Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2006
12/26/2006US7154155 Wing-shaped surface mount package for light emitting diodes
12/26/2006US7154139 Embedded capacitors using conductor filled vias
12/26/2006US7154048 Common electrode wire for plating
12/26/2006US7154046 Flexible dielectric electronic substrate and method for making same
12/26/2006US7154045 Wired circuit board
12/26/2006US7154044 Flat cable conductor, method of making the same and flat cable using the same
12/26/2006US7153775 Conductive material patterning methods
12/26/2006US7153590 Composite copper foil and manufacturing method thereof
12/26/2006US7153449 Acidic treatment liquid and method of treating copper surfaces
12/26/2006US7153445 Hydrogen peroxide, a pH adjuster, a topography modifier, and a uniformity enhancer, and free of halogen ions.
12/26/2006US7153186 Jet singulation
12/26/2006US7153143 Circuit carrier and production thereof
12/26/2006US7152996 Diode lighting system
12/26/2006US7152319 Method of making high speed circuit board
12/26/2006US7152318 Method for manufacturing built-up printed circuit board with stacked type via-holes
12/26/2006US7152317 Circuit forming method
12/26/2006US7152316 Hybrid integrated circuit device and method of manufacturing the same
12/26/2006US7152315 Method of making a printed circuit board
12/26/2006US7152314 Method of manufacturing circuit board
12/26/2006US7152313 Package substrate for integrated circuit and method of making the substrate
12/26/2006US7152312 Method for transmitting current through a substrate
12/21/2006WO2006135246A1 A method in the fabrication of a ferroelectric memory device
12/21/2006WO2006134977A1 Multilayer printed wiring board
12/21/2006WO2006134914A1 Printed wiring board
12/21/2006WO2006134891A1 Method for soldering module substrate
12/21/2006WO2006134854A1 Image processing device, image drawing device, and system
12/21/2006WO2006134846A1 Curing accelerator, thermosetting resin composition, photosensitive composition, photosensitive film, permanent pattern and method for forming same
12/21/2006WO2006134734A1 Screen printing plate and screen printer
12/21/2006WO2006134399A1 Transmission line
12/21/2006WO2006134220A1 Method for manufacturing a circuit board structure, and a circuit board structure
12/21/2006WO2006134217A1 Method for manufacturing a circuit board structure, and a circuit board structure
12/21/2006WO2006134216A2 Circuit board structure and method for manufacturing a circuit board structure
12/21/2006WO2006134082A1 Compact passive transponder
12/21/2006WO2006134006A1 Electrically conductive, mechanically flexible connection between electrical or electronic components
12/21/2006WO2006133761A2 Partially shaped electrically conductive structure and method for the production thereof
12/21/2006WO2006122025B1 Process for minimizing electromigration in an electronic device
12/21/2006WO2005103824A3 Method of forming a metal pattern on a substrate
12/21/2006WO2005091998A3 Electrical connector in a flexible host
12/21/2006WO2005086978A3 Embedded power management control circuit
12/21/2006WO2005045997A3 An electrical circuit assembly with improved shock resistance
12/21/2006US20060286858 Printed wiring board connection structure
12/21/2006US20060286828 Contact Structures Comprising A Core Structure And An Overcoat
12/21/2006US20060286826 Joint member and joint connector for wire harness
12/21/2006US20060286823 PCB and connector design
12/21/2006US20060286722 Methods for making microwave circuits
12/21/2006US20060286716 Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package
12/21/2006US20060286714 Semiconductor device and system having semiconductor device mounted thereon
12/21/2006US20060286704 Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus
12/21/2006US20060286449 Battery provided with terminals
12/21/2006US20060286316 Conductive film for transfer, method for forming transparent conductive film using same, and transparent conductive film
12/21/2006US20060286304 Methttod for producing metal conductors on a substrate
12/21/2006US20060286301 Substrates and method of manufacturing same
12/21/2006US20060284927 Inkjet printhead with common chamber and actuator material
12/21/2006US20060284717 Flyback transformer wire attach method to printed circuit board
12/21/2006US20060284287 Two-pole smt miniature housing for semiconductor components and method for the manufacture thereof
12/21/2006US20060283917 Method of soldering or brazing articles having surfaces that are difficult to bond
12/21/2006US20060283710 Methods of and apparatus for making high aspect ratio microelectromechanical structures
12/21/2006US20060283629 Wiring board and method for manufacturing the same
12/21/2006US20060283627 Substrate structure of integrated embedded passive components and method for fabricating the same
12/21/2006US20060283626 Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
12/21/2006US20060283624 Method and apparatus for providing hermetic electrical feedthrough
12/21/2006US20060283616 Cable and production method therefor
12/21/2006US20060283116 Facade covering
12/21/2006US20060283012 Apparatus and method for solder ball placement
12/21/2006US20060283005 Conductive pattern and method of making
12/21/2006DE19729891B4 Verfahren zur gezielten Aufrauhung von Kunststoffoberflächen und Vorrichtung zur Ausführung des Verfahrens A method for the targeted roughening plastic surfaces and apparatus for carrying out the method
12/21/2006DE10223957B4 Ein verbessertes Verfahren zum Elektroplattieren von Kupfer auf einer strukturierten dielektrischen Schicht An improved method for electroplating copper on a patterned dielectric layer
12/21/2006DE102005028196A1 Vorrichtung zum Wellenlöten Apparatus for wave soldering
12/21/2006DE102005027898A1 Apparatus for selectively steering a laser beam having an optical control element such that the wavelength of the beam is variable
12/21/2006DE102005027652A1 Elektrisch leitfähige, mechanisch flexible Verbindung zwischen elektrischen bzw. elektronischen Bauteilen Electrically conductive, mechanically flexible connection between the electrical or electronic components
12/21/2006DE102005026241A1 Electrical component, e.g. a thermistor, has a ceramic base body and connections using wires with insulation shrouding melted by soldering
12/20/2006EP1734801A1 Packaging method of electronic component
12/20/2006EP1734800A2 Technique for manufacturing an overmolded electronic assembly
12/20/2006EP1734799A1 Passive compact transponder
12/20/2006EP1734570A1 Method for packaging electronic component
12/20/2006EP1734569A1 Process for producing semiconductor module
12/20/2006EP1734544A1 Lead for electronic device for signal transmission
12/20/2006EP1734543A1 Method for manufacturing electronic device for signal transmission
12/20/2006EP1734147A1 Process for producing austenite stainless steel, solder melting vessel and autosoldering apparatus
12/20/2006EP1734071A1 Light-activatable polymer compositions
12/20/2006EP1734068A1 Polymer composite formed article, printed wiring board using the formed article and method for producing them
12/20/2006EP1733834A1 Device for wave soldering with a nozzle having openings, wherein the outer openings form an ondulating curve in the feeding direction of the workpieces
12/20/2006EP1733833A1 Device for wave soldering with a nozzle having openings, which density changes in the feeding direction of the workpieces
12/20/2006EP1733281A2 Method of forming a metal pattern on a substrate
12/20/2006EP1733067A1 Method of metallizing a silicone rubber substrate
12/20/2006EP1406745B1 Soldering flux vehicle additive
12/20/2006EP1329488B1 Ink-jet ink and process for producing the same
12/20/2006EP1009200B1 Circuit member and circuit board
12/20/2006CN2850204Y 一体化贴膜机 Integration laminator
12/20/2006CN1883241A Circuit board
12/20/2006CN1883240A Methods and devices for manufacturing of electrical components and laminated structures
12/20/2006CN1883237A Lighting device of discharge lamp, illumination apparatus and illumination system
12/20/2006CN1882719A Improved copper bath for electroplating fine circuitry on semiconductor chips
12/20/2006CN1882664A Formation of self-assembled monolayers
12/20/2006CN1882243A Device for handling components and method of controlling
12/20/2006CN1882239A Method for automatically adsorbing nut and adsorption structure
12/20/2006CN1882224A Wiring board and method for manufacturing the same
12/20/2006CN1882223A Printed circuit board making method
12/20/2006CN1882222A Fixing apparatus that assistant metal assembly is fixed on circuit board
12/20/2006CN1882221A Electronic component module and electronic device using the same