| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 02/01/2007 | DE102005034082A1 Verfahren zum Aufbringen von elektrischen Leiterstrukturen auf ein Zielbauteil aus Kunststoff A method of applying electrical conductor patterns on a target component made of plastic |
| 02/01/2007 | DE102005018539B4 Werkzeug zur Durchführung einer Wärmebehandlung Tool for carrying out a heat treatment |
| 02/01/2007 | DE102005015656B4 Verfahren zum elektrischen Verbinden von RFID-Chipmodulen mit RFID-Antennen und Transpondern A method of electrically connecting the RFID chip modules with RFID transponders and antennas |
| 02/01/2007 | DE102004055616B4 Verfahren zum Verbinden einer Modulbrücke mit einem Substrat und mehrschichtiger Transponder Method for connecting a bridge module comprising a substrate and multilayered transponder |
| 02/01/2007 | CA2616793A1 Bending-type rigid printed wiring board and process for producing the same |
| 01/31/2007 | EP1748381A1 Installation for production of electronic modules or circuit boards comprising RFID-chips |
| 01/31/2007 | EP1748092A1 Copper foil and its manufacturing method |
| 01/31/2007 | EP1747706A2 Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 01/31/2007 | CN2865193Y Improved structure for circuit board cleaning machine |
| 01/31/2007 | CN2865192Y Positioning device for circuit board temporary storage shelf |
| 01/31/2007 | CN1906988A Device for the vibration-proof mounting of electric special components and/or electric circuits |
| 01/31/2007 | CN1906987A Improved populated printed wiring board and method of manufacture |
| 01/31/2007 | CN1906986A Multilayer substrate incorporating chip type electronic component and production method therefor |
| 01/31/2007 | CN1906985A Multilayer circuit board manufacturing method |
| 01/31/2007 | CN1906984A Printed circuit board, a printed circuit assembly and electronic apparatus |
| 01/31/2007 | CN1906983A Micro-electromechanical sub-assembly having an on-chip transfer mechanism |
| 01/31/2007 | CN1906982A Molded abrasive brush and methods of using for manufacture of printed circuit boards |
| 01/31/2007 | CN1906981A Backup board for machining process |
| 01/31/2007 | CN1906799A Coupler resource module |
| 01/31/2007 | CN1906797A Triangular conforming transmission structure |
| 01/31/2007 | CN1906705A Conductive fine particle and anisotropic conductive material |
| 01/31/2007 | CN1906526A Method for gravure printing transparent electrodes, and ink composition therefor |
| 01/31/2007 | CN1906367A Faade covering |
| 01/31/2007 | CN1906265A Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof |
| 01/31/2007 | CN1906234A Polymer composite formed article, printed wiring board using the formed article and method for producing them |
| 01/31/2007 | CN1906036A Method and device for printing printed material |
| 01/31/2007 | CN1906028A Continuous production method for both-sided conductor polyimide laminate |
| 01/31/2007 | CN1906027A Continuous production method for both-sided conductor polyimide laminate |
| 01/31/2007 | CN1906019A Press for the production of laminates |
| 01/31/2007 | CN1905782A Surface treating method and film pattern forming method |
| 01/31/2007 | CN1905781A High flexible copper-clad laminate manufacturing method |
| 01/31/2007 | CN1905780A High-heat radiation lubricating aluminium cover plate for drilling |
| 01/31/2007 | CN1905779A Circuitboard and method for preventing crystal oscillator electromagnetic interference on circuitaboard |
| 01/31/2007 | CN1905200A Wiring base plate and making method, electro-optic device and method of manufacturing same, electronic device and making method |
| 01/31/2007 | CN1905182A Circuit base board, mounting structure for semiconductor device with bumps, and electro-optic device |
| 01/31/2007 | CN1904733A Conductor composition for use in LTCC photosensitive tape on substrate applications |
| 01/31/2007 | CN1298203C Circuit apparatus |
| 01/31/2007 | CN1298083C Electrical connector housing |
| 01/31/2007 | CN1298082C 图像传感器模块 The image sensor module |
| 01/31/2007 | CN1298051C Semiconductor device |
| 01/31/2007 | CN1298045C Method for manufacturing semiconductor device with embedded multilayer wiring structure |
| 01/31/2007 | CN1298033C Anisotropic conductive adhesive, assembling method, and electrooptical device module |
| 01/31/2007 | CN1298019C Film pattern forming method and device, and active matrix substrate manufacturing method |
| 01/31/2007 | CN1297996C Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet |
| 01/31/2007 | CN1297852C Photosensitive ceramics composition and method for making multi-layer substrate using it |
| 01/31/2007 | CN1297642C Semiconductor substrate cleaning composition |
| 01/31/2007 | CN1297398C Laminate and its producing method |
| 01/30/2007 | US7170757 Field changeable graphics system for a computing device |
| 01/30/2007 | US7170756 Trimming electrical parameters in a power supply switching regulator electrical circuit |
| 01/30/2007 | US7170754 SDIO memory and interface card |
| 01/30/2007 | US7170183 Wafer level stacked package |
| 01/30/2007 | US7170171 Support ring for use with a contact pad and semiconductor device components including the same |
| 01/30/2007 | US7170012 Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus |
| 01/30/2007 | US7170011 System and method for modifying electrical characteristics |
| 01/30/2007 | US7169947 Dicopper(I) oxalate complexes for use as precursor substances in metallic copper deposition |
| 01/30/2007 | US7169693 Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same |
| 01/30/2007 | US7169646 Interconnect assemblies and methods |
| 01/30/2007 | US7169640 Card manufacturing technique and resulting card |
| 01/30/2007 | US7169332 Insulated conductive ball for anisotropic conductive connection, method of preparing the same, and product using the same |
| 01/30/2007 | US7169331 decreases the warp of the ceramic multilayer substrate; comprises a copper powder coated with a first metal oxide having a melting point exceeding the melting point of copper |
| 01/30/2007 | US7169327 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof |
| 01/30/2007 | US7169216 Electroless copper plating solution, electroless copper plating process and production process of circuit board |
| 01/30/2007 | US7169195 Capacitor, circuit board with built-in capacitor and method of manufacturing the same |
| 01/30/2007 | US7168964 High density connector and method of manufacture |
| 01/30/2007 | US7168957 Via providing multiple electrically conductive paths |
| 01/30/2007 | US7168936 Light transparent substrate imprint tool with light blocking distal end |
| 01/30/2007 | US7168164 Methods for forming via shielding |
| 01/30/2007 | US7168161 Manufacturing method of solid-state image sensing device |
| 01/30/2007 | US7168160 Method for mounting and heating a plurality of microelectronic components |
| 01/30/2007 | US7168155 Method of manufacturing an integrated thin film head |
| 01/30/2007 | US7168154 Method of constructing an integrated lead suspension |
| 01/25/2007 | WO2007010927A1 SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH |
| 01/25/2007 | WO2007010758A1 Wiring board, wiring material, copper-clad laminate, and wiring board fabrication method |
| 01/25/2007 | WO2007010705A1 Capacitor, method for manufacturing capacitor, substrate with built-in capacitor, and method for manufacturing substrate with built-in capacitor |
| 01/25/2007 | WO2007010642A1 Screen printing apparatus and screen priting method |
| 01/25/2007 | WO2007009510A1 Method for applying electrical conductor patterns to a target component of plastic |
| 01/25/2007 | WO2007009508A1 Method for applying electrical conductor patterns to a target component of plastic |
| 01/25/2007 | WO2006068741A3 Flexible electronic circuit articles and methods of making thereof |
| 01/25/2007 | WO2006022416A3 Solder composition, connecting process with soldering, and connection structure with soldering |
| 01/25/2007 | WO2006022415A3 Solder composition, connecting process with soldering, and connection structure with soldering |
| 01/25/2007 | WO2005116760A3 Photosensitive resin composition, and cured product and use thereof |
| 01/25/2007 | US20070021787 Biocompatible bonding method and electronics package suitable for implantation |
| 01/25/2007 | US20070020971 Housing of circuit boards |
| 01/25/2007 | US20070019352 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 01/25/2007 | US20070019034 Inkjet nozzle assembly with pre-shaped actuator |
| 01/25/2007 | US20070018757 Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias |
| 01/25/2007 | US20070018362 Device and method for large area lithography |
| 01/25/2007 | US20070018315 Conductive adhesive composition |
| 01/25/2007 | US20070017959 Solder joint determination method, solder inspection method, and solder inspection device |
| 01/25/2007 | US20070017693 Printed circuit board including pads with vacancies |
| 01/25/2007 | US20070017652 Apparatus, mold, and method for manufacturing metal-ceramic composite member |
| 01/25/2007 | US20070017093 Method of making an interposer with contact structures |
| 01/25/2007 | US20070017092 Method and apparatus for forming multi-layered circuits using liquid crystalline polymers |
| 01/25/2007 | US20070017091 Method for Manufacturing Multi-Layered Ceramic Electronic Component |
| 01/25/2007 | US20070017090 Method of forming metal plate pattern and circuit board |
| 01/25/2007 | DE3806984C5 Verfahren sowie Vorrichtung zum Trennen eines Leiterplattennutzens Method and apparatus for separating a printed circuit board benefits |
| 01/25/2007 | DE202006003057U1 Arrangement of electronic components to form a continuous or endless circuit board structure |
| 01/25/2007 | DE19927046B4 Keramik-Metall-Substrat als Mehrfachsubstrat Ceramic-metal substrate as a multiple substrate |
| 01/25/2007 | DE19752176B4 Herstellungssystem für bestückte Leiterplatten und zugehöriges Verfahren Production system for printed circuit board assemblies and associated method |
| 01/25/2007 | DE102005041354B3 Method of mounting components provided with gold stud bumps onto a circuit board using isostatic force |