring board and method of manufacturing the same |
| 03/02/2006 | US20060042545 Plasma treatment apparatus, method of producing reaction vessel for plasma generation, and plasma treatment method |
| 03/02/2006 | US20060042078 Multi-layer board manufacturing method |
| 03/02/2006 | DE102005041058A1 Verfahren zur Herstellung einer mehrschichtigen Karte A method for producing a multilayer card |
| 03/02/2006 | DE102004061853A1 Combined support structure and manufacturing jig panel for integrated circuit with chip, jig panel and supporting circuit board |
| 03/02/2006 | DE102004056702B3 Verfahren zur Befestigung von elektronischen Bauelementen auf einem Substrat A method for mounting electronic components on a substrate |
| 03/02/2006 | DE102004039834A1 Method of insulating and electrically contacting components or chips arranged on a substrate by provided a metalized structured insulation layer |
| 03/02/2006 | CA2578033A1 Method of manufacturing a porous resin substrate having perforations and method of making a porous resin substrate including perforations having electrically conductive wall faces |
| 03/02/2006 | CA2575991A1 Cleaning compositions for microelectronics substrates |
| 03/01/2006 | EP1631137A1 Module component and method for manufacturing the same |
| 03/01/2006 | EP1631134A1 Multilayer circuit board and method of producing the same |
| 03/01/2006 | EP1631132A2 Aluminium/ceramic bonding substrate |
| 03/01/2006 | EP1630592A1 Tape circuit substrate having a signal line with a slit |
| 03/01/2006 | EP1630128A1 Carbon nanotube device, process for producing the same and carbon nanotube transcriptional body |
| 03/01/2006 | EP1629704A1 Process for filling micro-blind vias |
| 03/01/2006 | EP1629703A1 Method for the structured metal-coating of polymeric and ceramic support materials, and compound that can be activated and is used in said method |
| 03/01/2006 | EP1629702A1 Flexible wiring board and flex-rigid wiring board |
| 03/01/2006 | EP1629549A2 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells |
| 03/01/2006 | EP1629509A2 Polymer thick film resistor, layout cell, and method |
| 03/01/2006 | EP1629420A2 Method for producing a contactless ticket and ticket obtained by means of said method |
| 03/01/2006 | EP1629288A1 Board for probe card, inspection apparatus, photo-fabrication apparatus and photo-fabrication method |
| 03/01/2006 | EP1629137A1 Method for producing metal conductors on a substrate |
| 03/01/2006 | EP1628799A1 Electrode for machine for electromagnetic induction welding of the layers forming a multi-layer printed circuit |
| 03/01/2006 | EP1509358A4 Solder paste flux system |
| 03/01/2006 | EP1425759B1 Electrically conductive particles, especially for introducing in liquid media and method for the production thereof |
| 03/01/2006 | EP1285408B1 Method and device for examining a pre-determined area of a printed circuit board |
| 03/01/2006 | EP1184165B1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil |
| 03/01/2006 | CN2762493Y Small electronic component |
| 03/01/2006 | CN2762490Y Vertical expansion spring sheet device |
| 03/01/2006 | CN2762149Y Testing device for printed board |
| 03/01/2006 | CN2761419Y Fast pressing machine for vacuum flexible laminated board |
| 03/01/2006 | CN1742526A Member for circuit board, method for manufacturing circuit board, apparatus for manufacturing circuit board |
| 03/01/2006 | CN1742525A Circuit board device and method for interconnecting wiring boards |
| 03/01/2006 | CN1742524A Microconnector for FPC connection and method of producing the same |
| 03/01/2006 | CN1742369A Underfill film for printed wiring assemblies |
| 03/01/2006 | CN1742235A Binder diffusion transfer patterning of a thick film paste layer |
| 03/01/2006 | CN1742231A Patterning layers comprised of spin-on ceramic films |
| 03/01/2006 | CN1741904A Industrial microdeposition system including masking to reduce the impact of droplet alignment and droplet volume tolerances and errors |
| 03/01/2006 | CN1741717A Method of manufacturing multi-layered wiring board, electronic device, and electronic apparatus |
| 03/01/2006 | CN1741716A Method for producing multi-layer circuit board by scorifying thickened dielectric material of laser beam |