Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/2006
06/21/2006EP1671523A2 Method of producing a composite multilayer
06/21/2006EP1671515A1 Hearing aid with printed circuit board and microphone suspension
06/21/2006EP1671182A2 Spin-printing of electronic and display components
06/21/2006EP1670596A1 Method of pattern coating
06/21/2006EP1532850B1 Method for forming printing inspection data
06/21/2006EP1507627B1 Automatic machine tool
06/21/2006EP1273212B1 Double-sided wiring board and its manufacture method
06/21/2006EP1137970B1 Method and device for aligning two photo masks with each other and an unexposed printed circuit board blank, and for subsequent simultaneous exposure in the production of double-sided printed circuit boards
06/21/2006CN2790104Y Flexible circuit board moulding device
06/21/2006CN1792128A Transfer assembly for manufacturing electronic devices
06/21/2006CN1792127A Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film using said method
06/21/2006CN1792126A Double-sided wiring board and manufacturing method of double-sided wiring board
06/21/2006CN1792125A Circuit board assembly employing solder vent hole
06/21/2006CN1792012A Method of making an electrical connector
06/21/2006CN1791951A Method of forming sheet having foreign material portions used for forming multilayer wiring board and sheet having foreign portion
06/21/2006CN1791947A Insulating material, film, circuit board and method for manufacture thereof
06/21/2006CN1791703A Device for treating objects, in particular for plating printed circuit boards
06/21/2006CN1791506A Sheet for thermal pressing
06/21/2006CN1791472A Method for forming relief image and paatern formed by that method
06/21/2006CN1791328A Mounting head of electronic component mounting apparatus
06/21/2006CN1791324A Multipart electronic circuit assembly with detachably interconnecting and locking component circuit substrates
06/21/2006CN1791311A Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure
06/21/2006CN1791310A Method for manufacturing a laminated board
06/21/2006CN1791309A Soldering method and apparatus
06/21/2006CN1791308A Heating film manufacturing method and its relational heater
06/21/2006CN1791307A Method for manufacturing electrical heating rear-view mirror heating film and its mirror face
06/21/2006CN1791306A Electric wire formation method, wiring substrate, electrooptical element manufacturing method and electronic apparatus manufacturing method
06/21/2006CN1791305A Circuit component module, electronic circuit device, and method for manufacturing the circuit component module
06/21/2006CN1791302A 印刷布线板 A printed circuit board
06/21/2006CN1791300A Multi-layered circuit board and manufacturing method of multi-layered circuit board
06/21/2006CN1791299A Flexible rigid printed circuit board for display
06/21/2006CN1790696A Electronic device package and electronic equipment
06/21/2006CN1790685A Wiring board with semiconductor component
06/21/2006CN1790684A Ball grid array substrate having window and method of fabricating same
06/21/2006CN1790653A Method for mounting electronic element, method for producing electronic device, circuit board, and electronic instrument
06/21/2006CN1790651A Manufacturing method of chip integrated substrate
06/21/2006CN1790646A Manufacturing method of electronic part and wiring substrate
06/21/2006CN1790644A Circuitized substrates, method of making same, and electrical assemblies and information handling systems utilizing same
06/21/2006CN1790621A Method for forming conductive layer pattern and method for forming electro-optical device and electronic device
06/21/2006CN1790570A Thick-film capacitors and methods of making them
06/21/2006CN1790076A Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics
06/21/2006CN1789006A Laser thermal transfer device, manufacturing method for organic electroluminescent element, and organic electroluminescent element
06/21/2006CN1261011C Mounting apparatus and mounting method
06/21/2006CN1261007C Line board and its producing method
06/21/2006CN1261006C Printed circuit board fabrication-related device
06/21/2006CN1261005C Wiring base plate, semconductor device and its manufacturing mtehod, circuit board and electronic instrument
06/21/2006CN1261004C Circuit board of protective circuit for storage battery
06/21/2006CN1260975C Device for arranging a photoelectric transducer at an electric signal processing device
06/21/2006CN1260790C Wiring substrate and its manufacturing method
06/21/2006CN1260789C Circuit board, semiconductor device mfg. method, and electroplating system
06/21/2006CN1260725C Address changing signal input device and soft disc driver
06/21/2006CN1260620C Exposure method and device for forming pattern on printed circuit board
06/21/2006CN1260617C Photosensitive element, photosensitive element roller, process for producing resist pattern with the same, resist pattern, substrate with overlying resist pattern, process for producing wiring pattern
06/21/2006CN1260608C Active matrix substrate, liquid crystal display apparatus having same, method for mfg of same
06/21/2006CN1260398C Electrolysis method of micro-chip, microchip electroplating system, copper electroplating composition and use
06/21/2006CN1260394C Inhibitor and manufacturing process thereof
06/21/2006CN1260062C Laminate and process for producing the same
06/20/2006US7064962 Transponder assembly for use with parallel optics modules in fiber optic communications systems
06/20/2006US7064751 Display device
06/20/2006US7064632 Microwave circuit
06/20/2006US7064630 High-frequency module and its manufacturing method
06/20/2006US7064627 Signal transmission structure having a non-reference region for matching to a conductive ball attached to the signal transmission structure
06/20/2006US7064566 Probe card assembly and kit
06/20/2006US7064563 Method and structure for measuring a bonding resistance
06/20/2006US7064435 Semiconductor package with improved ball land structure
06/20/2006US7064432 Method and system for bonding a semiconductor chip onto a carrier using micro-pins
06/20/2006US7064427 Buried array capacitor and microelectronic structure incorporating the same
06/20/2006US7064422 Electronic assembly with integrated IO and power contacts
06/20/2006US7064278 Impedance matching connection scheme for high frequency circuits
06/20/2006US7064068 Method to improve planarity of electroplated copper
06/20/2006US7064063 Photo-thermal induced diffusion
06/20/2006US7064015 Semiconductor device and manufacturing method of the same
06/20/2006US7064008 Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin
06/20/2006US7063800 Methods of cleaning copper surfaces in the manufacture of printed circuit boards
06/20/2006US7063797 Mounting electronic components
06/20/2006US7063762 immersion of polytetrafluoroethylene dielectric layers in solutions comprising electroconductive polymers and intermetallic seeding materials, then rinsing, drying and coppering to form printed circuits or laminated chip carriers; electronics
06/20/2006US7063756 Enhanced design and process for a conductive adhesive
06/20/2006US7063543 Assembly for connecting a busbar and printed circuit board
06/20/2006US7063542 Compliant electrical probe device incorporating anisotropically conductive elastomer and flexible circuits
06/20/2006US7063541 Composite microelectronic spring structure and method for making same
06/20/2006US7063249 Electrical circuit apparatus and method
06/20/2006US7062850 Forming a row of aligned windows in a planar surface; depositing an electromigration-inhibiting/electrically conductive material over the planar surface and through the windows to fill; removing portions
06/20/2006US7062849 Method for producing circuitry using molten metal droplets
06/20/2006US7062848 Printable compositions having anisometric nanostructures for use in printed electronics
06/20/2006US7062845 Conveyorized blind microvia laser drilling system
06/20/2006US7062840 Method for forming permanent magnet targets for position sensors
06/15/2006WO2006062457A1 Solder paste stencil and method for producing the same
06/15/2006WO2006061916A1 Printed board and printed board manufacturing method
06/15/2006WO2006061557A1 Conductive silver dispersions and uses thereof
06/15/2006WO2006061223A1 Printing screens , machine and method for screen printing
06/15/2006WO2006050362A3 Method of creating an rfid tag with substantially protected rigid electronic component
06/15/2006WO2006041926A3 Post-fire print fixturing of low temperature co-fired ceramic substrates
06/15/2006WO2006005317A3 Method for the production of an electric component and component
06/15/2006WO2006004971B1 A process of manufacturing a micro-fluid ejection device
06/15/2006WO2005118244A3 Fuel cell bipolar plates of conductive loaded resin-based materials
06/15/2006WO2005114720A3 Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same
06/15/2006WO2005101183A8 Interchangeable graphics card for a computing device
06/15/2006US20060129450 Environmental compliance certification
06/15/2006US20060128835 Capsule type hardener and composition
06/15/2006US20060128834 Microelectronic devices having underfill materials with improved fluxing agents