| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/08/2007 | US20070055039 Latent curing agent and composition |
| 03/08/2007 | US20070054114 Multilayer anisotropic conductive adhesive and connection structure using the same |
| 03/08/2007 | US20070054112 Conductive layers and fabrication methods thereof |
| 03/08/2007 | US20070054106 Method of recycling mixed streams of ewaste (weee) |
| 03/08/2007 | US20070054098 Multi-layer ceramic substrate and manufacturing method thereof |
| 03/08/2007 | US20070054060 Droplet applying method and droplet applying device, and device and electronic equipment |
| 03/08/2007 | US20070053577 Production of test patterns for test inspection |
| 03/08/2007 | US20070052791 Methods and systems for thermal-based laser processing a multi-material device |
| 03/08/2007 | US20070052787 Method for fixing functional material apparatus for fixing functional material, device fabrication method, electrooptical device, and electronic equipment |
| 03/08/2007 | US20070052757 Electronically addressable microencapsulated ink and display thereof |
| 03/08/2007 | US20070052112 Support with solder ball elements and a method for populating substrates with solder balls |
| 03/08/2007 | US20070051927 Fine metal particles and fine metal oxide particles in dry powder form, and use thereof |
| 03/08/2007 | US20070051772 Modular rotary anvil |
| 03/08/2007 | US20070051695 Printed wiring board and method for manufacturing the same |
| 03/08/2007 | US20070051694 Formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate in which circuit is comprised of an electroless plated film and in which an electrolytic plated film and a roughened layer are formed on part of surface of circuit; prevents cracking |
| 03/08/2007 | US20070051459 Method for forming wiring on insulating resin layer |
| 03/08/2007 | US20070051253 Method and apparatus for performing operations within a stencil printer |
| 03/08/2007 | US20070050974 Efficient wafer processing technology |
| 03/08/2007 | DE4437573B4 Klebstoff zur Bindung eines Fluorkohlenwasserstoffharzsubstrats an ein Metall, Verfahren zu seiner Herstellung in Filmform und seine Verwendung Adhesive for bonding a fluorocarbon resin to a metal substrate, a process for its preparation in a film form and its use |
| 03/08/2007 | DE112005000232T5 Verfahren zur Verbindung von Keramik mit Kupfer, ohne dabei eine Wölbung im Kupfer zu erzeugen Method of joining ceramics with copper without thereby produce a curvature in the copper |
| 03/08/2007 | DE102005042415A1 Circuit arrangement e.g. for motor vehicle door locks, uses stamped wire conduction element for interconnecting circuit components |
| 03/08/2007 | DE102005039829A1 Verfahren zum Löten von SMD-Bauteilen, Leiterplatte und Reflow-Lötofen dazu Method for soldering SMD components, PCB and reflow soldering oven to |
| 03/07/2007 | EP1761120A1 Wired circuit board |
| 03/07/2007 | EP1761116A2 Circuit board having electronic parts mounted thereon by using under-fill material and method for producing the same |
| 03/07/2007 | EP1760783A2 Semiconductor device and automotive ac generator |
| 03/07/2007 | EP1760778A2 Multilayer circuit board |
| 03/07/2007 | EP1760736A1 Process of forming variable capacitor |
| 03/07/2007 | EP1760133A1 Adhesive agent composition and adhesive film for electronic component |
| 03/07/2007 | EP1760042A2 Method of manufacturing connecting and/or bonding means of a device. |
| 03/07/2007 | EP1759244A2 Photosensitive resin composition, and cured product and use thereof |
| 03/07/2007 | EP1759039A2 Process for preparing a non-conductive substrate for electroplating |
| 03/07/2007 | EP1579024B1 Flexible frame for mounting a deposition mask |
| 03/07/2007 | EP1518859B1 Process for the purification of thiophenes |
| 03/07/2007 | EP1436237B1 Bonding method and product |
| 03/07/2007 | EP1273213B1 Method and apparatus for applying viscous or paste material onto a substrate |
| 03/07/2007 | EP1189308B1 Electrical connection material and electrical connection method |
| 03/07/2007 | EP1181848B1 Ultraviolet curable silver composition and related method |
| 03/07/2007 | CN2877190Y Pressing device for fast press of flexible circuitboard |
| 03/07/2007 | CN2877189Y Fast press for flexible circuitboard |
| 03/07/2007 | CN2877188Y Electronic element pin positioning structure |
| 03/07/2007 | CN2875649Y Resistance wire shaping working outfit |
| 03/07/2007 | CN1926932A Module heat dissipating structure and control device using the same |
| 03/07/2007 | CN1926931A Multilayer board manufacturing method |
| 03/07/2007 | CN1926930A 电路板制造方法与电路板 Circuit board manufacturing method of the circuit board |
| 03/07/2007 | CN1926929A Electronic component mounting method and electronic component mounting structure |
| 03/07/2007 | CN1926928A Circuit device and method for manufacturing same |
| 03/07/2007 | CN1926675A Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film |
| 03/07/2007 | CN1926646A Magnetic part |
| 03/07/2007 | CN1926643A Insulated conductive particles and an anisotropic conductive film containing the particles |
| 03/07/2007 | CN1926179A Etched polycarbonate films |
| 03/07/2007 | CN1926174A Active energy line cured resin, optical solidified and thermosetting resin composition containing said resin and its condensate |
| 03/07/2007 | CN1925982A Carrier foil-attached electrolytic copper foil proviuded with insulation layer forming resin layer, copper-clad laminated sheet, printed circuit board, production method for multilayer copper-clad lam |
| 03/07/2007 | CN1925946A Weld grease |
| 03/07/2007 | CN1925726A Flux collection system |
| 03/07/2007 | CN1925725A Method for manufacturing circuit substrate |
| 03/07/2007 | CN1925724A Method of forming circuit pattern on printed circuit board |
| 03/07/2007 | CN1925723A Substrate processing device |
| 03/07/2007 | CN1925719A Module, method of manufacturing module, and electronic apparatus using module |
| 03/07/2007 | CN1925717A Circuit board and electronic device including same and method for manufacturing same |
| 03/07/2007 | CN1925209A Minus magnetism conducting rate material constituted of branch shape structural unit |
| 03/07/2007 | CN1925148A Multilayer wiring substrate and method for manufacturing same |
| 03/07/2007 | CN1924599A Conduction checking device and method for printed base plate |
| 03/07/2007 | CN1924088A Polyimide polymer for preparing copper-cover laminated plate and preparation method thereof |
| 03/07/2007 | CN1303854C Method and device for mounting semiconductor chip |
| 03/07/2007 | CN1303853C Dip soldering method and dip soldering device |
| 03/07/2007 | CN1303852C Radiating structure of lead frame package and method for improving radiating performance of the same package |
| 03/07/2007 | CN1303851C 软体印刷电路板 Software printed circuit board |
| 03/07/2007 | CN1303726C Low profile connector |
| 03/07/2007 | CN1303679C Connector and method of manufacturing the same |
| 03/07/2007 | CN1303677C Circuit substrate, mounting structure of semiconductor element with lug and electrio-optical device |
| 03/07/2007 | CN1303655C Polishing method for base copper-layer |
| 03/07/2007 | CN1303646C Sticking device for reinforcing plate |
| 03/07/2007 | CN1303175C Conductive adhesive and circuit comprising same |
| 03/07/2007 | CN1302899C Punching tool with re-usable, neutral structural groups |
| 03/07/2007 | CN1302863C Cleaning roller device with vertical movement mechanism |
| 03/06/2007 | US7187559 Circuit board device and its manufacturing method |
| 03/06/2007 | US7187556 Power distribution system |
| 03/06/2007 | US7187518 Flexible printed circuit for spindle motor and disk drive having the same |
| 03/06/2007 | US7187086 Integrated circuit arrangement |
| 03/06/2007 | US7187074 Semiconductor and electronic device with spring terminal |
| 03/06/2007 | US7187072 Fabrication process of semiconductor package and semiconductor package |
| 03/06/2007 | US7187071 Composite electronic component |
| 03/06/2007 | US7186926 Surface mounting structure for surface mounting an electronic component |
| 03/06/2007 | US7186925 Electronic circuit device and method of manufacturing the same |
| 03/06/2007 | US7186924 Dielectric structure for printed circuit board traces |
| 03/06/2007 | US7186923 Printed wiring boards and methods for making them |
| 03/06/2007 | US7186922 Circuit board |
| 03/06/2007 | US7186921 Circuit device and manufacturing method thereof |
| 03/06/2007 | US7186920 Flexible wiring board, an intermediate product of a flexible wiring board, and a multi-layer flexible wiring board |
| 03/06/2007 | US7186645 Selective plating of package terminals |
| 03/06/2007 | US7186636 Nickel bonding cap over copper metalized bondpads |
| 03/06/2007 | US7186584 Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument |
| 03/06/2007 | US7186365 Forming a first mold by screen printing, forming a second mold from the first mold, forming an imprinting tool from the second mold, by metalizing at least a portion of the second mold |
| 03/06/2007 | US7186311 Process for producing substrate for flexible circuit board |
| 03/06/2007 | US7186307 Method for manufacturing a ceramic multilayer circuit board |
| 03/06/2007 | US7186305 Process for improving the adhesion of polymeric materials to metal surfaces |
| 03/06/2007 | US7186136 FFC-connection assembly |
| 03/06/2007 | US7186123 High density connector and method of manufacture |
| 03/06/2007 | US7185973 Assembly for material deposition |
| 03/06/2007 | US7185799 Method of creating solder bar connections on electronic packages |