Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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04/11/2007 | CN1310577C Flexible base boards |
04/11/2007 | CN1310320C Flexible interconnection device, fingerprint transducing device and manufacturing method thereof |
04/11/2007 | CN1310316C Mixed integrated circuit apparatus |
04/11/2007 | CN1310297C Packaging base plate with no plating bar and making method for same |
04/11/2007 | CN1310259C Method for producing electronic parts, and material for production thereof |
04/11/2007 | CN1310088C Photosensitive resin composition and use thereof |
04/11/2007 | CN1310013C Apparatus for measuring convex shape and method thereof |
04/11/2007 | CN1309878C Continuous processing device for plate processing element and electric contact method |
04/11/2007 | CN1309874C Tin plating method |
04/11/2007 | CN1309786C Thermosetting resin composition and laminates and circuit board substrates made by same |
04/11/2007 | CN1309527C 激光加工方法 The laser processing method |
04/11/2007 | CN1309523C Solder ball bonding method and bonding device |
04/11/2007 | CN1309518C Array method for drill spindles of printed circuit board drilling machine or forming machine |
04/11/2007 | CN1309486C Method of and apparatus for substrate pre-treatment |
04/10/2007 | US7203921 Method and system for designing an integrated circuit with reduced noise |
04/10/2007 | US7203388 Printed circuit board including waveguide and method of producing the same |
04/10/2007 | US7203075 Screen mask |
04/10/2007 | US7203073 Circuit-constituting member and circuit unit |
04/10/2007 | US7203071 Component mounting circuit board with resin-molded section covering circuit pattern and inner components |
04/10/2007 | US7202770 Voltage variable material for direct application and devices employing same |
04/10/2007 | US7202755 Semi-suspended coplanar waveguide on a printed circuit board |
04/10/2007 | US7202677 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
04/10/2007 | US7202582 Electric machine with a circuit board for wiring lines of a winding system |
04/10/2007 | US7202555 Pitch change and chip scale stacking system and method |
04/10/2007 | US7202422 Electromagnetically shielded circuit device and shielding method therefor |
04/10/2007 | US7202421 Electronic elements, method for manufacturing electronic elements, circuit substrates, method for manufacturing circuit substrates, electronic devices and method for manufacturing electronic devices |
04/10/2007 | US7202420 Methods to prevent mechanical flexure related BGA failure |
04/10/2007 | US7202369 Decarboxylation and etherification with cyclization |
04/10/2007 | US7202156 Process for manufacturing a wiring substrate |
04/10/2007 | US7202155 Method for manufacturing wiring and method for manufacturing semiconductor device |
04/10/2007 | US7202154 Suspension for filling via holes in silicon and method for making the same |
04/10/2007 | US7202017 as the main substrate can be separated from the sub substrate along the thin portion, the separation line will not be located at an unintended position or will not be in an unintended shape. As a result, reliability of the pattern formed on the main substrate is improved |
04/10/2007 | US7201802 Apparatus for providing a substrate with viscous medium |
04/10/2007 | US7201511 Light emitting module |
04/10/2007 | US7201304 Electroconductive alloy of tin and lead; first fluxing agent reacting with oxide of metal to promote melting of metal at first temperature; second fluxing agent having higher melting temperature; resolidification; rosin or resin binder |
04/10/2007 | US7200930 Probe for semiconductor devices |
04/10/2007 | US7200927 Method for producing a wiring transfer sheet |
04/10/2007 | US7200926 Parts mounting method |
04/10/2007 | US7200925 Component mounting method |
04/10/2007 | US7200924 Method of packaging electronic parts |
04/10/2007 | US7200920 Method for the implementation of electronic components in via-holes of a multi-layer multi-chip module |
04/10/2007 | US7200919 Method of fabricating a magnetic transducer with multilayer conductive leads including a tantalum layer, a chromium layer and a rhodium layer |
04/10/2007 | US7200907 Method of manufacturing piezoelectric device |
04/05/2007 | WO2007038156A2 Led lighting with integrated heat sink and process for manufacturing same |
04/05/2007 | WO2007037553A1 Process for producing substrate with metal wiring |
04/05/2007 | WO2007037086A1 Substrate with built-in component and method for manufacturing such substrate |
04/05/2007 | WO2007037075A1 Process for producing wiring board, and wiring board |
04/05/2007 | WO2007036991A1 Atmosphere controlled joining device, joining method, and electronic device |
04/05/2007 | WO2007036610A1 Attachment of conductor structure to object |
04/05/2007 | WO2007036551A1 Conductive textile, antenna and vehicle seat |
04/05/2007 | WO2007036181A1 Connection of two semi-conductor plates or flat components by means of a mechanical lock |
04/05/2007 | WO2006105521A3 System and method for advanced mezzanine card connection |
04/05/2007 | WO2006087529A3 Printing screens |
04/05/2007 | WO2005050708A3 Stair step printed circuit board structures for high speed signal transmissions |
04/05/2007 | US20070077687 Method of producing circuit carriers with integrated passive components |
04/05/2007 | US20070077514 Photosensitive resin composition, photosensitive element, resist pattern forming method and process for manufacturing printed circuit board |
04/05/2007 | US20070075767 Inductor element containing circuit board and power amplifier module |
04/05/2007 | US20070075715 Contact Carriers (Tiles) For Populating Larger Substrates With Spring Contacts |
04/05/2007 | US20070075408 Semiconductor device and radiation detector employing it |
04/05/2007 | US20070075058 High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
04/05/2007 | US20070075034 Electronic device and method of manufacturing thereof |
04/05/2007 | US20070074907 Method of manufacturing an electronic device and an electronic device |
04/05/2007 | US20070074895 Printed circuit board and manufacturing method thereof |
04/05/2007 | US20070074392 Membrane probing system |
04/05/2007 | US20070074391 Method of producing circuit board |
04/05/2007 | US20070074390 Component mounting apparatus |
04/05/2007 | US20070074389 Reducing loadline impedance in a system |
04/05/2007 | US20070074384 Manufacturing method for a wireless communication device and manufacturing apparatus |
04/05/2007 | DE112005000952T5 Elektronik-Modul und Verfahren zur Herstellung desselben The same electronic module and method for producing |
04/05/2007 | DE112004002827T5 Verfahren zum Bohren von Durchgangslöchern in homogenen und nicht-homogenen Substraten The method of drilling through-holes in homogeneous and non-homogeneous substrates |
04/05/2007 | DE10357251B4 Anordnung, an der elektronische Bauteile anbringbar sind Assembly to which electronic components are mountable |
04/05/2007 | DE10338297B4 Busschiene Bus bar |
04/05/2007 | DE10229337B4 Elektronische Baugruppe Electronic assembly |
04/05/2007 | DE102006038725A1 Heating strip-shaped carrier, i.e. film, in oven to fix electronic components on carrier, involves passing carrier through oven and moving carrier further in direction of conveyance while returning heatable plate to starting position |
04/05/2007 | DE102005047026A1 Printed circuit board has an array of contact points extending from the warm side to the cold side, and filled with solder metal |
04/05/2007 | DE102005046970A1 Printed circuit board for ball grid array components has pre-drilled or milled zones located beneath the components |
04/05/2007 | DE10029396B4 Elektrische Schaltungsvorrichtung Electric circuit device |
04/04/2007 | EP1771051A1 Male contact and process for contacting an electrical lead of an injection molded circuit substrate |
04/04/2007 | EP1771050A1 Printed circuit board and method of manufacturing printed circuit board |
04/04/2007 | EP1770777A2 Semiconductor device |
04/04/2007 | EP1769658A1 Forming electrical conductors on a substrate |
04/04/2007 | EP1769547A2 Electric circuit battery support |
04/04/2007 | EP1769531A2 Assembly and method of placing the assembly on an external board |
04/04/2007 | EP1428677B1 Printing plate, circuit board and method of printing circuit board |
04/04/2007 | EP1353804B1 Ink-jet printer having carriage and flexible circuit movably connected, method and apparatus |
04/04/2007 | CN2885790Y Framework type retractable plate machine |
04/04/2007 | CN1943286A Preferential asymmetric through-hole positoning for printed circuit boards |
04/04/2007 | CN1943024A Wiring board and semiconductor device |
04/04/2007 | CN1942524A Polyimidesiloxane solution composition |
04/04/2007 | CN1942310A Process for producing double-sided metal clad laminate and double-sided metal clad laminate produced by the process |
04/04/2007 | CN1942298A Cushioning material for heat press and manufacturing method thereof, and manufacturing method of laminated board |
04/04/2007 | CN1942281A Joining method and device therefor |
04/04/2007 | CN1942269A Silver powder coated with silver compound and manufacturing method thereof |
04/04/2007 | CN1942094A Electronic component moving device, surface mounting machine and ic automatically conveying device |
04/04/2007 | CN1942071A Display device, repairing structure for display device circuit and its production |
04/04/2007 | CN1942060A Method for fastly recovering circuit board, clamping and cutting circuit board block and circuit base plate |
04/04/2007 | CN1942059A Mark recognition method and printing apparatus |
04/04/2007 | CN1942058A Method for inspecting handi inserted component |
04/04/2007 | CN1942057A Method of forming metal plate pattern and circuit board |
04/04/2007 | CN1942056A Production of flexible circuit board |