| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 03/28/2007 | EP1766672A2 Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same |
| 03/28/2007 | EP1766427A1 Substrate with patterned conductive layer |
| 03/28/2007 | EP1704759B1 Nozzle arrangement and method for processing a material for processing with a processing medium |
| 03/28/2007 | EP1647170B1 Method for manufacturing a midplane |
| 03/28/2007 | EP1638781B1 Method for preparing a patterned coating |
| 03/28/2007 | EP1412198B1 Method for placing indicia on substrates |
| 03/28/2007 | EP1206780B1 Method and device for insulating electro-technical components |
| 03/28/2007 | CN2884814Y Bracket for installing printed circuit boards |
| 03/28/2007 | CN2884813Y Braket implement for bearing printed circuit boards |
| 03/28/2007 | CN2884792Y Structure for replacing bad units in printed circuit board |
| 03/28/2007 | CN2884791Y Circuit board preventing electronic assembly from skew |
| 03/28/2007 | CN2882873Y Region adjustable wave welding nozzle structure |
| 03/28/2007 | CN1939104A Rigid-flexible board and manufacturing method thereof |
| 03/28/2007 | CN1939102A Carrier substrate with a thermochromatic coating |
| 03/28/2007 | CN1939101A Circuit board, its manufacturing method, and joint box using circuit board |
| 03/28/2007 | CN1938923A Surface mounting type vibrating motor and portable communication equipment having the same |
| 03/28/2007 | CN1938912A Light beam bonding |
| 03/28/2007 | CN1938879A Method for providing a substrate with a printed pattern which comprises a number of separate pattern elements |
| 03/28/2007 | CN1938878A Method for providing a substrate with a printed pattern |
| 03/28/2007 | CN1938849A Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist |
| 03/28/2007 | CN1938839A Semiconductor device and process for manufacturing the same |
| 03/28/2007 | CN1938838A Heater, reflow apparatus, and solder bump forming method and apparatus |
| 03/28/2007 | CN1938799A Embedded capacitors using conductor filled vias |
| 03/28/2007 | CN1938777A Laminate for hdd suspension and process for producing the same |
| 03/28/2007 | CN1938707A Integrated power supply system ananyzing system, integrated power supply system ananyzing method, and multilayer printed circuit board |
| 03/28/2007 | CN1938456A Copper foil and its manufacturing method |
| 03/28/2007 | CN1938443A Process for producing austenite stainless steel, solder melting vessel and autosoldering apparatus |
| 03/28/2007 | CN1938380A Thermosetting resin composition and multilayered printed wiring board comprising the same |
| 03/28/2007 | CN1938358A Resin composition, metal foil with resin, insulating sheet with base material and multilayer printed wiring board |
| 03/28/2007 | CN1937909A Installation system, installation method, installation programe and recording medium |
| 03/28/2007 | CN1937892A Multi-layered wiring board, fabricating method, electronic device and electronic instrument |
| 03/28/2007 | CN1937891A Circuit board non-porous ring circuit manufacturing method |
| 03/28/2007 | CN1937890A Method for manufacturing soft-hard composite board |
| 03/28/2007 | CN1937889A Method for manufacturing flexible circuit board |
| 03/28/2007 | CN1937888A Method for continuously producing flexible printed circuit board |
| 03/28/2007 | CN1937887A Structure and method for reducing warp of substrate |
| 03/28/2007 | CN1937886A High-layer circuit board and its manufacturing method |
| 03/28/2007 | CN1937885A Radiating type printed circuit board and its manufacturing process |
| 03/28/2007 | CN1935442A Method and device for reinforcing tin weldability |
| 03/28/2007 | CN1307855C Tombstoning structures and methods of manufacture |
| 03/28/2007 | CN1307755C Method for producing electric connector |
| 03/28/2007 | CN1307745C Electric connector for printed circuit board |
| 03/28/2007 | CN1307717C 电子器件 Electronic devices |
| 03/28/2007 | CN1307715C Using the wave soldering process to attach motherboard chipset heat sinks |
| 03/28/2007 | CN1307702C Manufacturing method of electron device |
| 03/28/2007 | CN1307698C Device having resin package and method of producing the same |
| 03/28/2007 | CN1307668C Method for manufacturing ceramic electronic element |
| 03/28/2007 | CN1307665C One-chip ceramic electronic parts and mfg. method thereof |
| 03/28/2007 | CN1307658C Coil electric conductor, laminated coil conductor, production method of the same and electronic component using the same |
| 03/28/2007 | CN1307233C Planarized microelectronic substrates |
| 03/28/2007 | CN1307023C Tin-zinc lead-free solder and solder-joined part |
| 03/28/2007 | CN1307022C Tin-zinc lead-free solder alloy and solder-joined part |
| 03/27/2007 | US7196898 Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor |
| 03/27/2007 | US7196836 Rearview assembly having an integral crush zone |
| 03/27/2007 | US7196698 Display apparatus and assembly of its driving circuit |
| 03/27/2007 | US7196617 Graduated stiffness for electrical connections in tires |
| 03/27/2007 | US7196507 Apparatus for testing substrates |
| 03/27/2007 | US7196459 Light emitting assembly with heat dissipating support |
| 03/27/2007 | US7196426 Multilayered substrate for semiconductor device |
| 03/27/2007 | US7196402 Interconnections |
| 03/27/2007 | US7196275 EMI shield that adheres to and conforms with printed circuit board surfaces |
| 03/27/2007 | US7195953 Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein |
| 03/27/2007 | US7195857 Photosensitive prepolymer having an ethylenically unsaturated terminal group originating in an acrylic monomer, a photopolymerization initiator and a flame-retarding agent |
| 03/27/2007 | US7195714 Method and device for producing a system having a component applied to a predetermined location of a surface of a substrate |
| 03/27/2007 | US7195682 Method and apparatus for determining processing size of bonding material |
| 03/27/2007 | CA2381403C Method for manufacturing aluminum nitride sintered body in which via hole is made |
| 03/22/2007 | WO2007032424A1 Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate |
| 03/22/2007 | WO2007032312A1 Sound transmitting membrane, electronic part with sound transmitting membrane, and process for producing circuit board having the electronic part mounted thereon |
| 03/22/2007 | WO2007032260A1 Molding circuit component and process for producing the same |
| 03/22/2007 | WO2007032222A1 Electroless plating catalyst for printed wiring board having through hole, and printed wiring board having through hole processed by using such catalyst |
| 03/22/2007 | WO2007032167A1 Ceramic multilayer substrate and process for producing the same |
| 03/22/2007 | WO2007032086A1 Apparatus for producing electronic device such as display device, process for producing electronic device such as display device, and electronic device such as display device |
| 03/22/2007 | WO2007031712A2 Method of forming conductive tracks |
| 03/22/2007 | WO2007031711A1 Method of forming conductive tracks for flexible electronic circuits |
| 03/22/2007 | WO2007031241A1 Laminated substrate for mounting electronic parts |
| 03/22/2007 | WO2007031049A1 Device for determining the relative position of two substantially flat elements |
| 03/22/2007 | WO2006125947A3 Improved printed circuit board assembly |
| 03/22/2007 | US20070067064 Surface level control systems and material recycling systems for use with programmable material consolidation apparatus |
| 03/22/2007 | US20070066090 Wiring board, process for producing the same polyimide film for use in the wiring board, and etchant for use in the process |
| 03/22/2007 | US20070066078 Method of producing a substrate having areas of different hydrophilicity and/or oleophilicity on the same surface |
| 03/22/2007 | US20070065647 Hot pressing ceramic distortion control |
| 03/22/2007 | US20070065570 Method of producing a substrate having areas of different hydrophilicity and/or oleophilicity on the same surface |
| 03/22/2007 | US20070064192 Liquid crystal display apparatus |
| 03/22/2007 | US20070063722 Method and apparatus for testing bumped die |
| 03/22/2007 | US20070063623 Multilayer ceramic substrate, method for manufacturing the same, and piezoelectric resonator component |
| 03/22/2007 | US20070063343 Substrate for semiconductor device and semiconductor device |
| 03/22/2007 | US20070062925 Heater and the method for producing the same using pcb |
| 03/22/2007 | US20070062729 Printed wiring board and method for manufacturing the same |
| 03/22/2007 | US20070062728 Printed wiring board and method for manufacturing the same |
| 03/22/2007 | US20070062724 Printed wiring board and method for manufacturing the same |
| 03/22/2007 | US20070062640 Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board using the same copper foil with insulating layer |
| 03/22/2007 | US20070062558 Apparatus and method for surface treatment to substrate |
| 03/22/2007 | US20070062033 Selective consolidation methods for fabricating semiconductor device components and conductive features thereof |
| 03/22/2007 | US20070062032 Led lighting with integrated heat sink and process for manufacturing same |
| 03/22/2007 | US20070062031 Printed circuit board including a fuse |
| 03/22/2007 | DE202007000582U1 Vorrichtung zum Herstellen einer leitenden Antenne An apparatus for manufacturing a conductive antenna |
| 03/22/2007 | DE10311575B4 Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis A method of electrolytic plating of workpieces with holes with a high aspect ratio |
| 03/22/2007 | DE102006016400A1 Base material for making printed circuit boards, produced by pressing layers of glass fabric vacuum-impregnated with solvent-free epoxy resin, has defined properties |
| 03/22/2007 | CA2622359A1 Device for determining the relative position between two essentially flat elements |
| 03/21/2007 | EP1763704A2 Soft lithographic stamp with a chemically patterned surface |