| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 12/20/2006 | CN1882220A Wiring board and method for manufacturing the same |
| 12/20/2006 | CN1882219A Wiring structure of printed circuit board transmission line |
| 12/20/2006 | CN1882218A Substrate with composite medium and multilayer substrate made by the same |
| 12/20/2006 | CN1881575A Electronic member |
| 12/20/2006 | CN1881088A 扫描仪系统 The scanner system |
| 12/20/2006 | CN1291635C Method for acquiring printed circuit board positioning error and circuit component installing method and system |
| 12/20/2006 | CN1291629C An electronic assembly and a method of constructing an electronic assembly |
| 12/20/2006 | CN1291628C Wiring board |
| 12/20/2006 | CN1291627C Circuit board for cross-connected electric connector and its production method |
| 12/20/2006 | CN1291467C Method for manufacturing electronic device |
| 12/20/2006 | CN1291418C Electroconductive paste and method of producing the same |
| 12/20/2006 | CN1291278C Radiation-sensitive resin composition |
| 12/20/2006 | CN1291234C Printed board checking apparatus |
| 12/20/2006 | CN1290701C Liquid drop blowing-out device and method, electro-optical device and manufacturing method thereof |
| 12/20/2006 | CN1290660C Laser beam machining device |
| 12/20/2006 | CN1290626C Base board carrying method and apparatus between wet-film coating machine and circulating air oven and device therefor |
| 12/19/2006 | US7151674 Mold-type electronic control unit |
| 12/19/2006 | US7151431 Resistor element, stress sensor and method for manufacturing them |
| 12/19/2006 | US7151420 Electromagnetically shielded slot transmission line |
| 12/19/2006 | US7151321 Laminated electronic component |
| 12/19/2006 | US7151313 Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment |
| 12/19/2006 | US7151310 Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device |
| 12/19/2006 | US7151306 Electronic part, and electronic part mounting element and an process for manufacturing such the articles |
| 12/19/2006 | US7151251 Connector and image sensor module using the same |
| 12/19/2006 | US7151229 Printed circuit board with improved cooling of electrical component |
| 12/19/2006 | US7151228 Laminating double-side circuit board, manufacturing method thereof, and multilayer printed circuit board using same |
| 12/19/2006 | US7151014 Underfilling process in a molded matrix array package using flow front modifying solder resist |
| 12/19/2006 | US7150955 Light-sensitive sheet comprising support, first and second light-sensitive layers and barrier layer |
| 12/19/2006 | US7150898 Droplet applying method and droplet applying device, and device and electronic equipment |
| 12/19/2006 | US7150820 Thiourea- and cyanide-free bath and process for electrolytic etching of gold |
| 12/19/2006 | US7150406 Thin electronic label and method for making same |
| 12/19/2006 | US7150387 Process and apparatus for flow soldering |
| 12/19/2006 | US7150096 Universal tool for uniformly applying a force to a plurality of components on a circuit board |
| 12/19/2006 | CA2313017C Ground clip apparatus for circuit boards |
| 12/14/2006 | WO2006131979A1 METHOD FOR SOLDERING ELCTROLESS Ni PLATING PART |
| 12/14/2006 | WO2006131422A1 Printing machine and a method for producing a printed product |
| 12/14/2006 | WO2006112695A3 Method for electroforming a stencil, and a stencil of this type |
| 12/14/2006 | WO2005103822A3 Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same |
| 12/14/2006 | US20060281361 Connection structure of printed wiring board |
| 12/14/2006 | US20060281343 Printed wiring board connection structure |
| 12/14/2006 | US20060281342 Methods Of Making A Interconnect |
| 12/14/2006 | US20060281294 Method of forming a penetration electrode and substrate having a penetration electrode |
| 12/14/2006 | US20060279943 Interposers with alignment fences and semiconductor device assemblies including the interposers |
| 12/14/2006 | US20060279940 Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors |
| 12/14/2006 | US20060279300 Probe Card Assembly And Kit |
| 12/14/2006 | US20060279201 Droplet discharge method, electro optical device and electronic apparatus |
| 12/14/2006 | US20060279200 Droplet discharge method, electro-optic device, and electronic apparatus |
| 12/14/2006 | US20060279018 applying liquids containing polymers on substrates, then stamping relief patterns; electronics such as displays and detectors |
| 12/14/2006 | US20060279000 Pre-solder structure on semiconductor package substrate and method for fabricating the same |
| 12/14/2006 | US20060278999 Substrate for Pre-Soldering Material and Fabrication Method Thereof |
| 12/14/2006 | US20060278967 Method for manufacturing an electronic module and an electronic module |
| 12/14/2006 | US20060278684 Jig and method for connecting connection members using the same |
| 12/14/2006 | US20060278430 Method for manufacturing a midplane |
| 12/14/2006 | US20060278429 Closed loop backdrilling system |
| 12/14/2006 | DE19834410B4 Laserbearbeitungsvorrichtung Laser processing apparatus |
| 12/14/2006 | DE112004002510T5 Schaltkreise, Mehrschichtschaltungen und Verfahren zu ihrer Herstellung Circuits, multi-layer circuits, and methods for their preparation |
| 12/14/2006 | DE102006025711A1 Mehrschichtsubstrat mit leitfähiger Struktur und Harzfilm und Verfahren zur Herstellung desselben Of the same multi-layer substrate with conductive structure and resin film and method for producing |
| 12/14/2006 | DE102005042072A1 Vertical electrical contact connections e.g. micro-vias, producing method for silicon carbide-wafer, involves laser boring of passage holes through wafer and active layers and applying antiwetting layer in area of openings of holes |
| 12/14/2006 | DE102005026339A1 Kupfer(I)perfluorcarboxylat-Komplexe und ihre Verwendung zur Erzeugung von Kupfer Copper (I) perfluorocarboxylate complexes and their use for the production of copper |
| 12/14/2006 | DE102005026127A1 Druckmaschine und ein Verfahren zur Herstellung eines Druckerzeugnisses Printing machine and a method for producing a printed product |
| 12/14/2006 | DE10110203B4 Elektronisches Bauteil mit gestapelten Halbleiterchips und Verfahren zu seiner Herstellung An electronic part having stacked semiconductor chips and process for its preparation |
| 12/13/2006 | EP1732372A1 Wiring-connecting material and wiring-connected board production process using the same |
| 12/13/2006 | EP1732371A2 Method of forming a conductive pattern on a substrate |
| 12/13/2006 | EP1732370A2 Carrier tape for temporarily mounting flexible printed circuits |
| 12/13/2006 | EP1732118A1 Heater, reflow apparatus, and solder bump forming method and apparatus |
| 12/13/2006 | EP1731007A1 Multilayer printed circuit board and method for the production thereof |
| 12/13/2006 | EP1731006A1 Liquid crystalline polymer- and multilayer polymer-based passive signal processing components for rf/wireless multi-band applications |
| 12/13/2006 | EP1730774A2 Integrated circuit stacking system and method |
| 12/13/2006 | EP1730234A1 Resin molded article with reduced dielectric loss tangent and production method therefor |
| 12/13/2006 | EP1642176B1 Ground connection of a printed circuit board placed in a wristwatch type electronic device |
| 12/13/2006 | EP1629704B1 Process for filling micro-blind vias |
| 12/13/2006 | EP1558373B1 Printing method using rubber stamp |
| 12/13/2006 | EP1535499B1 Process for preparing a substantially transparent conductive layer configuration |
| 12/13/2006 | EP1353773A4 Method of laser milling |
| 12/13/2006 | EP1295344B1 Direct printing of thin-film conductors using metal-chelate inks |
| 12/13/2006 | CN2847797Y Welding clamp for circuit board |
| 12/13/2006 | CN2847796Y Coating machine for wet film circuit |
| 12/13/2006 | CN2847795Y Support device |
| 12/13/2006 | CN2847794Y Circuit board with electroplating conductor |
| 12/13/2006 | CN1879459A Multilayer printed wiring board and method for manufacturing same |
| 12/13/2006 | CN1879259A Connector chip and manufacturing method thereof |
| 12/13/2006 | CN1879213A Substrate for mounting semiconductor |
| 12/13/2006 | CN1879060A Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed circuit board |
| 12/13/2006 | CN1878885A Method of preparing a metal-silicone rubber composite |
| 12/13/2006 | CN1878884A Method of metallizing a silicone rubber substrate |
| 12/13/2006 | CN1878670A Hot pressing ceramic distortion control |
| 12/13/2006 | CN1878460A Installation work management method, installation machine and preparation support method, installation assembly line |
| 12/13/2006 | CN1878448A Soldering apparatus for printed circuit board, soldering method for printed circuit board and soldering cream printing unit for soldering printed circuit board |
| 12/13/2006 | CN1878447A Plate fitted resin molded article and method of molding it |
| 12/13/2006 | CN1878445A Multi-layer substrate having conductive pattern and resin film and method for manufacturing the same |
| 12/13/2006 | CN1878435A Laminate fabric heater and method of making |
| 12/13/2006 | CN1877251A Printing solder detecting device |
| 12/13/2006 | CN1876891A Method for direct metallization of non-conducting substrates |
| 12/13/2006 | CN1876371A Half-tone screen printing device |
| 12/13/2006 | CN1876246A Droplet discharge method, electro-optic device, and electronic apparatus |
| 12/13/2006 | CN1876245A Droplet discharge method, electro optical device and electronic apparatus |
| 12/13/2006 | CN1876244A Electronic device for direct slurry atomization and deposition |
| 12/13/2006 | CN1290397C Parts installation device |
| 12/13/2006 | CN1290390C Fabricating method for printed circuit board |
| 12/13/2006 | CN1290389C Circuit-board having internal electronic element and making method thereof |