| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/21/2007 | CN1301635C Manufacturing method and apparatus for circuit substrate |
| 02/21/2007 | CN1301572C Low profile connector |
| 02/21/2007 | CN1301540C Flip chip assembly process and substrate used therewith and printed screen free from being stained with solder |
| 02/21/2007 | CN1301483C Method for producing contactless chip card using transfer paper and intelligent card manufactured by such method |
| 02/21/2007 | CN1301173C Return soldering method |
| 02/20/2007 | US7180752 Method and structures for implementing enhanced reliability for printed circuit board high power dissipation applications |
| 02/20/2007 | US7180749 Circuit board and its manufacturing method |
| 02/20/2007 | US7180578 Exposure assembly for exposing a double-sided printed circuit panel to light |
| 02/20/2007 | US7180440 Integrated circuit for a radar device in a hermetically sealed housing comprising a patch antenna formed from a bent component from sheet metal |
| 02/20/2007 | US7180315 Substrate with patterned conductive layer |
| 02/20/2007 | US7180196 Semiconductor device mounting method, semiconductor device mounting structure, electro-optical device, electro-optical device manufacturing method and electronic device |
| 02/20/2007 | US7180186 Ball grid array package |
| 02/20/2007 | US7180183 Semiconductor device with reinforced under-support structure and method of fabricating the same |
| 02/20/2007 | US7180181 Mesh shaped dam mounted on a substrate |
| 02/20/2007 | US7180170 Lead-free integrated circuit package structure |
| 02/20/2007 | US7180169 Circuit component built-in module and method for manufacturing the same |
| 02/20/2007 | US7180167 Low profile stacking system and method |
| 02/20/2007 | US7180012 Module part |
| 02/20/2007 | US7180007 Electronic circuit device and its manufacturing method |
| 02/20/2007 | US7180006 Tape substrate and method for fabricating the same |
| 02/20/2007 | US7180005 Printed wiring board |
| 02/20/2007 | US7179742 Interconnect circuitry, multichip module, and methods for making them |
| 02/20/2007 | US7179738 Semiconductor assembly having substrate with electroplated contact pads |
| 02/20/2007 | US7179695 Method of forming wiring |
| 02/20/2007 | US7179666 Method for manufacturing an electronic circuit device and electronic circuit device |
| 02/20/2007 | US7179584 Exposure method and device for forming patterns on printed wiring board |
| 02/20/2007 | US7179552 Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
| 02/20/2007 | US7179519 Polyimide/metal laminate, and electric/electronic equipment bases, magnetic recording bases, solar battery bases, coating film for aerospace materials and filmy resistance elements with the use thereof |
| 02/20/2007 | US7179417 Sn—Zn lead-free solder alloy, its mixture, and soldered bond |
| 02/20/2007 | US7179362 Electrodepositing, alloying in presence of alkyl- or alkanol-sulfonic acid, free of cyanide ions, preventing tin oxidation |
| 02/20/2007 | US7179140 Method for connecting an electric conductor electrically to an electronic component |
| 02/20/2007 | US7178903 Ink jet nozzle to eject ink |
| 02/20/2007 | US7178711 Method and device to elongate a solder joint |
| 02/20/2007 | US7178234 Method of manufacturing multi-layer printed circuit board |
| 02/20/2007 | US7178233 Process for producing a collapsed filled via hole |
| 02/20/2007 | US7178232 Connector having improved contacts with fusible members |
| 02/20/2007 | US7178230 Method of manufacturing a metal housing of an electrical connector |
| 02/20/2007 | US7178229 Method of making interlayer panels |
| 02/16/2007 | CA2556133A1 Rfid inlays and methods of their manufacture |
| 02/15/2007 | WO2007018288A1 Lead free solder paste and application thereof |
| 02/15/2007 | WO2007017192A1 Method of manufacturing pattern-forming metal structures on a carrier substrate |
| 02/15/2007 | WO2007016886A1 Metal-ceramic substrate |
| 02/15/2007 | WO2006077163A3 Wire-printed circuit board or card comprising conductors with a rectangular or square cross-section |
| 02/15/2007 | WO2005109458A3 Method of laminating low temperature co-fired ceramic (ltcc) material and product formed thereby |
| 02/15/2007 | US20070037950 Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring board |
| 02/15/2007 | US20070037440 Connection structure for printed wiring board |
| 02/15/2007 | US20070037418 Process of forming socket contacts |
| 02/15/2007 | US20070037003 Dicopper (I) oxalate complexes as precursor for metallic copper deposition |
| 02/15/2007 | US20070036490 Methods for manufacturing optical modules having an optical sub-assembly |
| 02/15/2007 | US20070035688 Electronic apparatus with a wiring terminal |
| 02/15/2007 | US20070035013 Module with built-in circuit elements |
| 02/15/2007 | US20070035004 Semiconductor module |
| 02/15/2007 | US20070034695 Method of determining at least one marking element on a substrate |
| 02/15/2007 | US20070034400 Integrated cable management stay |
| 02/15/2007 | US20070033800 Method for electrically contacting a component to a flat cable |
| 02/15/2007 | US20070033796 Cross-over of conductive interconnects and a method of crossing conductive interconnects |
| 02/15/2007 | DE102005038631A1 Cleaning solder point interspaces e.g. for fabricating circuit boards. Involves machine-controlled or hand guided dry or wet mechanical brushing of solder interspaces |
| 02/15/2007 | DE102005038004A1 Fabrication method, for kitchen-ware item, such as plate, has casting compound and data carrier mounted in recess in plate |
| 02/15/2007 | DE102005037948A1 Sensoranordnung mit einem Sensorbauelement und einem Träger und Verfahren zur Herstellung einer Sensoranordnung Sensor arrangement having a sensor device and a support and method for manufacturing a sensor arrangement |
| 02/15/2007 | DE102005021100B4 Verfahren und Vorrichtung zur Bestückung eines Schaltungsträgers mit zumindest einem neigungssensitiven Element Method and device for mounting of a circuit carrier with at least a tilt sensitive element |
| 02/14/2007 | EP1753279A1 Multilayer circuit board manufacturing method |
| 02/14/2007 | EP1753278A1 Multilayer printed wiring board |
| 02/14/2007 | EP1753277A2 Wiring circuit board |
| 02/14/2007 | EP1753276A1 Method of soldering a quad flat package IC on a printed circuit board |
| 02/14/2007 | EP1753023A2 Method of manufacturing an electronic device in a cavity with a cover |
| 02/14/2007 | EP1752997A1 Inductor |
| 02/14/2007 | EP1752508A1 Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure sensitive adhesive tape or sheet and wiring circuit board. |
| 02/14/2007 | EP1752476A1 Polymer, film-forming composition comprising the polymer, insulating film formed by using the composition and electronic device |
| 02/14/2007 | EP1751328A2 Selective catalytic activation of non-conductive substrates |
| 02/14/2007 | EP1750901A1 Gripper for holding a piece to be machined in a grinding machine |
| 02/14/2007 | EP1578612B1 Continuous web process for the manufacture of electrochemical sensors |
| 02/14/2007 | EP1445995B1 Method of mounting an electronic component on a circuit board and system for carrying out the method |
| 02/14/2007 | EP1324851A4 Polymer collar for solder bumps |
| 02/14/2007 | EP1278405B1 Circuit board producing method and circuit board producing device |
| 02/14/2007 | EP1123525B2 Device and method for the optical inspection of concealed soldered connections |
| 02/14/2007 | EP1100096B1 Electronic device and manufacture thereof |
| 02/14/2007 | EP1043922B1 Multilayer printed wiring board |
| 02/14/2007 | CN2870389Y Fully-automatic circuit-board clinch-bolt connector machine |
| 02/14/2007 | CN2870388Y Circuit-board bending machine |
| 02/14/2007 | CN1914966A 多层印刷配线板 Multilayer printed wiring board |
| 02/14/2007 | CN1914965A Method of manufacturing a circuit carrier and the use of the method |
| 02/14/2007 | CN1914964A Circuits, multilayer circuits, and method of manufacture thereof |
| 02/14/2007 | CN1914963A Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure |
| 02/14/2007 | CN1914962A Method for increasing a routing density for a circuit board and such a circuit board |
| 02/14/2007 | CN1914961A Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
| 02/14/2007 | CN1914359A Sealing agent, method of sealing and printed circuit board treated with the sealing agent |
| 02/14/2007 | CN1914356A Surface-treating agent for metal |
| 02/14/2007 | CN1914239A 固化性树脂组合物 Curable resin composition |
| 02/14/2007 | CN1914001A Soldering flux and soldering method |
| 02/14/2007 | CN1913763A Thermal rubber heat sink and its manufacturing method and circuit board and its manufacturing method |
| 02/14/2007 | CN1913753A Manufacturing method of printed circuit board |
| 02/14/2007 | CN1913752A Method for manufacturing blended multi-layer circuit substrate |
| 02/14/2007 | CN1913751A Wiring circuit board |
| 02/14/2007 | CN1913750A Soldering method and solder joint member |
| 02/14/2007 | CN1913749A Printed wiring board fabrication method, printed wiring board photomask, and program for creating a photomask |
| 02/14/2007 | CN1913748A Method of soldering a quad flat package IC on a printed circuit board |
| 02/14/2007 | CN1913745A Fastening prefabricated element for fixing double-layer printing circuit board |
| 02/14/2007 | CN1913742A Wiring structure of printed circuit board |
| 02/14/2007 | CN1913150A Method for fabricating electronic circuit module and integrated circuit device |
| 02/14/2007 | CN1913116A Repairing method for bad paster in mobile phone camera mould set |