Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2007
01/02/2007US7156361 Method and apparatus for forming metal contacts on a substrate
01/02/2007US7156283 Method for making a solder between metallic balls of an electronic component and mounting lands of a circuit and soldering furnace therefor
01/02/2007US7156279 System and method for mounting electronic components onto flexible substrates
01/02/2007US7156233 Tamper barrier enclosure with corner protection
01/02/2007US7155823 Manufacturing inkjet printheads with large numbers of nozzles
01/02/2007US7155820 Method for manufacturing printed circuit board
01/02/2007US7155819 System for making a conductive circuit on a substantially non-conductive substrate
01/02/2007US7155817 Apparatus and method for mounting components on substrate
01/02/2007US7155816 Method for producing a multilayer ceramic substrate
01/02/2007US7155815 Electrical contacting method
01/02/2007CA2418683C Area-array with low inductance connecting device
12/2006
12/28/2006WO2006137504A1 Electronic component thermo-compression tool, and electronic component mounting apparatus and mounting method
12/28/2006WO2006137304A1 Adhesive and adhesive sheet
12/28/2006WO2006137043A1 Warpage preventing substrates and method of making same
12/28/2006WO2006136362A2 Device for treatment of surfaces and planar objects
12/28/2006WO2006124693A3 Method and composition for improving adhesion of organic polymer coatings with copper surface
12/28/2006WO2005021836A3 Chromium-free antitarnish adhesion promoting treatment composition
12/28/2006WO2005018292A3 Selective application of conductive material to circuit boards by pick and place
12/28/2006WO2004082180A3 Method for optimizing high frequency performance of via structures
12/28/2006US20060292813 Electronic component and method for manufacturing the same
12/28/2006US20060292722 Flexible interconnect structures for electrical devices and light sources incorporating the same
12/28/2006US20060292434 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
12/28/2006US20060292383 Metal-coated substrate and manufacturing method of the same
12/28/2006US20060292346 Sheet for thermal pressing
12/28/2006US20060290460 Ultra-thin flexible inductor
12/28/2006US20060290438 Microstrip line dielectric overlay
12/28/2006US20060290009 Semiconductor device and method for manufacturing the same
12/28/2006US20060290008 SMT passive device noflow underfill methodology and structure
12/28/2006US20060289872 Wiring substrate, electronic device, electro-optical device, and electronic apparatus
12/28/2006US20060289203 Double-sided wiring board, double sided wiring board manufacturing method, and multilayer wiring board
12/28/2006US20060289202 Stacked microvias and method of manufacturing same
12/28/2006US20060288574 Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers
12/28/2006US20060288573 Fluororesin thin film diaphragm pressure sensor and method of fabricating the same
12/28/2006US20060288572 Method of manufacturing semiconductor device
12/28/2006US20060288570 Method and structures for implementing customizable dielectric printed circuit card traces
12/28/2006US20060288569 Electronic circuit board assembly fixturing device and method of making electronic circuit board assemblies
12/28/2006US20060288567 Sacrificial component
12/28/2006US20060288564 Thin-film magnetic head, a head gimbal assembly, and a hard disk drive
12/28/2006US20060288563 Manufacturing method for a wireless communication device and manufacturing apparatus
12/28/2006DE112005000177T5 Schaltungsmaterialien, Schaltungen, Mehrschichtschaltungen und Verfahren zu ihrer Herstellung Circuit materials, circuits, multi-layer circuits, and methods for their preparation
12/28/2006DE102006027464A1 Component e.g. controller, detachable assembly method for printed circuit board, involves connecting circuit points of components over bore hole of metallic small plate so that connection of components is provided with conductor paths
12/28/2006DE102005028250A1 Leiterpaste zum Herstellen einer elektrischen Leiterbahn und Herstellungsverfahren der elektrischen Leiterbahn unter Verwendung der Leiterpaste A conductor paste for forming an electrical conductor and manufacturing method of the electric conductor sheet using the conductor paste
12/27/2006EP1737285A2 Circuit pattern forming method and circuit pattern forming device
12/27/2006EP1737284A2 Circuit pattern forming method, circuit pattern forming device and printed circuit board
12/27/2006EP1737282A1 Circuit board, its manufacturing method, and joint box using circuit board
12/27/2006EP1737086A1 Light beam bonding
12/27/2006EP1737034A1 Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE AND PROCESS FOR PRODUCING Al/AlN JOINT MATERIAL
12/27/2006EP1736569A1 Electroplating jig
12/27/2006EP1736499A1 Thermosetting silicone resin composition, resin film, metallic foil, insulation film, metal-clad laminate, multi-layered metal-clad laminate and multi-layered printed-wiring board comprising the composition and use of the composition as a film, on a foil, in a laminate or printed wiring board
12/27/2006EP1736324A2 Process and apparatus for providing an arbitrary pattern from a metallic or metallized layer on a substrate
12/27/2006EP1736273A1 Soldering flux and soldering method
12/27/2006EP1736034A1 Variable watt density layered heater
12/27/2006EP1735853A1 Method for providing a substrate with a printed pattern
12/27/2006EP1735852A1 Method for providing a substrate with a printed pattern which comprises a number of separate pattern elements
12/27/2006EP1735820A2 Fabrication and use of superlattice
12/27/2006EP1735663A1 Lithographic method products obtained and use of said method
12/27/2006EP1668697A4 Electrical circuit apparatus and methods for assembling same
12/27/2006EP1586112B1 Binder diffusion patterning of a thick film paste layer
12/27/2006EP1565516B1 Silver-based powder, method of preparation thereof, and curable silicone composition
12/27/2006EP1401984B1 Ultraviolet activatable adhesive film
12/27/2006EP1333050B1 Material for insulating film, coating varnish for insulating film, and insulating film and semiconductor device using the same
12/27/2006EP1266430B1 Method for making an electroconductive joint
12/27/2006CN2852605Y Connection device for realizing lamp mirror and PCB fixation
12/27/2006CN2852604Y Electronic apparatus
12/27/2006CN1887036A Electric circuit arrangement
12/27/2006CN1886821A Methods for making vertical electrical feed through structures
12/27/2006CN1886707A Circuit substrate manufacturing method and system, substrate used for the same, and circuit substrate using the same
12/27/2006CN1886034A Printed circuit board using convex point and manufacturing method thereof
12/27/2006CN1886033A Circuit pattern forming method, circuit pattern forming device and printed circuit board
12/27/2006CN1886032A Multilayered structure forming method
12/27/2006CN1886031A Method for forming fine patterns using soft mold
12/27/2006CN1886030A Printed circuit board wiring technique based on nanometer TiO2 photocatalysis property
12/27/2006CN1886029A Flexible circuit substrate manufacturing method
12/27/2006CN1886028A Composite structure
12/27/2006CN1886027A Electronic board, method of manufacturing the same, and electronic device
12/27/2006CN1886026A Printed circuit board with embedded electronic components
12/27/2006CN1886025A 配线基板 Wiring board
12/27/2006CN1886024A Printed circuit board having embedded RF module power stage circuit
12/27/2006CN1292629C Method for manufacturing multilayer wiring board
12/27/2006CN1292628C Method for forming induction and through-hole in single chip circuit
12/27/2006CN1292627C Circuit substrate
12/27/2006CN1292626C A circuit board and manufacturing method thereof
12/27/2006CN1292625C Printed circuit board, combined substrate, manufacturing method of printed circuit board and electronic device
12/27/2006CN1292462C Multi-layer circuit board and mfg method, electronic device and electronic apparatus
12/27/2006CN1292421C Optical head device, optical disk apparatus using optical head device
12/27/2006CN1292312C Patten drawing device
12/27/2006CN1292309C Panel surface exposing device
12/27/2006CN1292308C Resin composition, process for producing resin composition, and method of forming resin film
12/27/2006CN1292278C Device for holding an optical fiber
12/27/2006CN1292260C Device and method for inspection
12/27/2006CN1292037C Adhisive piece for fixing flexible printed circuit-board and method for fitting electronic element on flexible printed circuit board
12/27/2006CN1291834C Method for producing a ceramic substrate and ceramic substrate
12/26/2006US7155197 High-frequency module and communication apparatus
12/26/2006US7154760 Power amplifier module
12/26/2006US7154753 Circuit structural body and method for manufacturing the same
12/26/2006US7154373 Surface mounting chip network component
12/26/2006US7154356 Radio frequency (RF) circuit board topology
12/26/2006US7154355 Transmission line with a transforming impedance and solder lands
12/26/2006US7154353 Microstrip lines in a multi-layered shielded configuration
12/26/2006US7154172 Integrated circuit carrier