Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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12/26/2006 | US7154155 Wing-shaped surface mount package for light emitting diodes |
12/26/2006 | US7154139 Embedded capacitors using conductor filled vias |
12/26/2006 | US7154048 Common electrode wire for plating |
12/26/2006 | US7154046 Flexible dielectric electronic substrate and method for making same |
12/26/2006 | US7154045 Wired circuit board |
12/26/2006 | US7154044 Flat cable conductor, method of making the same and flat cable using the same |
12/26/2006 | US7153775 Conductive material patterning methods |
12/26/2006 | US7153590 Composite copper foil and manufacturing method thereof |
12/26/2006 | US7153449 Acidic treatment liquid and method of treating copper surfaces |
12/26/2006 | US7153445 Hydrogen peroxide, a pH adjuster, a topography modifier, and a uniformity enhancer, and free of halogen ions. |
12/26/2006 | US7153186 Jet singulation |
12/26/2006 | US7153143 Circuit carrier and production thereof |
12/26/2006 | US7152996 Diode lighting system |
12/26/2006 | US7152319 Method of making high speed circuit board |
12/26/2006 | US7152318 Method for manufacturing built-up printed circuit board with stacked type via-holes |
12/26/2006 | US7152317 Circuit forming method |
12/26/2006 | US7152316 Hybrid integrated circuit device and method of manufacturing the same |
12/26/2006 | US7152315 Method of making a printed circuit board |
12/26/2006 | US7152314 Method of manufacturing circuit board |
12/26/2006 | US7152313 Package substrate for integrated circuit and method of making the substrate |
12/26/2006 | US7152312 Method for transmitting current through a substrate |
12/21/2006 | WO2006135246A1 A method in the fabrication of a ferroelectric memory device |
12/21/2006 | WO2006134977A1 Multilayer printed wiring board |
12/21/2006 | WO2006134914A1 Printed wiring board |
12/21/2006 | WO2006134891A1 Method for soldering module substrate |
12/21/2006 | WO2006134854A1 Image processing device, image drawing device, and system |
12/21/2006 | WO2006134846A1 Curing accelerator, thermosetting resin composition, photosensitive composition, photosensitive film, permanent pattern and method for forming same |
12/21/2006 | WO2006134734A1 Screen printing plate and screen printer |
12/21/2006 | WO2006134399A1 Transmission line |
12/21/2006 | WO2006134220A1 Method for manufacturing a circuit board structure, and a circuit board structure |
12/21/2006 | WO2006134217A1 Method for manufacturing a circuit board structure, and a circuit board structure |
12/21/2006 | WO2006134216A2 Circuit board structure and method for manufacturing a circuit board structure |
12/21/2006 | WO2006134082A1 Compact passive transponder |
12/21/2006 | WO2006134006A1 Electrically conductive, mechanically flexible connection between electrical or electronic components |
12/21/2006 | WO2006133761A2 Partially shaped electrically conductive structure and method for the production thereof |
12/21/2006 | WO2006122025B1 Process for minimizing electromigration in an electronic device |
12/21/2006 | WO2005103824A3 Method of forming a metal pattern on a substrate |
12/21/2006 | WO2005091998A3 Electrical connector in a flexible host |
12/21/2006 | WO2005086978A3 Embedded power management control circuit |
12/21/2006 | WO2005045997A3 An electrical circuit assembly with improved shock resistance |
12/21/2006 | US20060286858 Printed wiring board connection structure |
12/21/2006 | US20060286828 Contact Structures Comprising A Core Structure And An Overcoat |
12/21/2006 | US20060286826 Joint member and joint connector for wire harness |
12/21/2006 | US20060286823 PCB and connector design |
12/21/2006 | US20060286722 Methods for making microwave circuits |
12/21/2006 | US20060286716 Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package |
12/21/2006 | US20060286714 Semiconductor device and system having semiconductor device mounted thereon |
12/21/2006 | US20060286704 Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus |
12/21/2006 | US20060286449 Battery provided with terminals |
12/21/2006 | US20060286316 Conductive film for transfer, method for forming transparent conductive film using same, and transparent conductive film |
12/21/2006 | US20060286304 Methttod for producing metal conductors on a substrate |
12/21/2006 | US20060286301 Substrates and method of manufacturing same |
12/21/2006 | US20060284927 Inkjet printhead with common chamber and actuator material |
12/21/2006 | US20060284717 Flyback transformer wire attach method to printed circuit board |
12/21/2006 | US20060284287 Two-pole smt miniature housing for semiconductor components and method for the manufacture thereof |
12/21/2006 | US20060283917 Method of soldering or brazing articles having surfaces that are difficult to bond |
12/21/2006 | US20060283710 Methods of and apparatus for making high aspect ratio microelectromechanical structures |
12/21/2006 | US20060283629 Wiring board and method for manufacturing the same |
12/21/2006 | US20060283627 Substrate structure of integrated embedded passive components and method for fabricating the same |
12/21/2006 | US20060283626 Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board |
12/21/2006 | US20060283624 Method and apparatus for providing hermetic electrical feedthrough |
12/21/2006 | US20060283616 Cable and production method therefor |
12/21/2006 | US20060283116 Facade covering |
12/21/2006 | US20060283012 Apparatus and method for solder ball placement |
12/21/2006 | US20060283005 Conductive pattern and method of making |
12/21/2006 | DE19729891B4 Verfahren zur gezielten Aufrauhung von Kunststoffoberflächen und Vorrichtung zur Ausführung des Verfahrens A method for the targeted roughening plastic surfaces and apparatus for carrying out the method |
12/21/2006 | DE10223957B4 Ein verbessertes Verfahren zum Elektroplattieren von Kupfer auf einer strukturierten dielektrischen Schicht An improved method for electroplating copper on a patterned dielectric layer |
12/21/2006 | DE102005028196A1 Vorrichtung zum Wellenlöten Apparatus for wave soldering |
12/21/2006 | DE102005027898A1 Apparatus for selectively steering a laser beam having an optical control element such that the wavelength of the beam is variable |
12/21/2006 | DE102005027652A1 Elektrisch leitfähige, mechanisch flexible Verbindung zwischen elektrischen bzw. elektronischen Bauteilen Electrically conductive, mechanically flexible connection between the electrical or electronic components |
12/21/2006 | DE102005026241A1 Electrical component, e.g. a thermistor, has a ceramic base body and connections using wires with insulation shrouding melted by soldering |
12/20/2006 | EP1734801A1 Packaging method of electronic component |
12/20/2006 | EP1734800A2 Technique for manufacturing an overmolded electronic assembly |
12/20/2006 | EP1734799A1 Passive compact transponder |
12/20/2006 | EP1734570A1 Method for packaging electronic component |
12/20/2006 | EP1734569A1 Process for producing semiconductor module |
12/20/2006 | EP1734544A1 Lead for electronic device for signal transmission |
12/20/2006 | EP1734543A1 Method for manufacturing electronic device for signal transmission |
12/20/2006 | EP1734147A1 Process for producing austenite stainless steel, solder melting vessel and autosoldering apparatus |
12/20/2006 | EP1734071A1 Light-activatable polymer compositions |
12/20/2006 | EP1734068A1 Polymer composite formed article, printed wiring board using the formed article and method for producing them |
12/20/2006 | EP1733834A1 Device for wave soldering with a nozzle having openings, wherein the outer openings form an ondulating curve in the feeding direction of the workpieces |
12/20/2006 | EP1733833A1 Device for wave soldering with a nozzle having openings, which density changes in the feeding direction of the workpieces |
12/20/2006 | EP1733281A2 Method of forming a metal pattern on a substrate |
12/20/2006 | EP1733067A1 Method of metallizing a silicone rubber substrate |
12/20/2006 | EP1406745B1 Soldering flux vehicle additive |
12/20/2006 | EP1329488B1 Ink-jet ink and process for producing the same |
12/20/2006 | EP1009200B1 Circuit member and circuit board |
12/20/2006 | CN2850204Y 一体化贴膜机 Integration laminator |
12/20/2006 | CN1883241A Circuit board |
12/20/2006 | CN1883240A Methods and devices for manufacturing of electrical components and laminated structures |
12/20/2006 | CN1883237A Lighting device of discharge lamp, illumination apparatus and illumination system |
12/20/2006 | CN1882719A Improved copper bath for electroplating fine circuitry on semiconductor chips |
12/20/2006 | CN1882664A Formation of self-assembled monolayers |
12/20/2006 | CN1882243A Device for handling components and method of controlling |
12/20/2006 | CN1882239A Method for automatically adsorbing nut and adsorption structure |
12/20/2006 | CN1882224A Wiring board and method for manufacturing the same |
12/20/2006 | CN1882223A Printed circuit board making method |
12/20/2006 | CN1882222A Fixing apparatus that assistant metal assembly is fixed on circuit board |
12/20/2006 | CN1882221A Electronic component module and electronic device using the same |