Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/2007
02/14/2007CN1913044A Thick film conductor composition, and its use in ltcc circuit and device
02/14/2007CN1912186A Oxygen charging device of sal ammoniac etching liquid
02/14/2007CN1912184A Etching method of copper-coated electronic circuit board
02/14/2007CN1912042A Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure sensitive adhesive tape or sheet and wiring circuit board
02/14/2007CN1912023A Coloured conductive ink and printing matter using said coloured conductive ink
02/14/2007CN1301052C Filtration of flux contaminants device and method
02/14/2007CN1301051C Printed circuitboard
02/14/2007CN1301049C Soldering method and soldering structure body
02/14/2007CN1301048C Method for producing distributing base board
02/14/2007CN1301047C Welding disk pattern structure and substrate for carrging electrical components
02/14/2007CN1301046C Flexible printed wiring board for chip-on-film
02/14/2007CN1301045C Multilayer terminal plate assembly, multilayer terminal plate assembly unit and its manufacturing method
02/14/2007CN1301044C 电路装置 Circuit device
02/14/2007CN1301043C Circuit device and its mfg. method
02/14/2007CN1300939C High-frequency switch assembly and high-frequency instrument mounting said high-frequency switch assembly
02/14/2007CN1300641C Residue removing liquor compsn. of photo resist
02/14/2007CN1300152C Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins
02/14/2007CN1300149C Dicopper(I)oxalate complexes for use as precursor substancesin metallic copper deposition
02/14/2007CN1299899C Screen printing method
02/14/2007CN1299873C Method for laser machining a workpiece with laser spot enlargement
02/14/2007CN1299573C Electronic component material containing insect repellent, electronic mail using the material and manufacture thereof
02/13/2007US7177548 Optical module
02/13/2007US7177161 Compact radio equipment and method of mounting the same
02/13/2007US7177136 Wiring board, electro-optical device, method of manufacturing the electro-optical device, and electronic instrument
02/13/2007US7176889 Force sensing pointing device with click function
02/13/2007US7176773 High density inductor and method for producing same
02/13/2007US7176756 Inductor element containing circuit board and power amplifier module
02/13/2007US7176582 Semiconductor device and method of manufacturing same
02/13/2007US7176578 Method for processing a thin film substrate
02/13/2007US7176569 Semiconductor device and method of manufacturing the same
02/13/2007US7176568 Semiconductor device and its manufacturing method, electronic module, and electronic unit
02/13/2007US7176409 Multiple beam micromachining system for removing at least two different layers of a substrate
02/13/2007US7176402 Method and apparatus for processing electronic parts
02/13/2007US7176388 Soldering method and solder joint member
02/13/2007US7176383 Printed circuit board with low cross-talk noise
02/13/2007US7176382 Electrical circuit board and method for making the same
02/13/2007US7176381 Printed circuit board and method of printing identification marks
02/13/2007US7176131 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same
02/13/2007US7176058 Chip scale package and method of fabricating the same
02/13/2007US7176055 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
02/13/2007US7176052 Capacitor, circuit board, method of formation of capacitor, and method of production of circuit board
02/13/2007US7175920 Copper foil for high-density ultra-fine printed wiring board
02/13/2007US7175919 Activation surfaces; press bonding
02/13/2007US7175876 Applying a release polymer to a substrate in a desired pattern, applying an adherent polymer over the pattern and substrate, and mechanically removing the adherent polymer from the pattern without requiring solvent, especially by applying adhesive tape and peeling or abrading the polymer from the pattern
02/13/2007US7175805 magnesium content being effective quantity for forming a protective magnesium oxide film on the surface of solder and also for destroying said oxide film during soldering
02/13/2007US7175804 Sn-Zn lead-free solder alloy, and solder junction portion
02/13/2007US7175774 Method of fabricating inkjet nozzles
02/13/2007US7175736 Laminate for electronic circuit
02/13/2007US7175677 Methodology for making electrical contact from a button cell battery to a printed circuit board and a process for manufacturing the same
02/13/2007US7175482 Connector assembly for an implantable medical device and process for making
02/13/2007US7175305 LED symbol signal
02/13/2007US7174632 Method of manufacturing a double-sided circuit board
02/13/2007US7174629 Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor
02/13/2007US7174628 Memory card production using prefabricated cover and molded casing portion
02/13/2007CA2186482C Palladium colloid solution and its utilisation
02/08/2007WO2007016323A2 Forming conductive strips with loop-engageable touch fasteners
02/08/2007WO2007016224A1 Mounting electrical components
02/08/2007WO2007015938A2 Method for patterning an underbump metallizattion layer using a dry etc process
02/08/2007WO2007015551A1 Polishing composition and polishing method
02/08/2007WO2007015367A1 Process for producing junction structure
02/08/2007WO2007014549A1 Process for producing a multilayer ceramic composite
02/08/2007US20070032078 Suspension for filling via holes in silicon and method for making the same
02/08/2007US20070031638 Thin film structure and manufacturing method therefor
02/08/2007US20070031279 Solder composition for electronic devices
02/08/2007US20070030683 Mounting arrangement for light emitting diodes
02/08/2007US20070030659 Multilayer laminated circuit board
02/08/2007US20070030435 Liquid crystal display devices
02/08/2007US20070030314 Micro-electromechanical nozzle assembly with an arcuate actuator
02/08/2007US20070029673 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
02/08/2007US20070029670 Semiconductor device and radiation detector employing it
02/08/2007US20070029639 Edge intensive antifuse and method for making the same
02/08/2007US20070029495 Alignment method and apparatus for pixilated detector
02/08/2007US20070029391 Method for producing a contactless ticket and ticket and ticket obtained by means of said method
02/08/2007US20070029183 fabricating method of keypad assembly
02/08/2007US20070029108 Printed circuit board and soldering method and apparatus
02/08/2007US20070029107 Wiring board and production method of wiring board
02/08/2007US20070029106 Multilayer printed wiring board
02/08/2007DE202006018111U1 Wet-chemical treatment device for raw material e.g., for circuit board, wafer, has sprayed jet interruption device positioned to be guided discontinuously onto raw material
02/08/2007DE202005015466U1 Circuit board system has two parallel circuit boards joined by solder rods engaging in the boards by through openings that form a pattern for connecting an electrical plug
02/08/2007DE10210841B4 Modul und Verfahren zur Herstellung von elektrischen Schaltungen und Modulen Module and process for manufacture of electrical circuitry and modules
02/08/2007DE102006033448A1 Eine Vorrichtung und ein Verfahren zum Löten eines Bauteils an eine Platine An apparatus and a method of soldering a component to a circuit board
02/08/2007DE102005046563B3 Soldering unit for soldering surface components has solder bath with removable cover and gas nozzle producing a protective gas atmosphere between the solder bath and the cover
02/08/2007DE102005038522A1 Laser cutting machine is used to separate electronic circuit boards that are moved by linear motors
02/08/2007DE102005026127B4 Druckmaschine und ein Verfahren zur Herstellung eines Druckerzeugnisses Printing machine and a method for producing a printed product
02/08/2007DE102004050391B4 Verfahren zum Herstellen einer Schicht-Anordnung und Schicht-Anordnung A method for producing a layer arrangement and layer arrangement
02/07/2007EP1750491A2 System and method for manufacturing flexible copper clad laminate film
02/07/2007EP1750489A1 Flexible printed circuit and manufacturing method thereof
02/07/2007EP1749600A1 Silver powder coated with silver compound and manufacturing method thereof
02/07/2007EP1749570A1 Method for oxidizing substance and oxidation apparatus therefor
02/07/2007EP1749425A1 Transport device
02/07/2007EP1749334A1 Flexible scrub ring contact
02/07/2007EP1748864A2 Soldering process
02/07/2007EP1623369B1 Method for mounting an electronic component on a substrate
02/07/2007EP0961809B1 Low temperature method and compositions for producing electrical conductors
02/07/2007CN2867811Y Material releasing device used by printing circuit board make-up machine
02/07/2007CN2867797Y Electronic element insert and clasp fixing structure
02/07/2007CN2867793Y Fast extruding packaging machine
02/07/2007CN2867631Y Thermal transfer printing wireless radio-frequency lable
02/07/2007CN2865968Y Tornado type hot air circulating device used for hot air reflux welding
02/07/2007CN1910975A Providing differentiated levels of solder paste for a circuit paste for a circuit board